IP Library › Granted Patent US 12,100,722
Granted Patent B2
US 12,100,722 · App. 17/250,834 · Granted Sep 24, 2024

Imaging device with improved short-wavelength sensitivity

Inventors: Koji Furumi (Kanagawa, JP); Shuji Manda (Kanagawa, JP); Ryosuke Matsumoto (Kanagawa, JP); Tomoyuki Hirano (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H01L27/14623H01L27/14621H01L27/14627H01L27/1463H01L27/1464H01L27/14645H01L27/14685
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Quick Facts
Patent No.
US 12,100,722
App. No.
17/250,834
Granted
Sep 24, 2024
Kind
B2
Abstract

There is provided an imaging device including a first semiconductor layer formed on a semiconductor substrate, a second semiconductor layer formed on the first semiconductor layer and having an opposite conductivity type to the first semiconductor layer, a pixel separation portion that demarcates a pixel region including the first semiconductor layer and the second semiconductor layer, a first electrode connected to the first semiconductor layer from one surface side of the semiconductor substrate, and a metal layer connected to the second semiconductor layer from a light irradiation surface side which is the other surface of the semiconductor substrate and buried in the pixel separation portion in at least a part of the semiconductor substrate in a thickness direction.

Claims (29)

1. An imaging device, comprising:

a first semiconductor layer on a semiconductor substrate;

a second semiconductor layer on the first semiconductor layer, wherein the second semiconductor layer has an opposite conductivity type to the first semiconductor layer;

a pixel separation portion configured to demarcate a pixel region including the first semiconductor layer and the second semiconductor layer;

a first electrode connected to the first semiconductor layer from a first surface side of the semiconductor substrate;

a metal layer connected to the second semiconductor layer from a light irradiation surface side which is a second surface side of the semiconductor substrate, wherein the metal layer is buried in the pixel separation portion in at least a part of the semiconductor substrate; and

a second electrode connected to the second semiconductor layer from the light irradiation surface side, wherein

the second electrode corresponds to a position of the pixel separation portion, and

the metal layer is electrically connected to the second semiconductor layer via the second electrode.

2. The imaging device according to claim 1 , wherein the second electrode is along a periphery of the pixel region.

3. The imaging device according to claim 1 , wherein the second electrode is in a region of a part of a periphery of the pixel region.

4. The imaging device according to claim 3 , wherein

the pixel region is a rectangular pixel region; and

the second electrode is in at least one of four corners of the rectangular pixel region.

5. The imaging device according to claim 3 , wherein the second electrode is buried in a hole in the second semiconductor layer.

6. The imaging device according to claim 3 , wherein the second electrode and the metal layer are formed of the same material.

7. The imaging device according to claim 1 , further comprising:

an insulation film along the pixel separation portion and the light irradiation surface side, wherein

the second electrode is buried in an opening in the second semiconductor layer; and

a specific region in which an end of the insulation film retreats more than a wall surface of the opening, wherein the specific region is filled with the second electrode.

8. The imaging device according to claim 1 , further comprising:

an insulation film along the pixel separation portion; and

a specific region in which an end of the insulation film retreats in a thickness direction of the pixel separation portion, wherein the specific region is filled with the second electrode.

9. The imaging device according to claim 1 , wherein a voltage for multiplying electrons is applied between the first electrode and the metal layer.

10. The imaging device according to claim 1 , further comprising a third semiconductor layer on the second semiconductor layer, wherein the third semiconductor layer and the second semiconductor layer have the same conductivity type.

11. The imaging device according to claim 1 , wherein the second electrode is on an upper surface of the pixel separation portion.

12. The imaging device according to claim 1 , wherein

the pixel separation portion and the second electrode have a planar shape of a grid shape surrounding a plurality of pixel regions, and

the plurality of pixel regions comprises the pixel region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2021
From: FURUMI, KOJI; MANDA, SHUJI; MATSUMOTO, RYOSUKE; HIRANO, TOMOYUKI
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 055552/0332 →
Priority Claims (1)
JP 2018-177893 · Sep 21, 2018 · national
Continuity (1)
Related Publication 20220052092A1 · Feb 17, 2022