Semiconductor device, integrated circuit and method of manufacturing the same
View Patent ↗A semiconductor device, an integrated circuit, and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a thin-film transistor (TFT) over the substrate, and a magnetoresistive random-access memory (MRAM) cell electrically coupled to the TFT. The TFT includes a gate electrode; an active layer disposed above the gate electrode; source/drain electrodes disposed above the gate electrode and separated by the active layer; and at least two dielectric layers disposed between the gate electrode and the source/drain electrodes.
1. A semiconductor device, comprising:
a substrate;
a thin-film transistor (TFT) disposed over the substrate, the TFT comprising:
a gate electrode;
an active layer disposed above the gate electrode;
source/drain electrodes disposed above the gate electrode and separated by the active layer; and
at least two dielectric layers disposed between the gate electrode and the source/drain electrodes, wherein the active layer extends from a plane, which is coplanar with an upper surface of the source/drain electrodes, to an upper surface of a first dielectric layer of the at least two dielectric layers through a second dielectric layer of the at least two dielectric layers; and
a magnetoresistive random-access memory (MRAM) cell electrically coupled to the TFT.
2. The semiconductor device of claim 1 , wherein the active layer and the gate electrode are separated by a single dielectric layer and the source/drain electrodes and the gate electrode are separated by the at least two dielectric layers.
3. The semiconductor device of claim 1 , wherein the first dielectric layer is disposed adjacent to the gate electrode, the second dielectric layer is disposed adjacent to the first dielectric layer, and the first dielectric layer has a dielectric constant higher than that of the second dielectric layer.
4. The semiconductor device of claim 1 , wherein the second dielectric layer that is disposed adjacent to the source/drain electrodes is separated by the active layer.
5. The semiconductor device of claim 1 , wherein the active layer has an upper surface substantially coplanar with the upper surface of the source/drain electrodes.
6. The semiconductor device of claim 1 , further comprising an interlayer dielectric (ILD) layer disposed over the substrate, wherein the TFT is disposed over the ILD layer and an upper surface of the ILD layer is substantially coplanar with an upper surface of the gate electrode of the TFT.
7. The semiconductor device of claim 1 , wherein an upper surface of the active layer of the TFT is substantially coplanar with the upper surface of the source/drain electrodes of the TFT.
8. The semiconductor device of claim 1 , wherein the TFT is disposed in a back-end-of-line (BEOL) interconnect structure.
9. An integrated circuit, comprising:
a logic region disposed on a substrate; and
an embedded memory region disposed over the substrate, comprising:
a thin-film transistor (TFT) disposed over the substrate, the TFT comprising:
a gate electrode;
an active layer disposed above the gate electrode;
source/drain electrodes disposed above the gate electrode and separated by the active layer; and
at least two dielectric layers disposed between the gate electrode and the source/drain electrodes, wherein the at least two dielectric layers includes a first dielectric layer disposed adjacent to the gate electrode and a second dielectric layer disposed adjacent to the first dielectric layer, and the active layer extends from a plane, which is coplanar with an upper surface of the source/drain electrodes, to an upper surface of the first dielectric layer through the second dielectric layer; and
a magnetoresistive random-access memory (MRAM) cell electrically coupled to the TFT.
10. The integrated circuit of claim 9 , wherein the active layer and the gate electrode are separated by a single dielectric layer and the source/drain electrodes and the gate electrode are separated by the at least two dielectric layers.
11. The integrated circuit of claim 9 , wherein the first dielectric layer has a dielectric constant higher than that of the second dielectric layer.
12. The integrated circuit of claim 9 , wherein a dielectric layer that is disposed adjacent to the source/drain electrodes is separated by the active layer.
13. The integrated circuit of claim 9 , wherein the active layer has an upper surface substantially coplanar with the upper surface of the source/drain electrodes.
14. The integrated circuit of claim 9 , further comprising an interlayer dielectric (ILD) layer disposed over the substrate, wherein the TFT is disposed over the ILD layer and an upper surface of the ILD layer is substantially coplanar with an upper surface of the gate electrode of the TFT.
15. The integrated circuit of claim 14 , wherein the logic region comprises a transistor and a portion of the transistor is within the ILD layer.
16. The integrated circuit of claim 9 , wherein an upper surface of the active layer of the TFT is substantially coplanar with the upper surface of the source/drain electrodes of the TFT.
17. An integrated circuit, comprising:
a logic region disposed on a substrate; and
an embedded memory region disposed over the substrate, comprising:
a thin-film transistor (TFT) disposed over the substrate, the TFT comprising:
a gate electrode;
an active layer disposed above the gate electrode;
source/drain electrodes disposed above the gate electrode and separated by the active layer; and
at least two dielectric layers disposed between the gate electrode and the source/drain electrodes,
wherein the active layer extends from a plane, which is coplanar with an upper surface of the source/drain electrodes, to an upper surface of a first dielectric layer of the at least two dielectric layers through a second dielectric layer of the at least two dielectric layers; and
a magnetoresistive random-access memory (MRAM) cell electrically coupled to the TFT.
18. The integrated circuit of claim 17 , wherein an upper surface of the active layer of the TFT is substantially coplanar with the upper surface of the source/drain electrodes of the TFT.
19. The integrated circuit of claim 17 , wherein the TFT is disposed in a back-end-of-line (BEOL) interconnect structure.
20. The integrated circuit of claim 17 , wherein the MRAM cell electrically coupled to the TFT by a via and one or more metal line.