IP Library Granted Patent US 12,101,593
Granted Patent B2
US 12,101,593 · App. 18/357,087 · Granted Sep 24, 2024

Bone conduction earphones

Inventors: Zhen Wang (Shenzhen, CN); Zhiqing Liu (Shenzhen, CN); Yonggen Wang (Shenzhen, CN); Xinnan Mao (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R1/105H04R2460/13
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Quick Facts
Patent No.
US 12,101,593
App. No.
18/357,087
Granted
Sep 24, 2024
Kind
B2
Abstract

The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.

Claims (27)

1. An earphone, comprising:

an ear hook assembly including an ear hook housing, wherein the ear hook housing includes an earphone fixing portion, and the earphone fixing portion includes a fixing body and an annular flange; and

a core module disposed on one end of the ear hook assembly, the core module including a core housing and a core, and an opening being disposed on one end of the core housing to form a chamber structure for accommodating the core; wherein

the core housing includes a bottom wall and an annular peripheral wall,

the earphone fixing portion is disposed on an opening end of the core housing,

the annular flange is connected with the fixing body and extends toward the core housing, and

the annular flange is abutted with an end of the annular peripheral wall away from the bottom wall.

2. The earphone of claim 1 , wherein the ear hook housing further includes a bending transition portion disposed in a bent shape to be hung on outside of a human ear, and the fixing body is connected with the bending transition portion.

3. The earphone of claim 1 , wherein the bottom wall including a skin contact region of the core housing, and another end of the annular peripheral wall being integrally connected with the bottom wall.

4. The earphone of claim 3 , wherein the core module further includes a cover plate, the cover plate being covered on the opening of the core housing, and the ear hook housing being connected with the cover plate.

5. The earphone of claim 4 , wherein the cover plate disposed at the other end of the annular peripheral wall and disposed opposite to the bottom wall.

6. The earphone of claim 4 , wherein the earphone fixing portion is covered at a side of the cover plate facing away from the core housing.

7. The earphone of claim 4 , wherein an elastic modulus of the cover plate is greater than the elastic modulus of the ear hook housing.

8. The earphone of claim 4 , wherein the elastic modulus of the cover plate is less than or equal to the elastic modulus of the core housing.

9. The earphone of claim 4 , wherein the earphone fixing portion and the cover plate are connected by a glue connection or a combination of a clamping connection and the glue connection.

10. The earphone of claim 4 , wherein a side of the cover plate facing away from the core housing is disposed with a microphone accommodation groove.

11. The earphone of claim 10 , wherein the core module further includes a first microphone and a second microphone, wherein

the first microphone is accommodated in the core housing, and

the second microphone is disposed in the microphone accommodation groove and covered by the earphone fixing portion.

12. The earphone of claim 1 , wherein the ear hook housing further includes an accommodation bin configured to accommodate a battery or a main control circuit board.

13. The earphone of claim 1 , wherein a reinforcing structure is disposed on the earphone fixing portion.

14. The earphone of claim 13 , wherein the reinforcing structure includes an arcuate structure disposed between the fixing body and the annular flange.

15. The earphone of claim 13 , wherein the reinforcing structure includes a thickened layer integrally disposed with the fixing body.

16. The earphone of claim 13 , wherein the reinforcing structure includes at least one reinforcing rib disposed on the earphone fixing portion.

17. The earphone of claim 16 , wherein the reinforcing structure includes at least two reinforcing ribs, and the at least two reinforcing ribs are disposed in parallel or the at least two reinforcing ribs forms a grid pattern.

18. The earphone of claim 16 , wherein the reinforcing structure includes at least two reinforcing ribs, the at least two reinforcing ribs are radially disposed centered at a preset reference point on the earphone fixing portion.

19. The earphone of claim 1 , wherein an elastic modulus of the core housing is greater than an elastic modulus of the ear hook housing.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2023
From: WANG, ZHEN; LIU, ZHIQING; WANG, YONGGEN; MAO, XINNAN
To: SHENZHEN VOXTECH CO., LTD.
Reel/Frame 065718/0275 →
CHANGE OF NAME Recorded Nov 30, 2023
From: SHENZHEN VOXTECH CO., LTD.
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 065718/0282 →
Priority Claims (3)
CN 202010367107.5 · Apr 30, 2020 · national
CN 202020720127.1 · Apr 30, 2020 · national
CN 202020720129.0 · Apr 30, 2020 · national
Continuity (4)
Continuation 17810617 · Jul 4, 2022
Continuation 17453648 · Nov 4, 2021
Continuation PCTCN2021090958 · Apr 29, 2021
Related Publication 20230370764A1 · Nov 16, 2023
Cited By (3)
US 1,076,873 US 1,117,140 US 12,604,134