Electronic device including clad components
A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
1. A housing for an electronic device, comprising:
an exterior titanium portion;
an interior aluminum joined to the exterior titanium portion; and
an intermetallic interface disposed between the exterior titanium portion and the interior aluminum, the intermetallic interface having a thickness disposed between the interior metal and the exterior titanium portion.
2. The housing of claim 1 , wherein the intermetallic interface has a thickness of less than 1 μm.
3. The housing of claim 1 , wherein the intermetallic interface has a thickness of less than 200 nm.
4. The housing of claim 1 , wherein the intermetallic interface comprises a high magnesium phase.
5. The housing of claim 1 , wherein the intermetallic interface is free of discrete oxide particles.
6. The housing of claim 1 , wherein:
the intermetallic interface comprises a continuous layer between the interior metal and the exterior titanium portion; and
the intermetallic interface separates the interior metal from the exterior titanium portion.
7. The housing of claim 1 , wherein:
the intermetallic interface comprises a discontinuous layer between the interior metal and the exterior titanium portion; and
the interior metal contacts the exterior titanium portion.
8. A housing for an electronic device, comprising:
an exterior titanium portion at least partially defining a first engagement feature; and
an interior aluminum portion joined to the exterior titanium portion, the interior aluminum portion at least partially defining an engagement surface having engagement features; and
a non-metallic portion engaging the engagement features to join the non-metallic portion to the interior aluminum portion.
9. The housing of claim 8 , wherein the non-metallic portion comprises plastic.
10. The housing of claim 8 , wherein the engagement features comprise a plurality of pores of an oxide layer.
11. The housing of claim 10 , wherein:
a density of the plurality of pores is between approximately 30% and 65%; and
an average pore depth of the plurality of pores is between 25 μm and 50 μm.
12. The housing of claim 8 , further comprising an intermetallic compound disposed between the exterior titanium portion and the interior aluminum portion, the intermetallic compound comprising Al 3 Ti.
13. The housing of claim 8 , wherein the engagement features comprises a plurality of etched features on the engagement surface of the interior aluminum portion.
14. The housing of claim 8 , further comprising an intermetallic compound between the exterior titanium portion and the interior aluminum portion including a mechanical surface interlocking structure between the exterior titanium portion and the interior aluminum portion.
15. The housing of claim 14 , wherein the intermetallic compound comprises a high magnesium phase.
16. A housing for a portable electronic device, comprising:
a clad sidewall portion at least partially defining an internal volume and an external surface of the portable electronic device, the clad sidewall portion comprising:
a titanium outer portion, the titanium outer portion at least partially defining an engagement surface;
an aluminum inner portion bonded to the titanium outer portion, the aluminum inner portion at least partially defining the engagement surface;
wherein the engagement surface includes at least one of a plurality of pores or a plurality of etches engagement features; and
a non-metallic portion engaging at least one of the plurality of pores of the plurality of etched engagement features to couple the non-metallic portion to the clad sidewall.
17. The housing of claim 16 , wherein the non-metallic portion comprises a moldable material at least partially disposed in at least one of the plurality of pores or the etched engagement features.
18. The housing of claim 16 , wherein the non-metallic portion comprises a polymer.
19. The housing of claim 18 , wherein the polymer comprises resin.
20. The housing of claim 16 , wherein the non-metallic portion is coupled to the engagement surface via a mechanical surface interlocking structure.