Antenna assembly and electronic device including same

1. An antenna assembly comprising:

a first flexible printed circuit board (FPCB) for multiple first antennas;

a second flexible printed circuit board (FPCB) for multiple second antennas;

a metal plate including multiple holes;

a first adhesive material layer for bonding between the metal plate and the first FPCB; and

a second adhesive material layer for bonding between the metal plate and the second FPCB,

wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas are located in the multiple holes, respectively.

2. The antenna assembly of claim 1 ,

wherein the first adhesive material layer comprises multiple first holes equal to a number of the multiple holes of the metal plate, and

wherein the second adhesive material layer comprises multiple second holes equal to the number of the multiple holes of the metal plate.

3. The antenna assembly of claim 2 ,

wherein the first adhesive material layer is disposed such that the multiple first antennas are respectively located in the first multiple holes with reference to the first adhesive material layer, and

wherein the second adhesive material layer is disposed such that the multiple second antennas are respectively located in the second multiple holes with reference to the second adhesive material layer.

4. The antenna assembly of claim 1 , wherein the first FPCB and the second FPCB comprise one or more air-vent holes for discharging air.

5. The antenna assembly of claim 4 , wherein the one or more air-vent holes are formed in an area of one surface of the second FPCB excluding an area in which the multiple second antennas are arranged and an area bonded to the second adhesive material layer.

6. The antenna assembly of claim 1 , wherein a first surface of the second FPCB, on which the multiple second antennas are arranged, is disposed to face a first surface of the first FPCB, on which the multiple first antennas are arranged.

7. The antenna assembly of claim 1 , wherein a thickness of the first adhesive material layer is thinner than a thickness of each of the multiple first antennas.

8. The antenna assembly of claim 1 , wherein the antenna assembly does not comprise a cover layer for each of the multiple first antennas and the multiple second antennas.

9. The antenna assembly of claim 1 , further comprising:

a third adhesive material layer to be bonded to a printed circuit board (PCB) of a radio unit (RU),

wherein the third adhesive material layer is bonded to a second surface of the first FPCB opposite to a first surface of the first FPCB, on which the first multiple antennas are arranged.

10. The antenna assembly of claim 9 , wherein the third adhesive material layer is configured to:

maintain adhesion in a first temperature range; and

lose adhesion in a second temperature range not overlapping the first temperature range.

11. A radio unit (RU) module comprising:

a printed circuit board (PCB); and

multiple antenna assemblies,

wherein an antenna assembly of the multiple antenna assemblies comprises:

a first flexible printed circuit board (FPCB) for multiple first antennas,

a second flexible printed circuit board (FPCB) for multiple second antennas,

a metal plate including multiple holes,

a first adhesive material layer for bonding between the metal plate and the first FPCB, and

a second adhesive material layer for bonding between the metal plate and the second FPCB, and

wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas are located in the multiple holes, respectively.

12. The RU module of claim 11 ,

wherein the first adhesive material layer comprises multiple first holes equal to a number of the multiple holes of the metal plate, and

wherein the second adhesive material layer comprises multiple second holes equal to the number of the multiple holes of the metal plate.

13. The RU module of claim 12 ,

wherein the first adhesive material layer is disposed such that the multiple first antennas are respectively located in the first multiple holes with reference to the first adhesive material layer, and

wherein the second adhesive material layer is disposed such that the multiple second antennas are respectively located in the second multiple holes with reference to the second adhesive material layer.

14. The RU module of claim 11 , wherein the first FPCB and the second FPCB comprise one or more air-vent holes for discharging air.

15. The RU module of claim 14 , wherein the one or more air-vent holes are formed in an area of one surface of the second FPCB excluding an area in which the multiple second antennas are arranged, and an area bonded to the second adhesive material layer.

16. The RU module of claim 11 , wherein a first surface of the second FPCB, on which the multiple second antennas are arranged, is disposed to face a first surface of the first FPCB, on which the multiple first antennas are arranged.

17. The RU module of claim 11 , further comprising:

multiple array antennas.

18. The RU module of claim 17 , wherein the multiple array antennas are arranged on one side of the RU module.

19. The RU module of claim 17 , wherein at least one of the multiple array antennas includes a plurality of sub arrays.

20. The RU module of claim 11 ,

wherein the first FPCB includes a first radiator, and

wherein the second FPCB includes a second radiator.