IP Library › Granted Patent US 12,152,310
Granted Patent B2
US 12,152,310 · App. 16/978,733 · Granted Nov 26, 2024

Nickel-free sealing of anodized metal substrates

Inventors: Kuan-Ting Wu (Taipei, TW); Ya-Ting Yeh (Taipei, TW); Chih-Hsiung Liao (Taipei, TW)
Assignee: Hewlett-Packard Development Company, L.P.
C25D11/246C09D5/002C09D7/20C09D183/04C25D11/18C25D11/243C25D11/26C25D11/30C25D11/34H05K5/04
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Quick Facts
Patent No.
US 12,152,310
App. No.
16/978,733
Granted
Nov 26, 2024
Kind
B2
Abstract

The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.

Claims (22)

1. A sealed metal substrate, comprising:

an anodized metal substrate dyed with a coloring agent to impart color to the anodized metal substrate, the anodized metal substrate having surface pores;

a first sealing material consisting of a Nickel-free (Ni-free) amide disposed over the anodized metal substrate to seal the surface pores of the anodized metal substrate, wherein the Ni-free amide is formed from a combination of i) one of acetic acid, propionic acid, butanoic acid, and pentanoic acid and ii) one of ammonia, methylamine, ethylamine, and propylamine; and

a second sealing material disposed over the first sealing material.

2. The sealed metal substrate as claimed in claim 1 , wherein the second sealing material is a combination of tetraethoxysilane (Si(OC 2 H 5 ) 4 ) and a long chain silane polymer solution.

3. The sealed metal substrate as claimed in claim 2 , wherein the long chain silane polymer solution comprises about 0.1 percent to 5 percent silane polymers in alcohol and water co-solvent.

4. A device, comprising:

a housing, wherein the housing comprises:

an anodized metal substrate dyed with a coloring agent to impart color to the anodized metal substrate, the anodized metal substrate having surface pores;

a first sealing material consisting of a Nickel-free (Ni-free) amide disposed over the anodized metal substrate to seal the surface pores of the anodized metal substrate, wherein the Ni-free amide is formed from a combination of i) one of acetic acid, propionic acid, butanoic acid, and pentanoic acid and ii) one of ammonia, methylamine, ethylamine, and propylamine; and

a second sealing material disposed over the first sealing material.

5. The device as claimed in claim 4 , wherein the second sealing material is a combination of tetraethoxysilane (Si(OC 2 H 5 ) 4 ) and a long chain silane polymer solution.

6. The device as claimed in claim 5 , wherein the long chain silane polymer solution comprises about 0.1 percent to 5 percent of silane polymers in an alcohol and water co-solvent.

7. A method, comprising:

combining i) one of acetic acid, propionic acid, butanoic acid, and pentanoic acid with ii) one of ammonia, methylamine, ethylamine, and propylamine to form a first sealing material consisting of a Nickel-free (Ni-free) amide;

dying an anodized metal substrate with a coloring agent to impart color to the anodized metal substrate, wherein the anodized metal substrate has a surface including surface pores;

disposing the first sealing material over the surface of the anodized metal substrate to seal the surface pores of the anodized metal substrate;

disposing a second sealing material atop the first sealing material to sandwich the first sealing material between the surface of the anodized metal substrate and the second sealing material to form a sealed metal substrate.

8. The method as claimed in claim 7 , further comprising combining tetraethoxysilane (Si(OC 2 H 5 ) 4 ) and a long chain silane polymer solution to form the second sealing material.

9. The method as claimed in claim 8 , wherein the long chain silane polymer solution comprises about 0.1 percent to 5 percent of silane polymers in an alcohol and water co-solvent.

10. The method as claimed in claim 7 , further comprising baking the anodized metal substrate to a temperature of about 50° centigrade to 100° centigrade for a duration of about 15 minutes to 60 minutes.

11. The method as claimed in claim 7 , further comprising dying the anodized metal substrate with the coloring agent prior to the disposing of the first sealing material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2020
From: WU, KUAN-TING; YEH, YA-TING; LIAO, CHIH-HSIUNG
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 053702/0927 →
Continuity (1)
Related Publication 20210363654A1 · Nov 25, 2021