IP Library Granted Patent US 12,128,479
Granted Patent B2
US 12,128,479 · App. 16/560,703 · Granted Oct 29, 2024

DMLS orthopedic intramedullary device and method of manufacture

Inventors: Darren J. Wilson (York, GB); David B. Harness (Eads, TN); Henry Faber (Memphis, TN)
Assignee: Smith & Nephew, Inc.
B22F10/364A61B17/72A61B17/7225A61B17/7233B22F3/15B22F5/10B22F10/28B23K26/08B23K26/103B23K26/354B24C1/086B33Y10/00B33Y80/00C22C14/00C22F1/183A61B2017/00526B22F2003/248B22F10/366B22F10/64B22F10/66B22F2998/10Y02P10/25
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Quick Facts
Patent No.
US 12,128,479
App. No.
16/560,703
Granted
Oct 29, 2024
Kind
B2
Abstract

An orthopedic device, such as an intramedullary nail for internal fixation of a bone and a method of manufacturing the same. The orthopedic device may be formed from a medical grade powder via an additive manufacturing process. The forming process may include heat treating the additive manufactured component and machining the heat treated additive manufactured component to form the orthopedic device. Further, the orthopedic device may be formed to include an internal sensor probe channel that extends within at least a portion of the wall of the device, but which does not protrude through an outer portion of the wall. Embodiments further include a dynamizing intramedullary nail that accommodate adjustments in the relative axial positions of one or more sections of the orthopedic device. The devise may include features in an inner region of the orthopedic device that may alter an elastic modulus of the orthopedic device.

Claims (30)

1. A method for manufacturing an orthopedic device comprising:

forming an orthopedic component via an additive manufacturing process by:

laser sintering a titanium powder to form a first plurality of laser sintered layers that define a pre-determined shape for the orthopedic component; and

selectively re-melting the first plurality of laser sintered layers, wherein the re-melting comprises a laser raster wherein a portion of a layer of the first plurality of laser sintered layers is double scanned;

heat treating the orthopedic component; and

after the heat treating, machining the orthopedic component to form the orthopedic device, wherein a wall of the orthopedic device has a variable thickness to alter a stiffness of the orthopedic device.

2. The method of claim 1 , wherein heat treating the orthopedic component comprises:

subjecting the orthopedic component to hot isostatically pressing utilizing a temperature of at least 1000° Celsius; and

cooling the orthopedic component at a cooling rate between 0.24° and 72° Celsius/minute.

3. The method of claim 1 , wherein forming the orthopedic component comprises forming the orthopedic component with a non-circular cross-sectional shape.

4. The method of claim 1 , wherein the orthopedic device comprises an intramedullary nail.

5. The method of claim 1 , wherein re-melting the first plurality of laser sintered layers comprises an alternating hatch laser raster that includes a scanning process along two perpendicular directions and a circumferential laser raster.

6. The method of claim 1 , wherein:

forming the orthopedic component comprises laser sintering an external surface and an internal surface of the orthopedic component, such that the external surface is separated from the internal surface by un-sintered titanium powder; and

heat treating the orthopedic component comprises melting the un-sintered titanium powder that is between the external and internal surfaces.

7. The method of claim 1 , wherein heat treating the orthopedic component comprises:

purging an environment in which the orthopedic component is positioned to a pressure of 15 millibars or less;

elevating a temperature of the orthopedic component to between 920° Celsius and 1000° Celsius;

sustaining a pressure of the environment in which the orthopedic component is positioned at 98 megapascal (MPa) to 108 MPa; and

cooling the temperature of the orthopedic component at a rate of, or less than, 10° Celsius/minute.

8. The method of claim 1 , wherein machining the orthopedic component comprises removing, using grit blasting, an alpha case layer of the orthopedic component.

9. The method of claim 1 , wherein machining the orthopedic component comprises forming a compressive layer of residual stresses on the orthopedic device.

10. The method of claim 1 , wherein machining the orthopedic component comprises extrude honing an inner surface of the orthopedic device.

11. The method of claim 1 , further comprising depositing an ion of gold and/or silver onto the orthopedic device to form an anti-microbial orthopedic device.

12. The method of claim 1 , wherein the titanium powder is TiAl6V4 powder.

13. The method of claim 1 , wherein the portion of a layer of the plurality of laser sintered layers is double scanned with uni-directional X and Y scanning.

14. The method of claim 1 , wherein the portion of a layer of the first plurality of laser sintered layers is double scanned with multi-directional X and Y scanning.

15. The method of claim 1 , wherein the portion of a layer of the first plurality of laser sintered layers is double scanned with an X and Y alternating hatch laser raster.

16. The method of claim 1 , wherein the portion of a layer of the first plurality of laser sintered layers is double scanned with a circumferential laser raster.

17. The method of claim 2 , wherein the titanium powder is TiAl6V4 powder.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2020
From: WILSON, DARREN J.; HARNESS, DAVID B.; FABER, HENRY
To: SMITH & NEPHEW, INC.
Reel/Frame 052646/0527 →
Continuity (4)
Continuation 15302899
Provisional Application 61978804 · Apr 11, 2014
Provisional Application 61978806 · Apr 11, 2014
Related Publication 20190388128A1 · Dec 26, 2019