Power electronics assemblies having embedded power electronics devices
Power electronics assemblies having embedded power electronics devices are disclosed. In one embodiment, a power electronics assembly includes a circuit board assembly that includes a substrate that is electrically insulating and a power electronics device assembly embedded in the substrate. The power electronics device assembly includes an S-cell that includes an inner graphite layer, a metal layer encasing the inner graphite layer, and a first surface of the metal layer comprising a recess provided within the first surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the first surface.
1. A power electronics assembly comprising:
a circuit board assembly comprising:
a substrate that is electrically insulating;
a power electronics device assembly embedded in the substrate, the power electronics device assembly comprising:
an S-cell comprising:
an inner graphite layer;
a metal layer encasing the inner graphite layer; and
a first surface of the metal layer comprising a recess provided within the first surface; and
a power electronics device disposed within the recess of the first surface.
2. The power electronics assembly of claim 1 , wherein the circuit board assembly further comprises a plurality of thermal vias embedded in the substrate and thermally coupled to the power electronics device.
3. The power electronics assembly of claim 1 , wherein the S-cell has a length that is greater than a width.
4. The power electronics assembly of claim 1 , further comprising a cold plate, wherein the circuit board assembly is bonded to a surface of the cold plate by a bond layer.
5. The power electronics assembly of claim 4 , wherein the bond layer is electrically insulating.
6. The power electronics assembly of claim 4 , wherein the bond layer is a RMS bond layer.
7. The power electronics assembly of claim 1 , wherein the S-cell further comprises a metalized insulation layer bonded to a second surface of the metal layer.
8. The power electronics assembly of claim 7 , further comprising a cold plate, wherein:
the metalized insulation layer of the S-cell is exposed at a surface of the circuit board assembly;
the circuit board assembly is bonded to a surface of the cold plate at the metalized insulation layer of the S-cell.
9. The power electronics assembly of claim 8 , wherein the circuit board assembly is bonded to a surface of the cold plate at the metalized insulation layer of the S-cell by RMS bonding.
10. The power electronics assembly of claim 7 , wherein the S-cell further comprises a second metal layer bonded to the metalized insulation layer.
11. The power electronics assembly of claim 10 , wherein the circuit board assembly further comprises a plurality of thermal vias thermally coupled to the second metal layer.
12. The power electronics assembly of claim 1 , wherein:
the S-cell further comprises a direct-bonded-metal substrate comprising:
a first DBM metal layer;
a ceramic layer bonded to the first DBM metal layer; and
a second DBM metal layer bonded to the ceramic layer.
13. The power electronics assembly of claim 12 , further comprising a cold plate, wherein:
the second DBM metal layer is exposed at a surface of the circuit board assembly; and
the circuit board assembly is bonded to the first surface of the cold plate at the second DBM metal layer of the S-cell.
14. A power electronics assembly comprising:
a circuit board assembly comprising:
a substrate that is electrically insulating;
a plurality of power electronics device assemblies embedded in the substrate, each power electronics device assembly comprising:
an S-cell comprising:
an inner graphite layer;
a metal layer encasing the inner graphite layer;
an insulation layer bonded to a second surface of the metal layer; and
a first surface of the metal layer comprising a recess provided within the first surface; and
a power electronics device disposed within the recess of the first surface;
a surface metal layer on a surface of the substrate; and
a plurality of thermal vias thermally coupling the S-cell to the surface metal layer; and
a cold plate, wherein the surface metal layer of the circuit board assembly is bonded to a first surface of the cold plate.
15. The power electronics assembly of claim 14 , wherein the S-cell has a length that is greater than a width.
16. The power electronics assembly of claim 14 , wherein the insulation layer comprises a metalized insulation layer.
17. The power electronics assembly of claim 14 , wherein the insulation layer comprises a direct-bonded-metal substrate comprising:
a first DBM metal layer;
a ceramic layer bonded to the first DBM metal layer; and
a second DBM metal layer bonded to the ceramic layer.
18. The power electronics assembly of claim 14 , further comprising further a capacitor affixed to a second surface of the cold plate that is opposite from the first surface.
19. The power electronics assembly of claim 14 , wherein;
the cold plate comprises a fluid chamber, a fluid inlet, and a fluid outlet; and
the fluid inlet and the fluid outlet are thermally coupled to the fluid chamber.
20. The power electronics assembly of claim 14 , wherein the circuit board assembly is affixed to the first surface of the cold plate by fasteners and a thermal grease layer.