Reduced vertical profile ejector for liquid cooled modules
An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.
1. An apparatus, comprising:
a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors, the ejectors having a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.
2. The apparatus of claim 1 , wherein the ejectors have tabs that, when pressed, helps to eject the DIMM from the PCB DIMM connector.
3. The apparatus of claim 1 , wherein the PCB DIMM connector has a vertical height of 3 mm or lower.
4. A dual in-line memory module (DIMM), comprising:
unbent liquid cooling conduits that run from one end of the DIMM to the other end of the DIMM.
5. The DIMM of claim 4 , wherein the unbent liquid cooling conduits, when connected to a liquid cooling system when the DIMM is connected to a printed circuit board (PCB) connector, secure the DIMM to the PCB connector.
6. An electronic system, comprising:
a liquid cooling system;
a printed circuit board (PCB), a dual in-line memory module (DIMM) connector on the PCB; and
a DIMM that is plugged into the DIMM connector, the DIMM having liquid cooling conduits that run straight across the DIMM, the liquid cooling conduits connected to the liquid cooling system, wherein the DIMM connector comprises ejectors that reside beneath the liquid cooling conduits.
7. The electronic system of claim 6 , wherein the ejectors have tabs that, when pressed, help to eject the DIMM from the DIMM connector.
8. The electronic system of claim 7 , wherein the electronic system is a computer system.
9. The electronic system of claim 6 , wherein the DIMM connector has a vertical height of 3 mm or lower.