Coil module, actuator provided with coil module, and method for manufacturing coil module

1. A coil module comprising:

a conductor layer formed along a predetermined plane and including a wiring portion and a coil portion;

at least one element mounted on the wiring portion;

a first sealing resin;

a second sealing resin disposed on the first sealing resin in a first direction perpendicular to the plane; and

a plurality of terminal portions,

wherein the conductor layer is disposed on a surface of the first sealing resin that faces the second sealing resin,

the second sealing resin covers the conductor layer and the at least one element, the second sealing resin being integrally formed of a single type of resin material and having a predetermined thickness in the first direction,

each one of the terminal portions is electrically connected to the wiring portion or the coil portion and extends through the first sealing resin in the first direction to be exposed from a side of the first sealing resin that is opposite from the second sealing resin, and

the wiring portion and the coil portion are disposed at a same position in the first direction.

2. The coil module according to claim 1 , wherein the at least one element includes a magnetic detection element.

3. The coil module according to claim 2 , wherein the at least one element includes a driver IC, and the magnetic detection element is built in the driver IC.

4. The coil module according to claim 3 , wherein the driver IC and the coil portion are electrically connectable via the wiring portion.

5. The coil module according to claim 2 , wherein the at least one element includes a chip capacitor.

6. The coil module according to claim 2 , wherein the at least one element is disposed inside of the coil portion as viewed in the first direction.

7. The coil module according to claim 2 , wherein the at least one element is disposed outside of the coil portion as viewed in the first direction.

8. The coil module according to claim 2 , wherein the coil portion includes an outer coil and an inner coil located inside of the outer coil as viewed in the first direction, and

the at least one element is disposed inside of the outer coil and outward from the inner coil as viewed in the first direction.

9. The coil module according to claim 2 , wherein the coil portion includes a first coil and a second coil connected in series and located adjacent to one another as viewed in the first direction, and

the at least one element is disposed between the first coil and the second coil as viewed in the first direction.

10. The coil module according to claim 1 , wherein the coil portion has a multilayer configuration including a plurality of layers separated by an interval in the first direction.

11. The coil module according to claim 1 , further comprising an additional coil connected to the coil portion, the additional coil extending in the first direction and overlapping with the coil portion as viewed in the first direction.

12. The coil module according to claim 11 , wherein the additional coil overlaps with at least a portion of the at least one element as viewed along a direction parallel with the plane.

13. An actuator, comprising:

a coil module according to claim 1 ; and

a magnetic field generator disposed opposing the coil module,

wherein the coil module and the magnetic field generator are movable relative to one another.

14. A method of manufacturing the coil module of claim 1 , the method comprising:

forming the first sealing resin on a surface of a substrate material;

forming the conductor layer including the wiring portion and the coil portion on the surface of the first sealing resin in a manner such that the wiring portion and the coil portion are disposed at a same position in a first direction perpendicular to the surface of the first sealing resin;

mounting the at least one element on the wiring portion;

forming the second sealing resin including a resin material of a similar type to that of the first sealing resin on the surface of the first sealing resin, covering the conductor layer and the at least one element; and

removing the substrate material.

15. The method according to claim 14 , further comprising forming the plurality of terminal portions on the substrate material before forming the first sealing resin.