IP Library › Granted Patent US 12,131,910
Granted Patent B2
US 12,131,910 · App. 17/474,973 · Granted Oct 29, 2024

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Inventors: Motoki Fujii (Yokkaichi, JP); Hiroshi Kubota (Yokkaichi, JP); Fumiki Aiso (Kuwana, JP)
Assignee: Kioxia Corporation
H01L21/3003C01B5/02H01L21/67017
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,131,910
App. No.
17/474,973
Granted
Oct 29, 2024
Kind
B2
Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a substrate processor configured to process a substrate with a gas of a first substance and a gas of a second substance, and discharge a first gas including the first substance and/or the second substance. The apparatus further includes a disposer configured to discard the first gas discharged from the substrate processor. The apparatus further includes a recoverer configured to generate a second gas including the second substance by using the first substance in the first gas discharged from the substrate processor, and supply the second gas to the substrate processor.

Claims (27)

1. A semiconductor manufacturing apparatus comprising:

a substrate processor configured to process a substrate with a gas of a first substance and a gas of a second substance, and discharge a first gas including the first substance and/or the second substance;

a disposer configured to discard the first gas discharged from the substrate processor; and

a recoverer configured to generate a second gas including the second substance by using the first substance in the first gas discharged from the substrate processor, and supply the second gas to the substrate processor,

wherein the recoverer includes:

a generator configured to generate the second substance by using the first substance in the first gas; and

a container configured to contain a liquid including the second substance generated by the generator, and

wherein the apparatus further comprises:

a measuring instrument configured to measure a liquid level of a liquid in the container;

a switch configured to switch a discharge destination of the first gas discharged from the substrate processor between the disposer and the recoverer; and

a controller configured to control the switch based on the liquid level measured by the measuring instrument.

2. A semiconductor manufacturing apparatus comprising:

a substrate processor configured to process a substrate with a gas of a first substance and a gas of a second substance, and discharge a first gas including the first substance and/or the second substance;

a disposer configured to discard the first gas discharged from the substrate processor; and

a recoverer configured to generate a second gas including the second substance by using the first substance in the first gas discharged from the substrate processor, and supply the second gas to the substrate processor,

wherein the recoverer includes:

a container configured to contain the first gas, and

wherein the apparatus further comprises:

a measuring instrument configured to measure a pressure of a gas in the container;

a switch configured to switch a discharge destination of the first gas discharged from the substrate processor between the disposer and the recoverer; and

a controller configured to control the switch based on the pressure measured by the measuring instrument.

3. A method of manufacturing a semiconductor device, comprising:

processing a substrate in a substrate processor by using a gas of a first substance and a gas of a second substance, and discharging a first gas including the first substance and/or the second substance from the substrate processor;

discarding, with a disposer, the first gas discharged from the substrate processor; and

generating, with a recoverer, a second gas including the second substance by using the first substance in the first gas discharged from the substrate processor, and supplying the second gas to the substrate processor,

wherein the first substance is D 2 or H 2 where H represents hydrogen and D represents deuterium, and the second substance is D 2 O or H 2 O where O represents oxygen.

4. The method of claim 3 , wherein the recoverer causes D 2 or H 2 as the first substance to react with O 2 to generate D 2 O or H 2 O as the second substance.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2021
From: FUJII, MOTOKI; KUBOTA, HIROSHI; AISO, FUMIKI
To: KIOXIA CORPORATION
Reel/Frame 058404/0944 →
Priority Claims (1)
JP 2021-029111 · Feb 25, 2021 · national
Continuity (1)
Related Publication 20220270885A1 · Aug 25, 2022