Multi-gate transistors with backside power rail and reduced gate-drain capacitance
A semiconductor device according to the present disclosure includes a bottom dielectric feature on a substrate, a plurality of channel members directly over the bottom dielectric feature, a gate structure wrapping around each of the plurality of channel members, two first epitaxial features sandwiching the bottom dielectric feature along a first direction, and two second epitaxial features sandwiching the plurality of channel members along the first direction.
1. A structure, comprising:
an isolation feature;
a first dielectric fin, a second dielectric fin and a third dielectric fin disposed over the isolation feature;
a first epitaxial feature sandwiched between the first dielectric fin and the second dielectric fin;
a second epitaxial feature sandwiched between the second dielectric fin and the third dielectric fin;
a backside dielectric plug extending through the isolation feature to contact the first epitaxial feature; and
a backside contact extending through the isolation feature to contact the second epitaxial feature by way of a silicide layer.
2. The structure of claim 1 , wherein the backside dielectric plug comprises:
a first dielectric liner in contact with the isolation feature and the first epitaxial feature; and
a bottom dielectric layer spaced apart from the isolation feature and the first epitaxial feature by the first dielectric liner.
3. The structure of claim 2 ,
wherein the first dielectric liner comprises an oxygen-atom-free dielectric material,
wherein the bottom dielectric layer comprises tetraethylorthosilicate (TEOS) oxide, un-doped silicate glass, or doped silicon oxide such as borophosphosilicate glass (BPSG), fused silica glass (FSG), phosphosilicate glass (PSG), or boron doped silicon glass (BSG).
4. The structure of claim 3 , wherein the oxygen-atom-free dielectric material comprises silicon nitride, silicon carbide, silicon carbonitride.
5. The structure of claim 1 , further comprising:
a silicide layer disposed between the backside contact and the second epitaxial feature.
6. The structure of claim 5 , wherein the backside contact comprises:
a second dielectric liner in contact with the isolation feature; and
a metal fill layer spaced apart from the isolation feature by the second dielectric liner and in direct contact with the silicide layer.
7. The structure of claim 6 , wherein the second dielectric liner comprises silicon nitride, silicon carbide, or silicon carbonitride.
8. The structure of claim 1 , wherein the first dielectric fin, the second dielectric fin and the third dielectric fin comprise hafnium oxide, zirconium oxide, hafnium aluminum oxide, hafnium silicon oxide, aluminum oxide, silicon carbonitride, silicon oxycarbide, or silicon oxycarbonitride.
9. A semiconductor structure, comprising:
an isolation feature;
a first dielectric fin, a second dielectric fin and a third dielectric fin disposed over the isolation feature;
a first epitaxial feature sandwiched between the first dielectric fin and the second dielectric fin along a first direction;
a second epitaxial feature sandwiched between the second dielectric fin and the third dielectric fin along the first direction;
a backside dielectric plug extending through the isolation feature to contact the first epitaxial feature;
a backside contact extending through the isolation feature to contact the second epitaxial feature by way of a silicide layer;
a contact etch stop layer (CESL) disposed over top surfaces of the first epitaxial feature, the second epitaxial feature, the first dielectric fin, the second dielectric fin and the third dielectric fin;
a first dielectric layer over the CESL;
a first frontside contact extending through the first dielectric layer and the CESL to contact the first epitaxial feature; and
a second frontside contact extending through the first dielectric layer and the CESL to contact the second epitaxial feature.
10. The semiconductor structure of claim 9 , further comprising:
a second dielectric layer disposed over the first frontside contact,
wherein top surfaces of the first dielectric layer and the second dielectric layer are coplanar.
11. The semiconductor structure of claim 9 , further comprising
a plurality of nanostructures extending lengthwise along a second direction perpendicular to the first direction; and
a gate structure wrapping around each of the plurality of nanostructures,
wherein sidewalls of the plurality of nanostructures are in contact with the second epitaxial feature.
12. The semiconductor structure of claim 11 , wherein the gate structure is spaced apart from the second epitaxial feature by a plurality of inner spacer features.
13. The semiconductor structure of claim 12 , further comprising:
a bottom dielectric layer disposed below and in contact with the gate structure,
wherein the bottom dielectric layer is in contact with a bottommost one of the plurality of inner spacer features.
14. The semiconductor structure of claim 13 , wherein the backside contact comprises:
a dielectric liner in contact with a sidewall of the bottom dielectric layer; and
a metal fill layer spaced apart from the sidewall of the bottom dielectric layer by the dielectric liner.
15. The semiconductor structure of claim 13 , wherein the bottom dielectric layer comprises silicon oxide, silicon nitride, silicon oxycarbide, silicon oxycarbonitride, silicon carbonitride.
16. The semiconductor structure of claim 13 , wherein the bottom dielectric layer comprises a thickness between about 5 nm and about 30 nm.
17. A semiconductor structure, comprising:
a drain feature and a source feature;
a plurality of nanostructures extending between the drain feature and the source feature;
a gate structure wrapping around each of the plurality of nano structures;
a bottom dielectric feature disposed over the gate structure;
a backside dielectric layer disposed over the drain feature;
a first dielectric liner disposed along a sidewall of the backside dielectric layer and between the backside dielectric layer and the bottom dielectric feature;
a backside contact disposed over the source feature; and
a second dielectric liner disposed along a sidewall of the backside contact and in contact with the first dielectric liner.
18. The semiconductor structure of claim 17 , wherein the backside dielectric layer and the backside contact is spaced apart by the first dielectric liner and the second dielectric liner.
19. The semiconductor structure of claim 17 , wherein a thickness of the second dielectric liner is smaller than a thickness of the first dielectric liner.
20. The semiconductor structure of claim 17 ,
wherein the first dielectric liner is formed of an oxygen-free dielectric material,
wherein a composition of the second dielectric liner is different from a composition of the backside dielectric layer.