Articles and structures with high heat and reflectance and laser direct structuring function

1. A thermoplastic composition comprising:

(a) from about 34.3 wt % to about 54.3 wt % poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof;

(b) at least 10 wt % of a reinforcing filler comprising glass fiber;

(c) from about 2 wt % to about 20 wt % of a laser direct structuring (LDS) additive comprising a tin oxide and an antimony oxide; and

(d) from about 5 wt % to about 50 wt % of a reflection additive comprising a titanium compound,

wherein the composition has a dissipation factor (Df) less than 0.01 as determined using an Agilent Split Post Dielectric Resonator at 1.1 gigahertz (GHz), and

wherein the combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition.

2. The thermoplastic composition according to claim 1 , wherein the tin oxide or the antimony oxide is in a form of a coating on an additional LDS additive.

3. The thermoplastic composition according to claim 2 , wherein the additional LDS additive comprises a titanium oxide.

4. The thermoplastic composition according to claim 1 , wherein the composition further comprises a thermally conductive filler different than the reinforcing filler in element (b).

5. The thermoplastic composition according to claim 4 , wherein the thermally conductive filler comprises boron nitride.

6. The thermoplastic composition according to claim 1 , wherein the composition comprises from about 5 wt % to about 20 wt % of the LDS additive.

7. The thermoplastic composition according to claim 6 , wherein the composition comprises from about 10 wt % to about 20 wt % of the reflection additive comprising the titanium compound.

8. The thermoplastic composition according to claim 1 , wherein the reinforcing filler further comprises ceramic fiber, carbon fiber, a mineral filler, or a combination thereof.

9. The thermoplastic composition according to claim 1 , wherein the composition has a heat distortion temperature (HDT) at 1.82 megapascals (MPa) and a sample thickness of 3.2 millimeters (mm) of at least 220° ° C., or a HDT at 0.45 MPa and a sample thickness of 3.2 mm of at least 200° C.

10. The thermoplastic composition according to claim 1 , wherein the composition has an L* of at least 70 as determined in accordance with the CIE L*a*b* color space standard.

11. The thermoplastic composition according to claim 1 , wherein the composition has a reflectance of from about 50% to about 95% at a wavelength of from 400 nanometers (nm) to 750 nm.

12. The thermoplastic composition according to claim 1 , wherein the composition has an in-plane thermal conductivity of at least 0.5 watts per meter Kelvin (W/(m·K)), or a through-plane thermal conductivity of at least 0.5 W/(m·K).

13. The thermoplastic composition according to claim 1 , wherein the composition further comprises one or more additional additives.

14. The thermoplastic composition according to claim 13 , wherein the one or more additional additives comprises an impact modifier, acid scavenger, anti-drip agent, antioxidant, antistatic agent, chain extender, colorant, de-molding agent, flow promoter, lubricant, mold release agent, plasticizer, quenching agent, flame retardant, UV reflecting additive, or a combination thereof.

15. An article comprising the thermoplastic composition according to claim 1 , wherein the article is a component of a light emitting diode (LED) or a component of a 5G network telecommunications device.

16. The thermoplastic composition according to claim 1 , wherein the composition comprises at least about 20 wt % of the reinforcing filler comprising glass fiber.