Method of manufacturing a semiconductor device and a semiconductor device
In a method of manufacturing a semiconductor device, a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked is formed, a sacrificial gate structure is formed over the fin structure, a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space, the first semiconductor layers are laterally etched through the source/drain space, and a source/drain epitaxial layer is formed in the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers and at least one of the spacer has width changes along vertical direction of device. At least one of the first semiconductor layers has a composition different from another of the first semiconductor layers.
1. A method of manufacturing a semiconductor device, comprising:
forming a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked along a stacked direction;
forming a sacrificial gate structure over the fin structure;
etching a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, thereby forming a source/drain space;
laterally etching the first semiconductor layers through the source/drain space; and
forming a source/drain epitaxial layer in the source/drain space,
wherein a composition of at least one of the first semiconductor layers varies, within the at least one of the first semiconductor layers, along the stacked direction,
the first semiconductor layers comprise SiGe and the second semiconductor layers comprise Si,
a Ge concentration of the first semiconductor layers decreases from a bottom one closest to a substrate to a top one of the first semiconductor layers, and
a difference of a Ge concentration between adjacent first semiconductor layers is in a range from 0.5% to 5.0%.
2. The method of claim 1 , wherein at least one of the first semiconductor layers has a constant Ge concentration.
3. The method of claim 2 , wherein the first semiconductor layers are laterally etched by wet etching comprising repeating wet etchings using a mixed solution of H 2 O 2 , CH 3 COOH and HF, followed by a H 2 O cleaning.
4. The method of claim 1 , wherein in the at least one of the first semiconductor layers, a Ge concentration at a center region of the at least one of the first semiconductor layers is smaller than a Ge concentration at edge regions of the at least one of the first semiconductor layers, along the stacked direction.
5. The method of claim 1 , further comprising forming inner spacers made of a dielectric material on ends of the etched first semiconductor layers, respectively,
wherein a width of a bottom one of the inner spacers is greater than a top one of the inner spacers.
6. The method of claim 5 , further comprising, after the source/drain epitaxial layer is formed:
removing the sacrificial gate structure, thereby exposing a part of the fin structure;
removing the first semiconductor layers from the exposed fin structure, thereby forming channel layers including the second semiconductor layers; and
forming a gate dielectric layer and a gate electrode layer around the channel layers,
wherein the gate electrode layer is isolated from the source/drain epitaxial layer by the inner spacer and the gate dielectric layer.
7. The method of claim 1 , wherein the source/drain space has a width that gradually increases from a bottom to a top.
8. The method of claim 1 , wherein a Ge concentration of the first semiconductor layers decreases from a bottom one to a top one of the first semiconductor layers, wherein the bottom one is closer to the substrate than the top one.
9. A method of manufacturing a semiconductor device, comprising:
forming a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked over a substrate;
forming a sacrificial gate structure over the fin structure;
etching a source/drain region of the fin structure, thereby forming a source/drain space having a tapered shape;
laterally etching the first semiconductor layers through the source/drain space;
forming inner spacers made of a dielectric material on ends of the etched first semiconductor layers; and
forming a source/drain epitaxial layer in the source/drain space,
wherein the first semiconductor layers comprise a first layer having a constant composition within the first layer, and a second layer having a variable composition within the second layer,
the first semiconductor layers further comprise a third layer having a constant composition within the third layer, and
the second layer is disposed between the first layer and the third layer.
10. The method of claim 9 , wherein a difference of lengths of the etched first semiconductor layers under the sacrificial gate structures is more than zero and less than 1 nm.
11. The method of claim 9 , wherein:
the first semiconductor layers are made of SiGe, and
the second semiconductor layers are made of Si.
12. The method of claim 9 , wherein the first semiconductor layers are laterally etched by wet etching comprising repeating wet etchings using a mixed solution of H 2 O 2 , CH 3 COOH and HF, followed by a H 2 O cleaning.
13. The method of claim 9 , wherein a width of a bottom one of the inner spacers is greater than a top one of the inner spacers.
14. A method of manufacturing a semiconductor device, comprising:
forming a stacked layer, in which first semiconductor layers and second semiconductor layers are alternately stacked, over a substrate;
patterning the stacked layer into a fin structure;
forming a sacrificial gate structure over the fin structure;
etching a source/drain region of the fin structure, thereby forming a source/drain space;
laterally etching the first semiconductor layers through the source/drain space;
forming inner spacers made of a dielectric material on ends of the etched first semiconductor layers; and
forming a source/drain epitaxial layer in the source/drain space, wherein:
the first semiconductor layers are made of SiGe, and
a Ge concentration of the first semiconductor layers decreases from a top one to a bottom one of the first semiconductor layers, wherein the bottom one is closer to the substrate than the top one.
15. The method of claim 14 , wherein in at least one of the first semiconductor layers, a Ge concentration changes, within the at least one of the first semiconductor layers, along a stacked direction of the first semiconductor layers and second semiconductor layers.
16. The method of claim 15 , wherein at least one of the first semiconductor layers has a constant Ge concentration.
17. The method of claim 15 , wherein in the at least one of the first semiconductor layers, the Ge concentration at a center region is smaller than a Ge concentration at edge regions along a stack direction.
18. The method of claim 17 , wherein the Ge concentration has two peaks along the stacked direction.
19. The method of claim 14 , wherein the first semiconductor layers are laterally etched by wet etching comprising repeating wet etchings using a mixed solution of H 2 O 2 , CH 3 COOH and HF, followed by a H 2 O cleaning.
20. The method of claim 14 , wherein a width of a bottom one of the inner spacers is greater than a top one of the inner spacers.