Interconnects for intravascular ultrasound (IVUS) devices
Intravascular ultrasound (IVUS) imaging devices, systems, and methods are provided. Embodiments of the present disclosure provide intravascular ultrasound (IVUS) devices with robust, four-wire electrical interconnects. In some embodiments, an intravascular ultrasound (IVUS) device is provided. The IVUS device comprises: a catheter body; an ultrasound assembly coupled to a distal portion of the catheter body; and four conductors extending along a length of the catheter body, wherein a distal section of each of the four conductors has a flattened profile and wherein the flattened distal section of each of the four conductors is electrically coupled to a respective electrical contact of the ultrasound assembly. The ultrasound assembly can be a phased-array ultrasound assembly or a rotational ultrasound assembly.
1. An intravascular ultrasound (IVUS) device, comprising:
a catheter body comprising a distal portion, an opposite, proximal portion, and a length defined between the distal portion and the proximal portion;
an ultrasound assembly coupled to the distal portion of the catheter body, wherein the ultrasound assembly comprises:
a flexible substrate;
an array of transducer elements; and
a plurality of electrical contacts; and
a plurality of conductors extending along the length of the catheter body,
wherein a distal section of each of the plurality of conductors comprises a flattened profile,
wherein the flattened profile of the plurality of conductors is electrically coupled to the plurality of electrical contacts of the ultrasound assembly at the distal portion of the catheter body that is configured to be positioned inside a blood vessel of a patient.
2. The device of claim 1 , wherein each of the plurality of electrical contacts are coupled to an outer surface of the flexible substrate.
3. The device of claim 1 , wherein each of the plurality of electrical contacts defines an opening sized and shaped to receive the distal section, wherein the distal section of each of the plurality of conductors is positioned within the opening of a respective electrical contact of the plurality of electrical contacts.
4. The device of claim 3 , wherein one or more sides of the opening comprises a conductive material, wherein the plurality of conductors is electrically coupled to the plurality of electrical contacts via the conductive material.
5. The device of claim 1 , wherein the distal section of each of the plurality of conductors is mechanically coupled to the plurality of electrical contacts via a crimping.
6. The device of claim 5 , wherein the flattened profile of the distal section of each of the plurality of conductors is defined by the crimping.
7. The device of claim 1 , wherein the flattened profile of the distal section of each of the plurality of conductors is different than a profile of a proximal section of each of the plurality of conductors.
8. The device of claim 7 , wherein a width of the flattened profile is greater than width of the profile of the proximal section of each of the plurality of conductors.
9. The device of claim 7 , wherein the profile of the proximal section of each of the plurality of conductors is cylindrical.
10. The device of claim 1 , wherein the plurality of conductors comprises four conductors.
11. The device of claim 1 , wherein a site of mechanical coupling between each of the plurality of conductors and a respective electrical contact of the plurality of electrical contacts is coated in a protective layer.
12. The device of claim 1 , wherein the plurality of conductors is bundled in a cable along at least a portion of the length of the catheter body.
13. A system, comprising:
the IVUS device of claim 1 , wherein the IVUS device comprises a proximal connector coupled to the proximal portion of the catheter body, wherein a proximal section of each of the plurality of conductors is coupled to the proximal connector;
an interface module configured to connect with the proximal connector; and
an IVUS processing component in communication with the interface module.