Chip inductor
The present technology provides a chip inductor of which the height can be reduced. The chip inductor includes a sealing resin having a mounting face; a coil conductor disposed in the sealing resin, including an inner end and an outer end, and spirally wound; an inner terminal disposed on the mounting face, and electrically connected to the inner end; and an outer terminal disposed on the mounting face and electrically connected to the outer end.
1. A chip inductor, comprising:
a sealing resin having a mounting face, wherein
the sealing resin has a resin laminated structure including a plurality of resin layers,
the plurality of resin layers comprises a supporting resin layer, a resin wiring layer, and a resin protective layer, and
the resin wiring layer is between the supporting resin layer and the resin protective layer;
a coil conductor disposed in the sealing resin, wherein
the coil conductor includes an inner end and an outer end,
the coil conductor is a single continuous coil which is spirally wound on a first face of the supporting resin layer,
the coil conductor has a laminated structure including a main electrode layer and a barrier electrode layer, and the barrier electrode layer is between the main electrode layer and the resin wiring layer,
the resin wiring layer has a first face and a second face,
the second face of the resin wiring layer is integrated with the first face of the supporting resin layer,
the first face of the resin wiring layer is opposite to the second face of the resin wiring layer,
the barrier electrode layer includes a covering portion which covers an end portion on a side of the first face of the resin wiring layer in the main electrode layer;
an inner terminal disposed on the mounting face, and electrically connected to the inner end; and
an outer terminal disposed on the mounting face, and electrically connected to the outer end, wherein
the resin wiring layer has a coil trench which penetrates the resin wiring layer to embed the coil conductor in the resin wiring layer, and
the supporting resin layer comprises an inner contact hole to expose the inner end of the coil conductor to the inner terminal, and an outer contact hole to expose the outer end of the coil conductor to the outer terminal.
2. The chip inductor according claim 1 , further comprising:
an inner contact electrode disposed in the sealing resin, and electrically connecting the inner end with the inner terminal; and
an outer contact electrode disposed in the sealing resin, and electrically connecting the outer end with the outer terminal.
3. The chip inductor according to claim 1 , wherein
the inner terminal is opposite to the inner end of the coil conductor through a first part of the sealing resin interposed therebetween, and
the outer terminal is opposite to the outer end of the coil conductor through a second part of the sealing resin interposed therebetween.
4. The chip inductor according to claim 1 , wherein the coil conductor is wound around a winding axis line extending along a normal direction of the mounting face.
5. The chip inductor according to claim 1 , wherein
the sealing resin has a non-mounting face opposite to the mounting face, and
a distance between the mounting face and the coil conductor is equal to or longer than a distance between the non-mounting face and the coil conductor.
6. The chip inductor according to claim 1 , wherein the plurality of resin layers are laminated along a normal direction of the mounting face.
7. The chip inductor according to claim 6 , wherein each of the plurality of resin layers has a flat face extending along the mounting face.
8. The chip inductor according to claim 1 , wherein the sealing resin is formed in a shape of a rectangular parallelepiped chip.
9. The chip inductor according to claim 1 , wherein the sealing resin includes a photosensitive resin.
10. A chip inductor, comprising:
a resin layer having a first face on one side and a second face on an other side, the second face being a mounting face;
a resin protective layer on the resin layer;
a resin wiring layer between the resin layer and the resin protective layer;
a coil conductor including an inner end and an outer end, wherein
the coil conductor is a single continuous coil which is spirally wound on the first face of the resin layer,
the coil conductor has a laminated structure including a main electrode layer and a barrier electrode layer, and
the barrier electrode layer is between the main electrode layer and the resin wiring layer,
the resin wiring layer has a first face and a second face,
the second face of the resin wiring layer is integrated with the first face of the resin layer,
the first face of the resin wiring layer is opposite to the second face of the resin wiring layer,
the barrier electrode layer includes a covering portion which covers an end portion on a side of the first face of the resin wiring layer in the main electrode layer;
an inner terminal disposed on the second face of the resin layer, and electrically connected to the inner end; and
an outer terminal disposed on the second face of the resin layer, and electrically connected to the outer end, wherein
the resin wiring layer has a coil trench which penetrates the resin wiring layer to embed the coil conductor in the resin wiring layer, and
the resin layer comprises an inner contact hole to expose the inner end of the coil conductor to the inner terminal, and an outer contact hole to expose the outer end of the coil conductor to the outer terminal.
