Electrostatic chuck and processing apparatus
An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, a ceramic porous part, and an elastic body. The base plate supports the ceramic dielectric substrate. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The third hole part is positioned at the bonding part. The counterbore part is located in the first hole part. The ceramic porous part is located in the counterbore part. The elastic body faces an end part of the bonding part at the third hole part side.
1. An electrostatic chuck, comprising:
a ceramic dielectric substrate including
a first major surface on which an object of clamping is placed, and
a second major surface at a side opposite to the first major surface;
a base plate supporting the ceramic dielectric substrate, the base plate including
an upper surface at the ceramic dielectric substrate side, and
a lower surface at a side opposite to the upper surface;
a bonding part located between the ceramic dielectric substrate and the base plate;
a gas inlet path extending through the ceramic dielectric substrate, the base plate, and the bonding part, the gas inlet path including
a first hole part positioned at the ceramic dielectric substrate,
a second hole part positioned at the base plate, and
a third hole part positioned at the bonding part;
a counterbore part located in the first hole part;
a ceramic porous part located in the counterbore part, the ceramic porous part including
a first surface at the third hole part side, and
a second surface at a side opposite to the first surface; and
an elastic body facing an end part of the bonding part at the third hole part side,
the ceramic porous part further including a side surface connecting the first surface and the second surface,
the side surface including
a first side part at the first surface side,
a second side part at the second surface side, and
a third side part between the first side part and the second side part,
a first direction being a direction from the base plate toward the ceramic dielectric substrate,
a second direction being a direction substantially orthogonal to the first direction,
a first sloped part being provided in at least a region of the first side part contacting the first surface,
the first sloped part being sloped with respect to the first direction,
the first surface overlapping the bonding part and the elastic body when viewed along the second direction,
the ceramic porous part being configured to contact the elastic body at the first sloped part.
2. The chuck according to claim 1 , wherein
the ceramic porous part includes:
a porous portion that is gas-permeable; and
a dense portion that is denser than the porous portion,
the dense portion covers an outer circumference of the porous portion, and
the first sloped part is provided in the dense portion.
3. The chuck according to claim 1 , wherein
the first side part is made of the first sloped part.
4. The chuck according to claim 3 , wherein
a second sloped part is provided in at least a part of the third side part and is continuous with the first sloped part, and
a fixing part fixes the ceramic porous part to the counterbore part between the counterbore part and the second sloped part.
5. The chuck according to claim 4 , wherein
a length along the second direction of the second side part is substantially equal to a length along the second direction of the counterbore part.
6. The chuck according to claim 1 , wherein
a length along the first direction of a part of the elastic body contacting the first sloped part is greater than a length along the first direction of the bonding part.
7. The chuck according to claim 1 , wherein
the elastic body is ring-shaped, and
the first surface is surrounded with the elastic body when viewed along the first direction.
8. The chuck according to claim 1 , wherein
the elastic body includes at least one of polytetrafluoroethylene or polyimide.
9. A processing apparatus, comprising:
the chuck according to claim 1 ; and
a supply part configured to supply a gas to the gas inlet path of the chuck.
10. An electrostatic chuck, comprising:
a ceramic dielectric substrate including
a first major surface on which an object of clamping is placed, and
a second major surface at a side opposite to the first major surface;
a base plate supporting the ceramic dielectric substrate, the base plate including
an upper surface at the ceramic dielectric substrate side, and
a lower surface at a side opposite to the upper surface;
a bonding part located between the ceramic dielectric substrate and the base plate;
a gas inlet path extending through the ceramic dielectric substrate, the base plate, and the bonding part, the gas inlet path including
a first hole part positioned at the ceramic dielectric substrate,
a second hole part positioned at the base plate, and
a third hole part positioned at the bonding part;
a counterbore part provided in the first hole part or the second hole part;
a ceramic porous part located in the counterbore part, the ceramic porous part including
a first surface at the third hole part side, and
a second surface at a side opposite to the first surface; and
an elastic body facing an end part of the bonding part at the third hole part side,
a first direction being a direction from the base plate toward the ceramic dielectric substrate,
a second direction being a direction orthogonal to the first direction,
the ceramic porous part including
a first ceramic part including the first surface,
a second ceramic part including the second surface, and
a third ceramic part positioned between the first ceramic part and the second ceramic part in the first direction,
a length along the second direction of the first ceramic part being less than a length along the second direction of the third ceramic part,
the first surface overlapping the bonding part and the elastic body when viewed along the second direction,
at least a part of the elastic body overlapping the third ceramic part in the first direction,
the elastic body contacting at least one of the first ceramic part or the third ceramic part.
11. The chuck according to claim 10 , wherein
the ceramic porous part includes a side surface connecting the first surface and the second surface,
the side surface includes:
a first side part at the first surface side;
a second side part at the second surface side; and
a third side part between the first side part and the second side part,
a first sloped part is provided in at least a region of the first side part contacting the first surface,
the first sloped part is sloped with respect to the first direction, and
the ceramic porous part contacts the elastic body at the first sloped part.
12. The chuck according to claim 10 , wherein
the third ceramic part includes an extension surface extending along the second direction, and
the elastic body contacts the extension surface.
13. The chuck according to claim 10 , wherein
the ceramic porous part includes:
a porous portion that is gas-permeable; and
a dense portion that is denser than the porous portion,
the dense portion covers an outer circumference of the porous portion, and
the elastic body contacts the dense portion.
14. The chuck according to claim 10 , wherein
a length along the second direction of the second ceramic part is substantially equal to a length along the second direction of the counterbore part.
15. The chuck according to claim 10 , wherein
the elastic body has compressive deformation in the first direction.
16. The chuck according to claim 10 , wherein
the elastic body is ring-shaped, and
the first surface is surrounded with the elastic body when viewed along the first direction.
17. The chuck according to claim 10 , wherein
the elastic body includes at least one of polytetrafluoroethylene or polyimide.
18. A processing apparatus, comprising:
the chuck according to claim 10 ; and
a supply part configured to supply a gas to the gas inlet path of the chuck.