IP Library › Granted Patent US 12,159,966
Granted Patent B2
US 12,159,966 · App. 18/200,400 · Granted Dec 3, 2024

Light emitting device for display and led display apparatus having the same

Inventors: Jong Min Jang (Ansan-si, KR); Chang Yeon Kim (Ansan-si, KR)
Assignee: Seoul Viosys Co., Ltd.
H01L33/62H01L25/0753H01L25/0756H01L33/0008H01L33/24H01L33/56
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Quick Facts
Patent No.
US 12,159,966
App. No.
18/200,400
Granted
Dec 3, 2024
Kind
B2
Abstract

A light emitting device including a first light emitter, a second light emitter, and a third light emitter, each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer. An adhesive layer includes a first adhesive portion disposed between the first light emitter, and the second light emitter, and a second adhesive portion disposed between the second light emitter and the third light emitter, in which the second light emitter is disposed between the first light emitter and the third light emitter, and the first adhesive portion and the second adhesive portion are optically transmitting and connect adjacent light emitters.

Claims (45)

1. A display light emitting apparatus, comprising:

a circuit board;

a set of light emitters that includes a first light emitter, a second light emitter, and a third light emitter disposed on the circuit board, each light emitter including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer;

an adhesive layer including a first adhesive region disposed between the first light emitter and the second light emitter and a second adhesive region disposed between the second light emitter and the third light emitter; and

a mold surrounding the set of light emitters;

wherein:

the mold is laterally spaced apart from the set of light emitters;

each of the light emitters includes an irregularity region that is formed on a surface that corresponds to the light emitter;

the second light emitter is disposed between the first light emitter and the third light emitter; and

the first adhesive region and the second adhesive region are optically transmitting and connect adjacent light emitters.

2. The light emitting apparatus of claim 1 , wherein the first, second, and third light emitters are configured to emit red light, blue light, and green light, respectively.

3. The light emitting apparatus of claim 1 , further comprising at least one electrode disposed on the circuit board, wherein the at least one electrode is commonly electrically connected to the first, second, and third light emitters.

4. The light emitting apparatus of claim 1 , wherein a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the first light emitter is different from a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the second light emitter, and wherein the second adhesive region includes layers of two different light emitters that have a same conductivity type.

5. The light emitting apparatus of claim 1 , wherein the first light emitter includes a contact electrode comprising a germanium material.

6. The light emitting apparatus of claim 1 , wherein the first, second, and third light emitters are configured to be operated independently.

7. A light emitting apparatus, comprising:

a circuit board;

a set of light emitters that includes a first light emitter, a second light emitter, and a third light emitter disposed on the circuit board, each light emitter including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer;

an adhesive layer including a first adhesive region disposed between the first light emitter and the second light emitter and a second adhesive region disposed between the second light emitter and the third light emitter; and

a mold surrounding the set of light emitters;

wherein:

the mold is laterally spaced apart from the set of light emitters;

the first light emitter includes an irregularity region formed on a surface of the first light emitter;

the second light emitter is disposed between the first light emitter and the third light emitter; and

the first adhesive region and the second adhesive region are optically transmitting and connect adjacent light emitters.

8. The light emitting apparatus of claim 7 , wherein the first light emitter includes at least one of: AlGaAs, AlGaInP, and GaP.

9. The light emitting apparatus of claim 7 , wherein a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the first light emitter is different from a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the second light emitter, and wherein the second adhesive region includes layers of two different light emitters that have a same conductivity type.

10. The light emitting apparatus of claim 7 , wherein the first light emitter includes a contact electrode comprising a germanium material.

11. The light emitting apparatus of claim 7 , wherein the first, second, and third light emitters are configured to be operated independently.

12. The light emitting apparatus of claim 7 , further comprising at least one electrode disposed on the circuit board, wherein the at least one electrode is commonly electrically connected to the first, second, and third light emitters.

13. A light emitting apparatus, comprising:

a circuit board;

a set of light emitters that includes a first light emitter, a second light emitter, and a third light emitter disposed on the circuit board, each light emitter including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer;

an adhesive layer including a first adhesive region disposed between the first light emitter and the second light emitter and a second adhesive region disposed between the second light emitter and the third light emitter; and

a molding layer surrounding the first, second, and third light emitters;

wherein:

the molding layer is laterally spaced apart from the set of light emitters;

the second and third light emitters have an irregularity region that is formed on surfaces that correspond to the second and third light emitters;

the second light emitter is disposed between the first light emitter and the third light emitter; and

the first adhesive portion and the second adhesive region are optically transmitting and connect adjacent light emitters.

14. The light emitting apparatus of claim 13 , wherein the first light emitter includes at least one of: AlGaAs, AlGaInP, and GaP.

15. The light emitting apparatus of claim 13 , wherein a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the first light emitter is different from a sequence of the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the second light emitter, and wherein the second adhesive region includes layers of two different light emitters that have a same conductivity type.

16. The light emitting apparatus of claim 13 , wherein the first light emitter includes a contact electrode comprising a germanium material.

17. The light emitting apparatus of claim 13 , wherein the first, second, and third light emitters are configured to be operated independently.

18. The light emitting apparatus of claim 13 , further comprising at least one electrode disposed on the circuit board, wherein the at least one electrode is commonly electrically connected to the first, second, and third light emitters.

Continuity (3)
Continuation 17076750 · Oct 21, 2020
Provisional Application 62926590 · Oct 28, 2019
Related Publication 20230378412A1 · Nov 23, 2023
Cited By (1)
US 12,713,743