Electronic device including clad components
A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.
1 . A housing for an electronic device, comprising:
an exterior titanium portion;
an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion; and
an intermetallic compound layer having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion;
wherein the intermetallic compound layer is free of discrete oxide particles.
2 . The housing of claim 1 , wherein the intermetallic compound layer has a thickness of less than 200 nm.
3 . The housing of claim 1 , wherein the interior metal comprises aluminum.
4 . The housing of claim 1 , wherein the intermetallic compound layer comprises Al 3 Ti.
5 . The housing of claim 1 , wherein:
the intermetallic compound layer comprises a continuous layer between the interior metal and the exterior titanium portion; and
the intermetallic compound layer separates the interior metal from the exterior titanium portion.
6 . The housing of claim 1 , wherein:
the intermetallic compound layer comprises a discontinuous layer between the interior metal and the exterior titanium portion; and
the interior metal contacts the exterior titanium portion.
7 . A housing for an electronic device, comprising:
an exterior titanium portion at least partially defining a first engagement feature; and
an interior aluminum portion joined to the exterior titanium portion, the interior aluminum portion at least partially defining the first engagement feature, wherein:
a first surface of the exterior titanium portion defining the first engagement feature comprises a first plurality of pores, the first plurality of pores having a first pore density and a first average pore depth; and
a second surface of the interior aluminum portion defining the first engagement feature comprises a second plurality of pores, the second plurality of pores having a second pore density and a second average pore depth.
8 . The housing of claim 7 , wherein:
the first pore density is between approximately 8% and 45%;
the first average pore depth is between 50 μm and 110 μm.
9 . The housing of claim 8 , wherein:
the second pore density is between approximately 30% and 65%; and
the second average pore depth is between 25 μm and 50 μm.
10 . The housing of claim 7 , further comprising an intermetallic compound disposed between the exterior titanium portion and the interior aluminum portion, the intermetallic compound comprising Al 3 Ti.
11 . The housing of claim 10 , wherein:
the intermetallic compound comprises a first layer, and a second layer different from the first layer; and
the intermetallic compound has a thickness of less than 500 nm.
12 . The housing of claim 10 , wherein the intermetallic compound comprises a continuous layer having a thickness of less than 200 nm.
13 . The housing of claim 10 , wherein the intermetallic compound comprises a discontinuous layer having a thickness of less than 150 nm.
14 . The housing of claim 10 , wherein the intermetallic compound is free from discrete oxide particles.
15 . A housing for a portable electronic device, comprising:
a titanium clad sidewall portion at least partially defining an internal volume and an external surface of the portable electronic device, the titanium clad sidewall portion comprising:
a metal outer portion comprising a first material having a first set of material properties, the metal outer portion at least partially defining a first engagement feature;
an inner portion bonded to the metal outer portion, the inner portion comprising a second material having a second set of material properties independent of the first set of material properties, the inner portion at least partially defining the first engagement feature;
wherein a surface of the metal outer portion defining the first engagement feature has a pore density from approximately 8% to 45%, pore depths from 50 μm to 110 μm, and pore diameters from 50 μm to 110 μm.
16 . The housing of claim 15 , further comprising a moldable material mechanically engaging the first engagement feature, wherein the moldable material is at least partially disposed in pores in the surface of the metal outer portion.
17 . The housing of claim 15 , wherein:
the metal outer portion comprises titanium;
the inner portion comprises aluminum;
the titanium clad sidewall portion further comprises an intermetallic compound disposed between the metal outer portion and the inner portion; and
the intermetallic compound comprises a continuous layer having a thickness of less than 200 nm.
18 . The housing of claim 15 , wherein:
the metal outer portion comprises titanium;
the inner portion comprises aluminum;
the titanium clad sidewall portion further comprises an intermetallic compound disposed between the metal outer portion and the inner portion; and
the intermetallic compound comprises a discontinuous layer having a thickness of less than 150 nm.
19 . The housing of claim 15 , wherein:
the metal outer portion comprises titanium;
the first engagement feature defines a coarse pore having a diameter between about 20 μm to about 500 μm and a depth between about 10 μm to about 60 μm; and
the first engagement feature further defines a fine pore within the coarse pore having a pore diameter between about 50 nm to about 2000 nm and a depth between about 50 nm to about 100 nm.