IP Library Granted Patent US 12,134,161
Granted Patent B2
US 12,134,161 · App. 17/017,220 · Granted Nov 5, 2024

Method for polishing diamond crystal, and diamond crystal

Inventors: Seongwoo Kim (Tokyo, JP); Daiki Fujii (Tokyo, JP); Koki Oyama (Tokyo, JP); Koji Koyama (Tokyo, JP)
Assignee: Orbray Co., Ltd.
B24B37/042
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Quick Facts
Patent No.
US 12,134,161
App. No.
17/017,220
Granted
Nov 5, 2024
Kind
B2
Abstract

A method for polishing a diamond crystal includes preparing a diamond crystal having a main surface having a plane orientation of (100). Mechanical polishing is performed on the main surface using a polishing wheel such that: a tangent contacts a curve extending in a rotation direction of the wheel and contacting a contact position between the diamond crystal and the wheel that is rotating; and a tangent direction of the tangent at the contact position is within a range of ±10 degrees relative to a <110> direction of the diamond crystal, thereby causing an affected region to appear such that the affected region is parallel to a direction of a plane orientation (111) of the diamond crystal and penetrates the diamond crystal onto the main surface. Chemical mechanical polishing is performed on the main surface to remove the affected region, thereby removing the affected region from the main surface.

Claims (5)

1. A method for polishing a diamond crystal, the method comprising:

providing a diamond crystal having a main surface having a plane orientation of (100);

performing mechanical polishing on the main surface of the diamond crystal using a polishing wheel such that: a tangent of a contact position on the diamond crystal contacts a curve that extends in a rotation direction in which the polishing wheel is rotating and that contacts the contact position at which the diamond crystal contacts the polishing wheel that is rotating; and a tangent direction of the tangent at the contact position is within a range of ±10 degrees relative to a <110> direction of the diamond crystal, thereby causing an affected region to appear such that the affected region is parallel to a direction of a plane orientation (111) of the diamond crystal and penetrates the diamond crystal onto the main surface; and

performing chemical mechanical polishing on the main surface of the diamond crystal to remove the affected region, thereby removing the affected region from the main surface.

2. The method for polishing a diamond crystal according to claim 1 , wherein the step of performing chemical mechanical polishing comprises making a surface roughness Rq of the main surface equal to or less than 5 nm.

Assignments (2)
CHANGE OF NAME Recorded Sep 26, 2024
From: ADAMANT NAMIKI PRECISION JEWEL CO., LTD.
To: ORBRAY CO., LTD.
Reel/Frame 068705/0274 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2020
From: KIM, SEONGWOO; FUJII, DAIKI; OYAMA, KOKI; KOYAMA, KOJI
To: ADAMANT NAMIKI PRECISION JEWEL CO., LTD.
Reel/Frame 053737/0716 →
Priority Claims (1)
JP 2018-048664 · Mar 16, 2018 · national
Continuity (2)
Continuation PCTJP2019010524 · Mar 14, 2019
Related Publication 20200406420A1 · Dec 31, 2020