IP Library › Granted Patent US 12,160,978
Granted Patent B2
US 12,160,978 · App. 17/985,161 · Granted Dec 3, 2024

Liquid immersion cooling apparatus

Inventors: Xue-Feng Chen (Shanghai, CN); Pin-Yi Xiang (Shanghai, CN); Ke Sun (Shanghai, CN)
Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION; INVENTEC CORPORATION
H05K7/203H05K7/20327H05K7/20381
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Quick Facts
Patent No.
US 12,160,978
App. No.
17/985,161
Granted
Dec 3, 2024
Kind
B2
Abstract

A liquid immersion cooling apparatus includes a box, a cover and a refrigeration device. The cover and the box form a closed space. The closed space includes a liquid storage space configured to accommodate a first coolant and at least one heat generating device and a gas storage space. The refrigeration device is located in the gas storage space. The refrigeration device includes a coiled tube, a liquid-cooled heat exchanger, and a cooling chip. The liquid-cooled heat exchanger is connected to the coiled tube to form a first circulation channel. The first circulation channel is configured to accommodate a second coolant. The cooling chip includes a hot end and a cold end, the cold end is thermally coupled to the liquid-cooled heat exchanger.

Claims (16)

1. A liquid immersion cooling apparatus configured to store a first coolant and dissipate heat from a heat generating device through the first coolant, the liquid immersion cooling apparatus comprising:

a box;

a cover, the cover and the box cooperatively forming a closed space, the closed space comprising a liquid storage space configured to accommodate the first coolant and the heat generating device and a gas storage space; and

a refrigeration device located in the gas storage space and comprising:

a coiled tube;

a first liquid-cooled heat exchanger connected to the coiled tube to form a first circulation channel configured to accommodate a second coolant; and

a cooling chip comprising a hot end and a cold end, wherein the cold end is thermally coupled to the first liquid-cooled heat exchanger.

2. The liquid immersion cooling apparatus according to claim 1 , further comprises a transparent window located on the box or on the cover, wherein the coiled tube is located on a side of the transparent window.

3. The liquid immersion cooling apparatus according to claim 1 , wherein the refrigeration device comprises a first pump connected to the coiled tube and configured to drive the second coolant to circulate in the first circulation channel.

4. The liquid immersion cooling apparatus according to claim 3 , further comprising a heat dissipation device comprising a second liquid-cooled heat exchanger and a cooling pipe, wherein the hot end of the cooling chip is thermally coupled to the second liquid-cooled heat exchanger, and the second liquid-cooled heat exchanger, the cooling pipe, and the box are connected to form a second circulation channel configured to accommodate the first coolant.

5. The liquid immersion cooling apparatus according to claim 4 , wherein the heat dissipation device comprises a second pump connected to the cooling pipe and configured to drive the first coolant to circulate in the second circulation channel.

6. The liquid immersion cooling apparatus according to claim 1 , wherein the refrigeration device comprises a temperature control device, the temperature control device comprises a temperature sensor and a temperature control device, the temperature sensor is thermally coupled to the cooling chip and configured to sense a current temperature of the cooling chip, the temperature control device is electrically connected to the cooling chip and configured to control a temperature of the cooling chip according to the current temperature of the cooling chip sensed by the temperature sensor.

7. The liquid immersion cooling apparatus according to claim 1 , further comprises a fan located in the gas storage space, wherein the fan is configured to generate a disturbing air flow that drives a gas in the gas storage space to circulate.

8. The liquid immersion cooling apparatus according to claim 1 , wherein the refrigeration device comprises a circuit electrically connected to the cooling chip and configured to supply power to the cooling chip.

9. The liquid immersion cooling apparatus according to claim 4 , wherein the first coolant is fluorinated or water.

10. The liquid immersion cooling apparatus according to claim 1 , wherein the second coolant is fluorinated or water.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2022
From: CHEN, XUE-FENG; XIANG, PIN-YI; SUN, KE
To: INVENTEC (PUDONG) TECHNOLOGY CORPORATION; INVENTEC CORPORATION
Reel/Frame 061931/0005 →
Priority Claims (1)
CN 202211116952.0 · Sep 14, 2022 · national
Continuity (1)
Related Publication 20240090170A1 · Mar 14, 2024