Snubber circuit, power semiconductor module, and induction heating power supply device
A snubber circuit unit for a power semiconductor module including an arm having two power semiconductor elements capable of switching which are connected in series, the power semiconductor module including a positive DC input terminal, a negative input terminal, and an output terminal which are electrically connected to the arm, the positive DC input terminal, the negative DC input terminal, and the output terminal being provided on an upper surface opposite to an installation surface of the power semiconductor module, the snubber circuit unit includes a circuit board, and a plurality of electronic components mounted on the circuit board.
1. A snubber circuit unit for a power semiconductor module including an arm having two power semiconductor elements capable of switching which are connected in series, the power semiconductor module including a positive DC input terminal, a negative DC input terminal, and an output terminal which are electrically connected to the arm, the positive DC input terminal, the negative DC input terminal, and the output terminal being provided on an upper surface opposite to an installation surface of the power semiconductor module,
the snubber circuit unit comprising:
a circuit board; and
a plurality of electronic components mounted on the circuit board,
wherein the circuit board includes:
a bare board erected with respect to the upper surface of the power semiconductor module;
a conductor layer provided on at least one surface of a front surface and a rear surface of the bare board, and forming a first circuit pattern between the positive DC input terminal and the output terminal, and a second circuit pattern between the negative DC input terminal and the output terminal; and
a plurality of connection terminals connecting the conductor layer to the positive DC input terminal, the negative DC input terminal, and the output terminal,
wherein the bare board includes:
a pair of insulating substrates; and
a plurality of conductive substrates sandwiched between the pair of insulating substrates in a state insulated from one another and connected to the conductor layer respectively via a through hole,
wherein each of the plurality of conductive substrates includes an extended portion protruding from one side surface of the bare board, and
wherein the plurality of connection terminals are respectively formed by the extended portions of the plurality of conductive substrates.
2. The snubber circuit unit according to claim 1 ,
wherein the conductor layer and the plurality of electronic components are provided on the front surface and the rear surface of the bare board.
3. The snubber circuit unit according to claim 2 ,
wherein the first circuit pattern and electronic components connected to the first circuit pattern among the plurality of electronic components are provided on the front surface of the bare board, and
wherein the second circuit pattern and electronic components connected to the second circuit pattern among the plurality of electronic components are provided on the rear surface of the bare board.
4. The snubber circuit unit according to claim 1 ,
wherein the plurality of electronic components are mounted on the circuit board in an exposed state.
5. The snubber circuit unit according to claim 1 ,
wherein the plurality of electronic components includes a diode, and
wherein the diode is a silicon diode or a silicon carbide diode.
6. The snubber circuit unit according to claim 1 ,
wherein the conductor layer has a thickness of 0.2 mm or more and 2 mm or less.
7. A power semiconductor module including an arm formed by connecting two power semiconductor elements capable of switching in series, the power semiconductor module comprising:
a positive DC input terminal, a negative DC input terminal, and an output terminal which are electrically connected to the arm; and
a snubber circuit unit connected to the positive DC input terminal, the negative DC input terminal, and the output terminal,
wherein the positive DC input terminal, the negative DC input terminal, and the output terminal are provided on an upper surface opposite to an installation surface of the power semiconductor module,
wherein the snubber circuit unit includes:
a circuit board; and
a plurality of electronic components mounted on the circuit board,
wherein the circuit board includes:
a bare board erected with respect to the upper surface of the power semiconductor module;
a conductor layer provided on at least one surface of a front surface and a rear surface of the bare board, and forming a first circuit pattern bridged between the positive DC input terminal and the output terminal, and a second circuit pattern bridged between the negative DC input terminal and the output terminal; and
a plurality of connection terminals connecting the conductor layer to the positive DC input terminal, the negative DC input terminal, and the output terminal,
wherein the bare board includes:
a pair of insulating substrates; and
a plurality of conductive substrates sandwiched between the pair of insulating substrates in a state insulated from one another and connected to the conductor layer respectively via a through hole,
wherein each of the plurality of conductive substrates includes an extended portion protruding from one side surface of the bare board, and
wherein the plurality of connection terminals are respectively formed by the extended portions of the plurality of conductive substrates.
8. An induction heating power supply device comprising:
an inverter unit configured to convert DC power into AC power,
wherein the inverter unit is configured with a bridge including a plurality of the power semiconductor modules according to claim 7 .