Semiconductor package

1. A semiconductor package, comprising:

an interposer substrate having a first surface and a second surface that are opposite to each other, the interposer substrate including a wiring layer adjacent to the first surface and a plurality of through electrodes that penetrate the interposer substrate and connect to the wiring layer, each of the plurality of through electrodes extending from the wiring layer toward the second surface;

a semiconductor chip on the first surface of the interposer substrate;

a passivation layer on the first surface of the interposer substrate, the passivation layer covering the semiconductor chip; and

a plurality of redistribution patterns in the passivation layer and connected to the semiconductor chip,

wherein the semiconductor chip has a third surface and a fourth surface that are opposite to each other, the third surface of the semiconductor chip faces the first surface of the interposer substrate, and the plurality of redistribution patterns are connected to the fourth surface of the semiconductor chip,

wherein the semiconductor chip includes:

a plurality of chip pads adjacent to the third surface;

a semiconductor substrate on the plurality of chip pads;

a plurality of chip through electrodes penetrating the semiconductor substrate and spaced apart from each other in the semiconductor substrate;

a circuit layer on the semiconductor substrate; and

a chip wiring layer on the circuit layer and adjacent to the fourth surface,

wherein the plurality of chip through electrodes are connected to the plurality of chip pads,

wherein each of the plurality of chip pads is directly connected to a corresponding one of a plurality of wiring patterns in the wiring layer of the interposer substrate, and

wherein the plurality of redistribution patterns are connected to a plurality of chip wiring patterns in the chip wiring layer.

2. The semiconductor package of claim 1 , wherein

the circuit layer is between the chip wiring layer and the plurality of chip through electrodes, and

wherein the plurality of chip through electrodes and the plurality of chip wiring patterns in the chip wiring layer are connected to the circuit layer.

3. The semiconductor package of claim 2 , wherein the plurality of chip through electrodes are between the circuit layer and the plurality of chip pads.

4. The semiconductor package of claim 1 , wherein

each of the plurality of redistribution patterns and the plurality of chip wiring patterns in the chip wiring layer has a thickness in a direction perpendicular to the first surface of the interposer substrate, and

wherein the thickness of each of the plurality of redistribution patterns is greater than the thickness of each of the plurality of chip wiring patterns.

5. The semiconductor package of claim 1 , wherein

each of the plurality of redistribution patterns and the plurality of wiring patterns in the wiring layer of the interposer substrate has a thickness in a direction perpendicular to the first surface of the interposer substrate, and

wherein the thickness of each of the plurality of redistribution patterns is greater than the thickness of each of the plurality of wiring patterns.

6. The semiconductor package of claim 1 , wherein a size of each of the plurality of through electrodes included in the interposer substrate is greater than a size of each of the plurality of chip through electrodes included in the semiconductor chip.

7. The semiconductor package of claim 1 , wherein

the wiring layer of the interposer substrate includes a wiring dielectric layer that covers the plurality of wiring patterns, and

the semiconductor chip further includes a pad dielectric layer that covers the plurality of chip pads, and

wherein the pad dielectric layer is in direct contact with wiring dielectric layer in the wiring layer.

8. A semiconductor package, comprising:

an interposer substrate having a first surface and a second surface that are opposite to each other, the interposer substrate including a wiring layer adjacent to the first surface;

a first semiconductor chip and a second semiconductor chip that are horizontally spaced apart from each other on the first surface of the interposer substrate;

a passivation layer on the first surface of the interposer substrate, the passivation layer covering the first semiconductor chip and the second semiconductor chip; and

a plurality of redistribution patterns in the passivation layer, the plurality of redistribution patterns connecting the first semiconductor chip to the second semiconductor chip,

wherein the first semiconductor chip has a third surface and a fourth surface that are opposite to each other, the first semiconductor chip including:

a plurality of first chip pads adjacent to the third surface;

a first semiconductor substrate on the plurality of first chip pads;

a plurality of first chip through electrodes penetrating the first semiconductor substrate and spaced apart from each other in the first semiconductor substrate; and

a first circuit layer on the first semiconductor substrate,

wherein the second semiconductor chip has a fifth surface and a sixth surface that are opposite to each other, the second semiconductor chip including:

a plurality of second chip pads adjacent to the fifth surfaces;

a second semiconductor substrate on the plurality of second chip pads;

a plurality of second chip through electrodes penetrating the second semiconductor substrate and spaced apart from each other in the second semiconductor substrate; and

a second circuit layer on the second semiconductor substrate,

wherein each of the plurality of first chip pads and the plurality of second chip pads are directly connected to a corresponding one of a plurality of wiring patterns in the wiring layer of the interposer substrate, and

wherein the plurality of redistribution patterns are connected to the fourth surface of the first semiconductor chip and to the sixth surface of the second semiconductor chip.

