Semiconductor module

1. A semiconductor module, comprising:

a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, the semiconductor device further including an upper surface electrode provided on the upper surface thereof and a plating layer provided on an upper surface of the upper surface electrode; and

a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material, wherein

the first bonding portion has a plurality of first protrusions at the bonding surface, each first protrusion protruding toward the semiconductor device, and

each first protrusion is provided at a position separated from a boundary portion in which the gate runner and the plating layer are gathered by a first distance in a plan view of the semiconductor module.

2. The semiconductor module according to claim 1 , wherein

a sum of areas of the plurality of first protrusions is in a range of 0.5% to 25% of an area of the bonding surface of the first bonding portion.

3. The semiconductor module according to claim 1 , wherein

said each first protrusion is provided at a position apart from an outer edge of the first bonding surface of the first bonding portion by a second distance.

4. The semiconductor module according to claim 1 , wherein

one of the first protrusions has a curved surface facing the gate runner in the plan view.

5. The semiconductor module according to claim 1 , wherein

one of the first protrusions has a curved surface at a tip end in a cross-sectional view.

6. The semiconductor module according to claim 1 , wherein

one of the first protrusions has a columnar shape, a truncated cone shape, or a hemispherical shape.

7. The semiconductor module according to claim 1 , wherein

the plurality of first protrusions are arranged along an outer peripheral edge of the first bonding portion so as to sandwich the gate runner in the plan view.

8. The semiconductor module according to claim 1 , wherein

the plurality of first protrusions are arranged side by side along the first direction of the gate runner in the plan view.

9. The semiconductor module according to claim 1 , wherein

said each first protrusion is separated from the gate runner by 0.4 mm or more in the plan view.

10. The semiconductor module according to claim 1 , wherein

said each first protrusion is provided in a range of 0.4 mm to 2.0 mm inward from an outer edge of the first bonding surface of the first bonding portion.

11. The semiconductor module according to claim 1 , wherein

a protrusion height of said each first protrusion is in a range of 50 μm to 300 μm.

12. The semiconductor module according claim 1 , wherein

said each first protrusion has a columnar shape or a truncated cone shape, and an outer diameter of said each first protrusion is in a range of 0.4 mm to 1.5 mm.

13. The semiconductor module according to claim 1 , wherein

the gate runner passes through the plating layer to reach the upper surface of the upper surface electrode, so that the gate runner and the plating layer are gathered in the boundary portion of the upper surface electrode.

14. The semiconductor module according to claim 13 , wherein

the upper surface of the semiconductor device has a rectangular shape with four sides in the plan view, and the semiconductor device further includes a gate pad in a center of one of the four sides on the upper surface thereof,

at the upper surface of the semiconductor device, the gate runner extends from the gate pad to an other one of the four sides that is parallel to the one of the four sides in a direction perpendicular to the one and the other one of the four sides, and

the first protrusions are arranged in linear symmetry about the gate runner.

15. The semiconductor module according to claim 13 , wherein

the gate runner extends to divide the upper surface of the semiconductor device into a plurality of pieces, and each the plurality of first protrusions is arranged on a respective one of the pieces of the upper surface of the semiconductor device.

16. The semiconductor module according to claim 15 , wherein

the gate runner is formed into a lattice shape on the upper surface of the semiconductor device, and

the plurality of pieces of the upper surface of the semiconductor device includes a plurality of lattice surfaces defined by the gate runner, and each of the lattice surfaces has a respective one of the first protrusions arranged one by one thereon, and the sum of areas of the first protrusions is in a range of 0.5% to 25% of an area of the first bonding surface of the first bonding portion.

17. The semiconductor module according to claim 15 , wherein

the upper surface of the semiconductor device has a rectangular shape with four sides in the plan view, and the semiconductor device further includes a gate pad in a center of one of the four sides on the upper surface of the semiconductor device,

at the upper surface of the semiconductor device, the gate runner is formed into a T shape as a whole by extending from the gate pad in a direction perpendicular to the one of the four sides, stopping midway between the one and the other one of the four sides, and extending from the stopped point in a direction parallel to the one of the four sides, and

one of the first protrusions is arranged in each of two partitions partitioned by the T-shaped gate runner at a side closer to the one of the four sides than the other one of the four sides of the upper surface of the semiconductor device, and two or more of the first protrusions are arranged in a partition partitioned by the T-shaped gate runner at a side closer to the other one of the four sides than the one of the four sides.

18. The semiconductor module according to claim 1 , further comprising:

a laminated substrate including an insulating plate with an upper surface, and a first circuit board and a second circuit board provided on the upper surface of the insulating plate, wherein

the semiconductor device is provided on the first circuit board,

the metal wiring plate has a second bonding portion with a second bonding surface to which the second circuit board is bonded via a second bonding material, and a connecting portion connecting the first bonding portion and the second bonding portion, and

the second bonding portion has at least one second protrusion at the second bonding surface that protrudes toward the second circuit board.

19. The semiconductor module according to claim 18 , wherein

the first bonding portion, the second bonding portion, and the connecting portion are aligned in the plan view.

20. The semiconductor module according to claim 18 , wherein

the first bonding portion and the second bonding portion face each other diagonally, and sandwich the connecting portion therebetween in the plan view.

21. The semiconductor module according to claim 18 , further comprising:

a first bending portion connecting the first bonding portion and the connecting portion, the first bending portion having a curved shape bent from one side of the first bonding portion toward the connecting portion, wherein

a width of the first bending portion at the one side of the first bonding portion is smaller than a length of the one side of the first bonding portion, and

at least one of the first protrusions faces the first bending portion in a direction perpendicular to the one side of the first bonding portion, and at least one of the first protrusions faces a portion of the one side of the first bonding portion in which the first bending portion is not connected.

22. The semiconductor module according to claim 21 , further comprising:

a second bending portion connecting the second bonding portion and the connecting portion, the second bending portion having a curved shape bent from one side of the second bonding portion toward the connecting portion,

wherein a width of the second bending portion is smaller than a length of the one side of the second bonding portion, and

at least one of the second protrusion includes a plurality of second protrusions, and at least one of the second protrusion faces the second bending portion in a direction perpendicular to the one side of the second bonding portion, and at least one of the second protrusions faces a portion of the one side of second bonding portion in which the second bending portion is not connected.

23. The semiconductor module according to claim 21 , wherein

the first bonding portion has a cutout at the one side adjacent to the first bending portion.

24. The semiconductor module according to claim 13 , wherein

the semiconductor device further includes a guard ring surrounding the plating layer in the plan view, and

the first protrusions are separated from the guard ring by a third distance in the plan view.