Semiconductor device
A semiconductor device having a semiconductor chip and a control circuit. The semiconductor chip has a gate electrode pad connected to the gate of an output element and the gate of a current monitor element, a sense emitter electrode pad connected to the sense emitter of the current monitor element and to the anode of the temperature detection diode via a current limiting element, and a cathode electrode pad that is connected to the cathode of the temperature detection diode, the cathode being grounded without being connected to the emitter of the output element. In a temperature detection mode, the control circuit receives a temperature detection voltage via the sense emitter electrode pad and detects the temperature state of the output element. In a current detection mode, the control circuit receives a sense current via the sense emitter electrode pad and detects the current state of the output element.
1. A semiconductor device for operating a load, comprising:
a semiconductor chip, including
an output element that receives a drive signal, to thereby perform switching to operate the load, the output element having a gate and an emitter,
a current monitor element that monitors a current flowing through the output element, the current monitor element having a gate and a sense emitter, and
a temperature detection element that detects a temperature of the output element, the temperature detection element having an anode and a cathode,
the semiconductor chip further having:
a first electrode pad connected to the gate of the output element and the gate of the current monitor element,
a second electrode pad connected to the sense emitter of the current monitor element and to the anode of the temperature detection element via a current limiting element, and
a third electrode pad connected to the cathode of the temperature detection element, which is grounded without being connected to the emitter of the output element; and
a control circuit connected to the first electrode pad and the second electrode pad, the control circuit being configured to
input the drive signal to the gate of the output element via the first electrode pad,
operate in a temperature detection mode in response to the output element being turned off, the temperature detection mode being a mode in which the control circuit
receives a temperature detection voltage output from the temperature detection element via the second electrode pad, and
detects a temperature state of the output element, and
operate in a current detection mode in response to the output element being turned on, the current detection mode being a mode in which the control circuit
receives a sense current output from the current monitor element via the second electrode pad, and
detects a current state of the output element.
2. The semiconductor device according to claim 1 , wherein
the control circuit includes a drive circuit, a gate level determination circuit, and a delay circuit,
the drive circuit generates the drive signal for turning on or off the output element,
the gate level determination circuit determines, based on a voltage level of the generated drive signal, whether the output element is on or off, to thereby output a determination signal, and
the delay circuit outputs a delayed determination signal obtained by delaying the determination signal by a predetermined period of time.
3. The semiconductor device according to claim 2 , wherein
the control circuit further includes
a first switch having a first terminal and a second terminal thereof,
a second switch having a first terminal and a second terminal thereof,
a constant current source having an output terminal,
a sense resistor having a first terminal and a second terminal thereof,
a temperature detection circuit having an input terminal thereof, and
a current detection circuit having an input terminal thereof, wherein
the constant current source outputs a forward current to the temperature detection element,
the sense resistor converts the sense current to a sense voltage,
the first terminal of the first switch is connected to the output terminal of the constant current source and the input terminal of the temperature detection circuit,
the first terminal of the second switch is connected to the first terminal of the sense resistor and the input terminal of the current detection circuit, and
the second terminal of the first switch is connected to the second terminal of the second switch and the second electrode pad.
4. The semiconductor device according to claim 3 , wherein
the control circuit switches to the temperature detection mode in response to the gate level determination circuit detecting a turn-off of the output element and outputting a first determination signal and the delay circuit delaying the first determination signal by the predetermined period of time and outputting a first delayed determination signal,
the first switch is turned on in response to the first delayed determination signal, so as to connect the output terminal of the constant current source and the input terminal of the temperature detection circuit to the second electrode pad, and
the second switch is turned off in response to the first determination signal, so as to disconnect the first terminal of the sense resistor and the input terminal of the current detection circuit from the second electrode pad.
5. The semiconductor device according to claim 4 , wherein the temperature detection circuit is configured to
receive the temperature detection voltage from the temperature detection element via the second electrode pad,
compare the temperature detection voltage with a temperature reference voltage, and
output an overheat detection signal upon detecting, based on a result of the comparison, that the temperature state of the output element is an overheat state.
6. The semiconductor device according to claim 3 , wherein
the control circuit switches to the current detection mode in response to the gate level determination circuit detecting a turn-on of the output element and outputting a second determination signal and the delay circuit delaying the second determination signal by the predetermined period of time and outputting a second delayed determination signal,
the first switch is turned off in response to the second delayed determination signal, so as to disconnect the output terminal of the constant current source and the input terminal of the temperature detection circuit from the second electrode pad, and
the second switch is turned on in response to the second determination signal, so as to connect the first terminal of the sense resistor and the input terminal of the current detection circuit to the second electrode pad.
7. The semiconductor device according to claim 6 , wherein
the sense current from the current monitor element flows via the second electrode pad, and
the current detection circuit compares the sense voltage, obtained by the sense resistor converting the sense current, with a current reference voltage, and outputs an overcurrent detection signal upon detecting, based on a result of the comparison, that the current state of the output element is an overcurrent state.
8. The semiconductor device according to claim 2 , wherein
the control circuit further includes an alarm output and protection circuit that outputs an alarm signal in response to at least one of an overheat state and an overcurrent state of the output element being detected, and
the drive circuit stops an operation of the output element in response to the alarm signal being output.
9. The semiconductor device according to claim 1 , wherein the current limiting element between the anode of the temperature detection element and the sense emitter of the current monitor element is a resistor.
10. The semiconductor device according to claim 1 , wherein the current limiting element between the anode of the temperature detection element and the sense emitter of the current monitor element is a metal-oxide-semiconductor (MOS) transistor.
11. The semiconductor device according to claim 1 , wherein the temperature detection element is a diode.
12. A semiconductor device for operating a load, comprising:
a semiconductor chip, including
an output element that receives a drive signal, to thereby perform switching to operate the load, the output element having a gate and an emitter,
a current monitor element that monitors a current flowing through the output element, the current monitor element having a gate and a sense emitter, and
a temperature detection element that detects a temperature of the output element, the temperature detection element having an anode and a cathode, the cathode being connected to the emitter of the output element,
the semiconductor chip further having:
a first electrode pad connected to the gate of the output element and the gate of the current monitor element, and
a second electrode pad connected to the sense emitter of the current monitor element and to the anode of the temperature detection element via a current limiting element; and
a control circuit connected to the first electrode pad and the second electrode pad, the control circuit being configured to
input the drive signal to the gate of the output element via the first electrode pad,
operate in a temperature detection mode in response to the output element being turned off, the temperature detection mode being a mode in which the control circuit
receives a temperature detection voltage output from the temperature detection element via the second electrode pad, and
detects a temperature state of the output element, and
operate in a current detection mode in response to the output element being turned on, the current detection mode being a mode in which the control circuit
receives a sense current output from the current monitor element via the second electrode pad, and
detects a current state of the output element.