9. The semiconductor package of claim 8 , wherein the interposer substrate further includes a plurality of through electrodes that penetrate the interposer substrate, and

wherein each of the plurality of through electrodes connects to the wiring layer and extends from the wiring layer toward the second surface.

10. The semiconductor package of claim 9 , wherein

the first semiconductor chip further includes a first chip wiring layer adjacent to the fourth surface, the first circuit layer between the first chip wiring layer and the first semiconductor substrate, and

the second semiconductor chip further includes a second chip wiring layer adjacent to the sixth surface, the second circuit layer between the second chip wiring layer and the second semiconductor substrate.

11. The semiconductor package of claim 10 , wherein the plurality of redistribution patterns are connected to a plurality of first chip wiring patterns in the first chip wiring layer of the first semiconductor chip and to a plurality of second chip wiring patterns in the second chip wiring layer of the second semiconductor chip.

12. The semiconductor package of claim 8 , wherein

the plurality of first chip through electrodes are connected to the first circuit layer and the plurality of first chip pads, and

the plurality of second chip through electrodes are connected to the second circuit layer and the plurality of second chip pads.

13. The semiconductor package of claim 9 , wherein a size of each of the plurality of through electrodes included in the interposer substrate is greater than a size of each of the plurality of first and the plurality of second chip through electrodes.

14. The semiconductor package of claim 8 , wherein

each of the plurality of redistribution patterns and the plurality of wiring patterns in the wiring layer of the interposer substrate has a thickness in a direction perpendicular to the first surface of the interposer substrate, and

wherein the thickness of each of the plurality of redistribution patterns is greater than the thickness of each of the plurality of wiring patterns.

15. The semiconductor package of claim 8 , wherein the first semiconductor chip and the second semiconductor chip are the same as each other.

16. A semiconductor package, comprising:

an interposer substrate having a first surface and a second surface that are opposite to each other, the interposer substrate including a wiring layer adjacent to the first surface;

a first semiconductor chip and a second semiconductor chip that are horizontally spaced apart from each other on the first surface of the interposer substrate;

a passivation layer on the first surface of the interposer substrate, the passivation layer covering the first semiconductor chip and the second semiconductor chip;

a third semiconductor chip on the passivation layer;

a plurality of conductive pillars below the third semiconductor chip; and

a plurality of redistribution patterns in the passivation layer, the plurality of redistribution patterns connecting the first semiconductor chip to the second semiconductor chip,

wherein the first semiconductor chip has a third surface and a fourth surface that are opposite to each other, the first semiconductor chip including a plurality of first chip pads adjacent to the third surface,

wherein the second semiconductor chip has a fifth surface and a sixth surface that are opposite to each other, the second semiconductor chip including a plurality of second chip pads adjacent to the fifth surface,

wherein each of the plurality of first chip pads and the plurality of second chip pads are directly bonded to a corresponding one of a plurality of wiring patterns in the wiring layer,

wherein the plurality of redistribution patterns are connected to the fourth surface of the first semiconductor chip and to the sixth surface of the second semiconductor chip,

wherein the plurality of conductive pillars penetrate through the passivation layer and connect with the wiring layer of the interposer substrate, and

wherein the plurality of conductive pillars are connected to corresponding ones of the plurality of wiring patterns in the wiring layer.

17. The semiconductor package of claim 16 , wherein

the first semiconductor chip and the second semiconductor chip are the same as each other, and

the third semiconductor chip is different from the first semiconductor chip and the second semiconductor chip.

18. The semiconductor package of claim 16 , wherein each of the first semiconductor chip, the second semiconductor chip, and the plurality of conductive pillars has a thickness in a direction perpendicular to the first surface of the interposer substrate, and

wherein the thickness of each of the plurality of conductive pillars is greater than the thickness of each of the first semiconductor chip and the second semiconductor chip.