Method for manufacturing a passive electronic component

1. A method for manufacturing a passive electronic component, the passive electronic component including an insulator portion, a conductor portion provided in the insulator portion, a terminal electrode electrically connected to the conductor portion and disposed on at least one of surfaces of the insulator portion, and at least one marker portion provided in at least one recessed portion of at least one of the surfaces of the insulator portion, the method comprising the steps of:

stacking together a plurality of lamination sheets each containing a resin;

disposing at least one marker portion on an uppermost lamination sheet and among the plurality of lamination sheets;

press-bonding the plurality of lamination sheets stacked together, to obtain a laminate; and

dicing the laminate into parts of a desired size and heating the parts,

wherein the step to obtain the laminate includes pressing in the at least one marker portion disposed on the lamination sheets in a lamination direction of the plurality of lamination sheets, such that an upper surface of the at least one marker portion becomes concave from an upper surface of the uppermost lamination sheet.

2. The method for manufacturing a passive electronic component according to claim 1 ,

wherein a material of a marker in the at least one marker portion is glass or an organic resin, and

wherein the step of heating includes allowing thermal contraction of the marker.

3. The method for manufacturing a passive electronic component according to claim 2 ,

wherein the material of the marker in the at least one marker portion is an organic resin, and

wherein the organic resin has a larger coefficient of thermal contraction than the resin.

4. The method for manufacturing a passive electronic component according to claim 2 , wherein the material of the marker in the at least one marker portion is glass.

5. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion provided in the at least one recessed portion has such a depth as not to affect electrical characteristics of the conductor portion.

6. The method for manufacturing a passive electronic component according to claim 5 , wherein the depth is smaller than 50% of a distance between the associated surface of the insulator portion and a portion of the conductor portion closest to the associated surface of the insulator portion.

7. The method for manufacturing a passive electronic component according to claim 1 , wherein an area of the at least one marker portion provided in the at least one recessed portion is equal to or smaller than 40% of a surface area of one of the surfaces of the insulator portion having the at least one marker portion provided in the at least one recessed portion.

8. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion provided in the at least one recessed portion is positioned so as not to contact with the terminal electrode.

9. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion provided in the at least one recessed portion is outside a quadrangle formed by connecting midpoints of sides of the insulator portion.

10. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion provided in the at least one recessed portion is elongated in a longitudinal direction of the insulator portion.

11. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion provided in the at least one recessed portion has an asymmetrical shape.

12. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the at least one marker portion comprises a plurality of marker portions positioned in a plurality of recessed portions, and

wherein a shape defined by arrangement of the plurality of marker portions is asymmetrical.

13. The method for manufacturing a passive electronic component according to claim 1 , wherein the at least one marker portion represents at least one selected from the group consisting of a character and a reading code.

14. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the at least one marker portion comprises at least two marker portions positioned in at least two recessed portions, and

wherein the at least two marker portions are provided on two opposed surfaces of the insulator portion, respectively.

15. The method for manufacturing a passive electronic component according to claim 14 , wherein positions of the at least two marker portions positioned in the at least two recessed portions are asymmetrical to each other.

16. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the passive electronic component is a coil component, and

wherein in a projective view from the surface having the at least one marker portion provided in the at least one recessed portion, the at least one marker portion is positioned so as not to overlap the conductor portion.

17. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the passive electronic component is a coil component, and

wherein the conductor portion includes a via portion connecting between layers of a conductor in the conductor portion, and in a projective view from the surface having the at least one marker portion provided in the at least one recessed portion, the at least one marker portion is positioned so as not to overlap the via portion.

18. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the passive electronic component is a coil component, and

wherein a position of the at least one marker portion provided in the at least one recessed portion, which position is within the associated surface of the insulator portion, indicates a winding start position and a winding direction of a conductor of the coil component.

19. The method for manufacturing a passive electronic component according to claim 1 ,

wherein the passive electronic component is a coil component, and

wherein a shape of the at least one marker portion provided in the at least one recessed portion indicates a winding start position and a winding direction of a conductor of the coil component.

20. A method for manufacturing a passive electronic component, the passive electronic component including an insulator portion, a conductor portion provided in the insulator portion, a terminal electrode electrically connected to the conductor portion and disposed on at least one of surfaces of the insulator portion, and at least one marker portion provided in at least one recessed portion of at least one of the surfaces of the insulator portion, the method comprising the steps of:

stacking together a plurality of lamination sheets each containing a resin;

disposing at least one marker portion on a lowermost lamination sheet among the plurality of lamination sheets;

press-bonding the plurality of lamination sheets stacked together, to obtain a laminate; and

dicing the laminate into parts of a desired size and heating the parts,

wherein the step to obtain the laminate includes pressing in the at least one marker portion disposed on the lamination sheets in a lamination direction of the plurality of lamination sheets, such that a lower surface of the at least one marker portion becomes concave from a lower surface of the lowermost lamination sheet.