Additively manufactured device enclosures
A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.
1. A housing for an electronic device, comprising:
a first housing portion, comprising:
a first substrate comprising a first metal and at least partially defining an exterior surface of the housing; and
a first additively manufactured portion bonded to the first substrate, the first additively manufactured portion comprising a second metal and defining a first engagement structure;
a second housing portion, comprising:
a second substrate comprising a third metal and at least partially defining the exterior surface; and
a second additively manufactured portion bonded to the second substrate, the second additively manufactured portion comprising a fourth metal and defining a second engagement structure; and
a material engaging the first substrate, the first engagement structure, the second substrate, and the second engagement structure.
2. The housing of claim 1 , wherein the first metal is different from the second metal.
3. The housing of claim 1 , wherein at least one of the first metal and the second metal comprises at least one of steel or titanium.
4. The housing of claim 3 , wherein the second metal comprises at least one of steel, aluminum, or copper.
5. The housing of claim 1 , wherein:
the first substrate has a first density;
the second substrate has a second density;
the first additively manufactured portion has a third density that is lower than the first density; and
the second additively manufactured portion has a fourth density that is lower than the second density.
6. The housing of claim 1 , wherein at least one of the first engagement structure or the second engagement structure comprises a gyroid structure.
7. The housing of claim 1 , wherein at least one of the first engagement structure or the second engagement structure defines an array of fluidically interconnected voids.
8. The housing of claim 1 , wherein the material comprises a polymer.
9. A component for an electronic device, comprising:
a pre-formed substrate comprising a first metal; and
an additively manufactured portion bonded to the pre-formed substrate, the additively manufactured portion comprising:
a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property; and
a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value;
wherein the first portion at least partially surrounds the second portion.
10. The component of claim 9 , wherein the material property comprises density and the second value is lower than the first value.
11. The component of claim 9 , wherein the material property comprises thermal conductivity and the second value is higher than the first value.
12. The component of claim 9 , wherein the second portion comprises an electronic component.
13. The component of claim 9 , wherein the second portion comprises a self-healing material.
14. The component of claim 9 , wherein the first metal is different from the second metal.
15. The component of claim 9 , wherein the pre-formed substrate defines a cosmetic exterior surface of the electronic device.
16. The component of claim 9 , wherein the additively manufactured portion is diffusion bonded to the pre-formed substrate.