Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R 4 represents a hydrogen atom or an alkyl group.
1. A resin composition comprising:
a polybutadiene compound having an epoxy group in a molecule;
a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule;
a styrene-based block copolymer; and
a curing agent:
(wherein in Formula (1), p represents 0 to 10, Z represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group) group,
(wherein in Formula (2), R 4 represents a hydrogen atom or an alkyl) group.
2. The resin composition according to claim 1 , wherein a content of the polybutadiene compound is 5 to 40 parts by mass with respect to 100 parts by mass of a sum of the polybutadiene compound, the polyphenylene ether compound, and the curing agent.
3. The resin composition according to claim 1 , wherein a content of the polybutadiene compound is 3 to 20 parts by mass with respect to 100 parts by mass of a sum of the polybutadiene compound, the polyphenylene ether compound, the styrene-based block copolymer, and the curing agent.
4. The resin composition according to claim 1 , wherein the curing agent contains an allyl compound.
5. The resin composition according to claim 4 , wherein the allyl compound includes an allyl isocyanurate compound having two or more allyl groups in a molecule.
6. The resin composition according to claim 1 , wherein a concentration of oxirane oxygen in the polybutadiene compound is 1% to 10% by mass.
7. The resin composition according to claim 1 , wherein the styrene-based block copolymer includes at least one selected from the group consisting of a methylstyrene (ethylene/butylene) methylstyrene copolymer, a methylstyrene (ethylene-ethylene/propylene) methylstyrene copolymer, a styrene isoprene copolymer, a styrene isoprene styrene copolymer, a styrene (ethylene/butylene) styrene copolymer, a styrene (ethylene-ethylene/propylene) styrene copolymer, a styrene butadiene styrene copolymer, a styrene (butadiene/butylene) styrene copolymer, a styrene isobutylene styrene copolymer, and any hydrogenated product of these copolymers.
8. The resin composition according to claim 1 , wherein the polyphenylene ether compound includes a polyphenylene ether compound having the group represented by Formula (2) in a molecule.
9. A prepreg comprising:
the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a fibrous base material.
10. A metal-clad laminate comprising:
an insulating layer containing a cured product of the prepreg according to claim 9 ; and
a metal foil.
11. A wiring board comprising:
an insulating layer containing a cured product of the prepreg according to claim 9 ; and
wiring.
12. A film with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a support film.
13. A metal foil with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a metal foil.
14. A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and
a metal foil.
15. A wiring board comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and
wiring.