Micro component structure and manufacturing method thereof, and transfer method for light-emitting diode chip
View Patent ↗The disclosure relates to a micro component structure and a manufacturing method thereof, and a transfer method for a light-emitting diode (LED) chip. The micro component structure includes a substrate ( 300 ), multiple stacked adhesive layer structures spaced on a first surface ( 300 a ) of the substrate ( 300 ), and multiple LED chips ( 20 ) correspondingly disposed on the multiple stacked adhesive layer structures. Each of the multiple LED chips ( 20 ) has two extraction electrodes ( 21 ) at a surface facing toward the multiple stacked adhesive layer structures. Each of the multiple stacked adhesive layer structures includes a photolysis adhesive layer ( 31 ′) and a pyrolysis adhesive layer ( 32 ′) that are stacked. The photolysis adhesive layer ( 31 ′) is in contact with the first surface ( 300 a ). The pyrolysis adhesive layer ( 32 ′) is located between the two extraction electrodes ( 21 ) and has a thickness greater than a height of each of the two extraction electrodes ( 21 ).
1. A micro component structure, comprising:
a substrate having a first surface;
a plurality of stacked adhesive layer structures spaced on the first surface; and
a plurality of light-emitting diode (LED) chips correspondingly disposed on the plurality of stacked adhesive layer structures, each of the plurality of LED chips having two extraction electrodes at a surface facing toward the plurality of stacked adhesive layer structures, wherein
each of the plurality of stacked adhesive layer structures comprises a photolysis adhesive layer and a pyrolysis adhesive layer that are stacked, the photolysis adhesive layer is in contact with the first surface, and the pyrolysis adhesive layer is located between the two extraction electrodes and has a thickness greater than a height of each of the two extraction electrodes.
2. The micro component structure of claim 1 , wherein the pyrolysis adhesive layer has a hot melt temperature lower than the photolysis adhesive layer, and a difference between hot melt temperatures of the pyrolysis adhesive layer and the photolysis adhesive layer is greater than 20° C.
3. The micro component structure of claim 1 , wherein the thickness of the pyrolysis adhesive layer is greater than a thickness of the photolysis adhesive layer.
4. The micro component structure of claim 3 , wherein the thickness of the photolysis adhesive layer is between 2 μm and 3 μm.
5. The micro component structure of claim 3 , wherein the thickness of the pyrolysis adhesive layer is between 4 μm and 6 μm.
6. The micro component structure of claim 1 , wherein a width of the photolysis adhesive layer is greater than or equal to a width of the pyrolysis adhesive layer.
7. The micro component structure of claim 6 , wherein the width of the photolysis adhesive layer is between 4 μm and 9 μm.
8. The micro component structure of claim 6 , wherein the width of the pyrolysis adhesive layer is between 2 μm and 6 μm.