Angle sensor

1. A method, comprising:

employing in a sensor IC package a first set of magnetic field sensing elements located at a first position and, a second set of magnetic field sensing elements located at a second position, and a third set of magnetic field sensing elements located at a third position, wherein the first, second, and third sets of magnetic field sensing elements each have a first magnetic field sensing element, not shared with any other of the first, second or third sets, with a first axis of sensitivity and a second magnetic field sensing element, not shared with any other of the first, second or third sets, with a second axis of sensitivity, wherein the first and second axes of sensitivity are orthogonal, and wherein the first, second, and third sets of magnetic field sensing elements are aligned and spaced apart from each other on a common line, wherein the sensor IC package is positioned in relation to a target comprising a two-pole magnet, and wherein the first and second axes of sensitivity and the common line are perpendicular to an axis about which the target rotates;

processing a first differential signal comprising signals for the first axis of sensitivity from the first and second sets of magnetic field sensing elements and a second differential signal comprising signals for the second axis of sensitivity from the first and second sets of magnetic field sensing elements to determine an absolute position of the target, said processing including performing offset and gain correction on the first and second differential signals;

generating a first secondary angle position from the first and third sets of magnetic field sensing elements;

comparing a difference between the absolute position of the target and the first secondary angle position to a first threshold; and

identifying a fault in the sensor IC package based on said comparison.

2. The method according to claim 1 , wherein the target comprises a shaft.

3. The method according to claim 1 , further including determining the absolute position of the target within a quadrant from positive or negative signs of the first and second differential signals.

4. The method according to claim 3 , wherein the quadrant of the target is determined without arctangent processing of the first and second differential signals for low power operation.

5. The method according to claim 1 , wherein the third set of magnetic field sensing elements is located halfway between the first and second sets of magnetic field sensing elements.

6. The method according to claim 1 , wherein the processing of the first and second differential signals includes arctangent processing.

7. The method according to claim 1 , wherein the target comprises a ring magnet.

8. The method according to claim 1 , wherein the target comprises a cylindrical magnet.

9. The method according to claim 1 , wherein the first set of magnetic field sensing elements comprises a left side set of magnetic field sensing elements, the second set of magnetic field sensing elements comprises a right side set magnetic field sensing elements, and the third set of magnetic field sensing elements comprises an in between set of magnetic field sensing elements.

10. The method according to claim 1 , further comprising generating a second secondary angle position from the second and third sets of magnetic field sensing elements.

11. A sensor, comprising:

a sensor IC package having a first set of magnetic field sensing elements located at a first position and a second set of magnetic field sensing elements located at a second position, and a third set of magnetic field sensing elements located at a third position between the first and second positions, wherein the first, second, and third sets of magnetic field sensing elements each have a first magnetic field sensing element, not shared with any other of the first, second or third sets, with a first axis of sensitivity and a second magnetic field sensing element, not shared with any other of the first, second or third sets, with a second axis of sensitivity, wherein the first and second axes of sensitivity are orthogonal, and wherein the first, second, and third sets of magnetic field sensing elements are aligned and spaced apart from each other on a common line,

wherein the sensor IC package is configured to:

process a first differential signal comprising signals for the first axis of sensitivity from the first and second sets of magnetic field sensing elements and a second differential signal comprising signals for the second axis of sensitivity from the first and second sets of magnetic field sensing elements to determine an absolute position of a target comprising a two-pole magnet, wherein the first and second axes of sensitivity and the common line are perpendicular to an axis about which the target rotates, said processing including performing offset and gain correction on the first and second differential signals;

generate a first secondary angle position from the first and third sets of magnetic field sensing elements;

compare a difference between the absolute position of the target and the first secondary angle position to a first threshold; and

identify a fault in the sensor IC package based on said comparison.

12. The sensor according to claim 11 , wherein the absolute position of the target is determined within a quadrant from positive or negative signs of the first and second differential signals.

13. The sensor according to claim 12 , wherein the quadrant of the target is determined without arctangent processing of the first and second differential signals for low power operation.

14. The sensor according to claim 11 , wherein the third set of magnetic field sensing elements is located halfway between the first and second sets of magnetic field sensing elements.

15. The sensor according to claim 11 , wherein the processing of the first and second differential signals includes arctangent processing.

16. The sensor of claim 11 , wherein the sensor IC package is further configured to generate a second secondary angle position from the second and third sets of magnetic field sensing elements.

17. A sensor, comprising:

a sensor IC package having a first magnetic field sensing means located at a first position and a second magnetic field sensing means located at a second position, and a third magnetic field sensing means located at a third position between the first and second positions, wherein the first, second, and third magnetic field sensing means each have a first magnetic field sensing element, not shared with any other of the first, second or third sets, with a first axis of sensitivity and a second magnetic field sensing element, not shared with any other of the first, second or third sets, with a second axis of sensitivity, wherein the first and second axes of sensitivity are orthogonal, and

wherein the first, second, and third magnetic field sensing means are aligned on a common line,

wherein the sensor IC package is configured to:

process a first differential signal comprising signals for the first axis of sensitivity from the first and second magnetic field sensing means and a second differential signal comprising signals for the second axis of sensitivity from the first and second magnetic field sensing means to determine an absolute position of the target comprising a two-pole magnet, wherein the first and second axes of sensitivity and the common line are perpendicular to an axis about which the target rotates, said processing including performing offset and gain correction on the first and second differential signals;

generate a first secondary angle position from the first and third magnetic field sensing means;

compare a difference between the absolute position of the target and the first secondary angle position to a first threshold; and

identify a fault in the sensor IC package based on said comparison.

18. The sensor according to claim 17 , wherein the absolute position of the target is determined within a quadrant from positive or negative signs of the first and second differential signals.

19. The sensor according to claim 18 , wherein the quadrant of the target is determined without arctangent processing of the first and second differential signals for low power operation.

20. The sensor of claim 17 , wherein the sensor IC package is further configured to generate a second secondary angle position from the second and third sets of magnetic field sensing elements.