IP Library › Granted Patent US 12,119,370
Granted Patent B2
US 12,119,370 · App. 17/535,800 · Granted Oct 15, 2024

Micro LED display including antistatic ground circuit board

Inventors: Seongho Son (Suwon-si, KR); Jongsung Lee (Suwon-si, KR); Changjoon Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01L27/156H01L27/0248H05K9/0054H05K9/0067
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Quick Facts
Patent No.
US 12,119,370
App. No.
17/535,800
Granted
Oct 15, 2024
Kind
B2
Abstract

An antistatic ground circuit board and a micro light emitting diode (LED) display including same are provided. The display includes a substrate comprising a first surface oriented toward a first direction, a second surface oriented toward a second direction opposite the first direction, and a side surface oriented toward a third direction perpendicular to the first and second directions, a first circuit unit disposed on the first surface, a second circuit unit disposed on the second surface, a side circuit unit disposed on the side surface and electrically connected to the first circuit unit, a plurality of micro LED chips arranged on one surface of the first circuit unit oriented toward the first direction, and a ground circuit board disposed on the second surface to ground static electricity generated in one or more circuit units from among the first circuit unit, the second circuit unit, and the side circuit unit.

Claims (36)

1. A micro light emitting diode (LED) display comprising:

a substrate comprising:

a first face disposed to face in a first direction,

a second face disposed to face in a second direction opposite to the first direction, and

a side face disposed to face in a third direction perpendicular to the first direction and the second direction;

a first circuit disposed on the first face;

a second circuit disposed on the second face;

a side circuit disposed on the side face and electrically connected in parallel to the first circuit;

multiple micro LED chips arranged on a face of the first circuit facing in the first direction; and

a ground circuit board disposed on the second face and configured to ground static electricity having been generated in one or more circuits from among the first circuit, the second circuit, or the side circuit,

wherein the ground circuit board is disposed between the second circuit and the side circuit,

wherein the ground circuit board comprises:

a signal layer electrically coupled to the side circuit, and

a ground layer attached to a first face of the signal layer, and

wherein the ground layer is electrically connected, through the signal layer, to at least one antistatic protection element arranged on a second face of the signal layer opposite to the first face of the signal layer.

2. The micro LED display of claim 1 , wherein the ground circuit board is disposed between the side circuit and the second circuit.

3. The micro LED display of claim 1 , wherein the ground circuit board comprises a flexible material.

4. The micro LED display of claim 1 ,

wherein the at least one antistatic protection element comprises a first connection pad and a second connection pad,

wherein the first connection pad is electrically connected to the signal layer, and

wherein the second connection pad is electrically connected to the ground layer.

5. The micro LED display of claim 4 ,

wherein the ground layer comprises a ground connection pad, and

wherein the second connection pad is electrically connected to the ground connection pad.

6. The micro LED display of claim 5 , wherein a portion of the ground layer on which the ground connection pad is disposed has an isosceles trapezoid shape.

7. The micro LED display of claim 1 , wherein the at least one antistatic protection element comprises a transient voltage suppressor (TVS) diode.

8. The micro LED display of claim 1 , wherein the signal layer comprises a flexible material.

9. The micro LED display of claim 1 , wherein the ground layer comprises a flexible material.

10. The micro LED display of claim 1 , wherein the at least one antistatic protection element is mounted on the signal layer by using a film on glass (FOG) method.

11. The micro LED display of claim 1 , wherein the signal layer on which the at least one antistatic protection element is arranged in an isosceles trapezoid shape.

12. The micro LED display of claim 1 , wherein the substrate comprises a glass material.

13. The micro LED display of claim 1 , wherein the second circuit is formed by a conductive material patterned onto the second face of the substrate or is a flexible circuit board connected to the second face.

14. The micro LED display of claim 1 ,

wherein the first circuit comprises a multiplexer/demultiplexer (MUX/DEMUX) circuit,

wherein the second circuit comprises a driver integrated circuit (IC), and

wherein the ground circuit board is disposed on an intermediate path between the MUX/DEMUX circuit and the driver IC.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2021
From: SON, SEONGHO; LEE, JONGSUNG; LEE, CHANGJOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 058212/0681 →
Priority Claims (1)
KR 10-2019-0064694 · May 31, 2019 · national
Continuity (2)
Continuation PCTKR2020007016 · May 29, 2020
Related Publication 20220085099A1 · Mar 17, 2022