Laser processing machine
A laser beam application unit of a laser processing machine includes a laser oscillator, a spot shaper, a polygon mirror, and a condenser. The laser oscillator emits a pulsed laser beam. The spot shaper is configured to shape a spot profile of the pulsed laser beam emitted from the laser oscillator such that the spot profile becomes long in a Y-axis direction and short in an X-axis direction. The polygon mirror disperses the spot, which has been shaped by the spot shaper, in the X-axis direction. The condenser focuses the pulsed laser beam, which has been dispersed by the polygon mirror, on a workpiece held on a chuck table.
1. A laser processing machine comprising:
a chuck table configured to hold a workpiece;
a laser beam application unit configured to apply a pulsed laser beam to the workpiece held on the chuck table;
an X-axis direction feed mechanism configured to perform relative processing feed of the chuck table and the laser beam application unit in an X-axis direction; and
a Y-axis direction feed mechanism configured to perform relative processing feed of the chuck table and the laser beam application unit in a Y-axis direction that intersects the X-axis direction at right angles,
wherein the laser beam application unit includes
a laser oscillator that oscillates pulsed laser and emits a pulsed laser beam,
a spot shaper configured to shape a spot profile of the pulsed laser beam emitted from the laser oscillator such that the spot profile becomes long in the Y-axis direction and short in the X-axis direction,
a polygon mirror that disperses, in the X-axis direction, the spot which has been shaped by the spot shaper, and
a condenser that focuses, on the workpiece held on the chuck table, the pulsed laser beam which has been dispersed by the polygon mirror so that the spot profile in the Y-axis direction is oriented in a width direction of each of a plurality of intersecting streets formed on the workpiece.
2. The laser processing machine according to claim 1 , wherein the workpiece is a semiconductor wafer with a plurality of devices formed in a front surface thereof divided by the plurality of intersecting streets, and the spot profile which has been shaped at the spot shaper has, in the Y-axis direction, a length corresponding to a width of the streets.
3. The laser processing machine according to claim 1 , wherein the laser beam application unit further includes a water film-forming unit configured to form a water film between the condenser and the workpiece held on the chuck table.