Protection mechanism and method for protecting wafer and pin
This application provides a protection mechanism and a method for protecting a wafer and a pin. The protection mechanism includes: a drive; a linear unit, connected to the drive, so as to cause a pin to eject a wafer under the action of the drive; a torsion meter, configured to measure a torque of the protection mechanism in a process of ejecting the wafer by the pin; and a control module, configured to receive the torque measured by the torsion meter, and compare the torque with a predetermined value. The torsion meter is disposed between the drive and the linear unit. The to protection mechanism can effectively measure, in real time, a torque generated in a process of ejecting the wafer, and can determine, according to the torque, whether an abnormality occurs in the ejection process, so that an accident such as wafer fragmentation or pin fracturing can be effectively prevented.
1. A protection mechanism, comprising:
a drive;
a linear unit connected to the drive, such that the drive is configured to drive the linear unit to cause a pin to eject a wafer;
a torsion meter configured to measure a torque of the protection mechanism in a process of ejecting the wafer by the pin; and
a control module configured to receive the torque measured by the torsion meter and to compare the measured torque with a reference torque, wherein:
the control module is configured, in response to the measured torque exceeding an allowable range of the reference torque, to at least one of send an alarm signal or stop the drive,
the reference torque is pre-measured by the torsion meter when the wafer is normally ejected, and
the reference torque linearly decreases with a distance of the pin away from an original position.
2. The protection mechanism according to claim 1 , wherein the torsion meter is between the drive and the linear unit.
3. The protection mechanism according to claim 2 , further comprising a first connector and a second connector, wherein:
the first connector is between the drive and the torsion meter, and
the second connector is between the torsion meter and the linear unit.
4. The protection mechanism according to claim 1 , wherein the allowable range of the reference torque is between 0.7 to 1.3, inclusive, times the reference torque.
5. The protection mechanism according to claim 1 , further comprising a pin support plate that is configured to push against the pin, wherein the linear unit is connected between the drive and the pin support plate such that the linear unit is configured to push the pin support plate to move the pin upward and eject the wafer.
6. The protection mechanism according to claim 5 , wherein the pin support plate is sleeved on a central shaft of a wafer carrying apparatus, the linear unit being disposed parallel to the central shaft of the wafer carrying apparatus, and separated from the central shaft.
7. The protection mechanism according to claim 1 , wherein the linear unit is connected between the drive and a wafer carrying apparatus such that the wafer carrying apparatus moves downward to cause the pin to eject the wafer.
8. The protection mechanism according to claim 7 , wherein:
the pin is one of a plurality of pins,
the plurality of pins are disposed parallel to each other through the wafer carrying apparatus,
one end of each pin of the plurality of pins is fixed to a bottom of a cavity, and
the other end of each pin of the plurality of pins is configured to protrude from the wafer carrying apparatus.
9. The protection mechanism according to claim 7 , wherein the linear unit is connected to a central shaft of the wafer carrying apparatus.
10. A method for protecting a wafer and a pin, comprising:
driving a linear unit, with a drive, to cause the pin to eject the wafer;
measuring a torque of the linear unit by with a torsion meter;
receiving, at a control module, the torque from the torsion meter; and
comparing, with the control module, the torque with a reference torque, and in response to the comparing of the torque with the reference torque resulting in the torque exceeding an allowable range of the reference torque at least one of:
sending an alarm signal; or
stopping the drive; wherein
the reference torque is pre-measured by the torsion meter when the wafer is normally ejected, and
the reference torque linearly decreases with a distance of the pin away from an original position.
11. The method according to claim 10 , wherein the allowable range is between 0.7 to 1.3 times, inclusive, the reference torque.
12. The method according to claim 10 , wherein driving the linear unit to cause the pin to eject the wafer comprises pushing, with the linear unit, a pin support plate that pushes against the pin, to move the pin upward to eject the wafer.
13. The method according to claim 12 , wherein the pin support plate is sleeved on a central shaft of a wafer carrying apparatus, the linear unit being disposed parallel to the central shaft of the wafer carrying apparatus, and separated from the central shaft.
14. The method according to claim 10 , wherein driving the linear unit to cause the pin to eject the wafer comprises pulling down a wafer carrying apparatus, to move the wafer carrying apparatus downward and cause the pin to eject the wafer.
15. The method according to claim 14 , wherein:
the pin is one of a plurality of pins,
the plurality of pins are disposed parallel to each other through the wafer carrying apparatus,
one end of each pin of the plurality of pins is fixed to a bottom of a cavity, and
the other end of each pin of the plurality of pins is configured to protrude from the wafer carrying apparatus.
16. The method according to claim 14 , wherein the linear unit is connected to a central shaft of the wafer carrying apparatus.