11. The chip inductor according to claim 10 , further comprising:
an inner contact electrode penetrating the resin layer, and electrically connecting the inner end of the coil conductor with the inner terminal; and
an outer contact electrode penetrating the resin layer, and electrically connecting the outer end of the coil conductor with the outer terminal.
12. The chip inductor according to claim 10 , wherein
the inner terminal is opposite to the inner end of the coil conductor through the resin layer interposed therebetween, and
the outer terminal is opposite to the outer end of the coil conductor through the resin layer interposed therebetween.
13. The chip inductor according to claim 10 , wherein the resin protective layer covers the coil conductor.
14. The chip inductor according to claim 10 , wherein the resin layer includes a photosensitive resin.
15. A chip inductor, comprising:
a sealing resin having a mounting face and made of a photosensitive resin, wherein
the sealing resin has a resin laminated structure including a plurality of resin layers,
the plurality of resin layers comprises a supporting resin layer, a resin wiring layer, and a resin protective layer, and
the resin wiring layer is between the supporting resin layer and the resin protective layer;
a coil conductor sealed with the sealing resin so as to be in contact with the sealing resin, wherein
the coil conductor includes an inner end and an outer end,
the coil conductor is a single continuous coil which is spirally wound on a first face of the supporting resin layer,
the coil conductor has a laminated structure including a main electrode layer and a barrier electrode layer, and
the barrier electrode layer is between the main electrode layer and the resin wiring layer,
the resin wiring layer has a first face and a second face,
the second face of the resin wiring layer is integrated with the first face of the supporting resin layer,
the first face of the resin wiring layer is opposite to the second face of the resin wiring layer,
the barrier electrode layer includes a covering portion which covers an end portion on a side of the first face of the resin wiring layer in the main electrode layer;
an inner terminal disposed on the mounting face, and electrically connected to the inner end; and
an outer terminal disposed on the mounting face, and electrically connected to the outer end, wherein
the resin wiring layer has a coil trench which penetrates the resin wiring layer to embed the coil conductor in the resin wiring layer, and
the supporting resin layer comprises an inner contact hole to expose the inner end of the coil conductor to the inner terminal, and an outer contact hole to expose the outer end of the coil conductor to the outer terminal.
16. The chip inductor according to claim 15 , further comprising:
an inner contact electrode sealed with the sealing resin so as to be in contact with the sealing resin, and electrically connecting the inner end with the inner terminal; and
an outer contact electrode sealed with the sealing resin so as to be in contact with the sealing resin, and electrically connecting the outer end with the outer terminal.
17. The chip inductor according to claim 15 , wherein the plurality of resin layers are laminated along a normal direction of the mounting face.
18. The chip inductor according to claim 15 , wherein
the supporting resin layer includes a first face on one side and a second face on other side,
the second face of the supporting resin layer is the mounting face,
the resin protective layer is laminated on the supporting resin layer,
the resin protective layer protects the supporting resin layer and the resin wiring layer,
the coil conductor is on the first face of the supporting resin layer so as to be interposed between the supporting resin layer and the resin protective layer,
the inner terminal is disposed on the second face of the supporting resin layer, and
the outer terminal is disposed on the second face of the supporting resin layer.
19. The chip inductor according to claim 15 , wherein
the supporting resin layer includes a first face on one side and a second face on other side,
the second face of the supporting resin layer is the mounting face,
the resin wiring layer is laminated on the supporting resin layer,
the resin protective layer is laminated on the resin wiring layer,
the resin protective layer protects the resin wiring layer,
the coil conductor is embedded in the resin wiring layer on the first face of the supporting resin layer,
the inner terminal is disposed on the second face of the supporting resin layer, and
the outer terminal is disposed on the second face of the supporting resin layer.