Piezoelectric device and method of manufacturing the same

1. A piezoelectric device comprising:

a first electrode layer;

a second electrode layer; and

a piezoelectric layer provided between the first electrode layer and the second electrode layer,

wherein the piezoelectric layer comprises a first piezoelectric film over a first surface of a substrate and a second piezoelectric film over the first piezoelectric film, the first piezoelectric film and the second piezoelectric film have a wurtzite crystal structure and have ZnO as a main component, to which one or more elements is/are added,

wherein a haze value is 3% or less, and transmittance with respect to light having a wavelength of 380 nm is 50% or more, and

wherein Si is added to the first piezoelectric film.

2. The piezoelectric device as claimed in claim 1 , wherein the piezoelectric layer further comprises an element selected from a group consisting of Mg, Ca, Ti, Zr, Sr, V, Li, or a mixture thereof, as a subcomponent added to the main component.

3. The piezoelectric device as claimed in claim 1 , wherein said one or more elements is Mg, and an amount of Mg with respect to a total amount of Zn and Mg is 5 atom % to 30 atom %.

4. The piezoelectric device as claimed in claim 1 , wherein said one or more elements is Si, and an amount of Si with respect to a total amount of Zn and Si is 3 atom % to 10 atom %.

5. The piezoelectric device as claimed in claim 1 ,

wherein the Si is present in the first piezoelectric film in an amount of 3 atom % to 10 atom % with respect to a total of Zn and Si, and

wherein Mg is present in the second piezoelectric film in an amount of 5 atom % to 30 atom % with respect to a total of Zn and Mg.

6. The piezoelectric device as claimed in claim 5 , wherein a thickness of the first piezoelectric film is 20 nm to 100 nm.

7. The piezoelectric device as claimed in claim 5 , wherein a thickness of the first piezoelectric film is 1/10 to ½ of a thickness of the second piezoelectric film.

8. The piezoelectric device as claimed in claim 1 , further comprising:

an amorphous orientation control layer provided under the piezoelectric layer.

9. The piezoelectric device as claimed in claim 1 , wherein the piezoelectric device is formed on a plastic substrate or a thin glass.

10. A method of manufacturing a piezoelectric device; the method comprising:

forming a first piezoelectric film by sputtering onto a surface of a first electrode, the first piezoelectric film including a wurtzite crystal material as a main component, and a first subcomponent added to the main component;

forming a second piezoelectric film by sputtering onto the first piezoelectric film in a stacking direction to fabricate a piezoelectric layer that includes the first piezoelectric film and the second piezoelectric film, the second piezoelectric film including the wurtzite crystal material as the main component, and a second subcomponent; and

providing a second electrode on the piezoelectric layer,

wherein the main component is ZnO, the first subcomponent is Si, and the second subcomponent is Mg, and

wherein an amount of Si with respect to a total amount of Zn and Si in the first piezoelectric film is 3 atom % to 10 atom %, and an amount of Mg with respect to a total amount of Zn and Mg in the second piezoelectric film is 5 atom % to 30 atom %.

11. The method as claimed in claim 10 , further comprising:

forming an amorphous orientation control layer as an underlying layer of the piezoelectric layer.