IP Library Granted Patent US 12,165,977
Granted Patent B2
US 12,165,977 · App. 18/003,819 · Granted Dec 10, 2024

Terahertz module

Inventors: Masayuki Fujita (Suita, JP); Daniel Jonathan Headland (Suita, JP); Tadao Nagatsuma (Suita, JP); Yosuke Nishida (Kyoto, JP)
Assignees: ROHM CO., LTD.; OSAKA UNIVERSITY
H01L23/538H01L21/76802H01L29/66219H01P3/16H04B10/572
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Quick Facts
Patent No.
US 12,165,977
App. No.
18/003,819
Granted
Dec 10, 2024
Kind
B2
Abstract

A terahertz module includes: a terahertz chip which includes an active device which emits a terahertz wave; and a dielectric substrate coupled to the terahertz chip. The terahertz chip includes a semiconductor substrate. The active device is disposed on an upper surface of the semiconductor substrate. A cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface. The terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout.

Claims (44)

1. A terahertz module, comprising

a terahertz chip which includes an active device which emits a terahertz wave;

a dielectric substrate coupled to the terahertz chip, wherein

the terahertz chip includes a semiconductor substrate and the active device is disposed on an upper surface of the semiconductor substrate,

a cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface,

the terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout, and

the terahertz chip has a thickness which is equal to a depth of the cutout.

2. The terahertz module according to claim 1 , wherein

the cutout has a surface parallel to the first side surface, and

the semiconductor substrate has a lower surface in contact with a surface of the cutout parallel to the first side surface.

3. The terahertz module according to claim 1 , wherein

the dielectric substrate is a photonic crystal.

4. The terahertz module according to claim 3 , wherein

a waveguide for the terahertz wave is formed on the photonic crystal in a direction perpendicular to the upper surface of the semiconductor substrate.

5. The terahertz module according to claim 3 , wherein

a filter for passing or filtering out a predetermined frequency component of the terahertz wave is formed on the photonic crystal.

6. The terahertz module according to claim 3 , wherein

a planar lens for collecting the terahertz wave emitted by the active device is formed on the photonic crystal.

7. The terahertz module according to claim 3 , wherein

a plurality of the terahertz chips disposed in a row are coupled to the photonic crystal.

8. The terahertz module according to claim 1 , wherein

the active device is a resonant tunneling diode.

9. A terahertz module, comprising

a terahertz chip which includes an active device which emits a terahertz wave;

a dielectric substrate coupled to the terahertz chip, wherein

the terahertz chip includes a semiconductor substrate and the active device is disposed on an upper surface of the semiconductor substrate,

a cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface, and

the terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout, and

the terahertz chip has a thickness greater than a depth of the cutout.

10. The terahertz module according to claim 9 , wherein

the cutout has a surface parallel to the first side surface, and

the semiconductor substrate has a lower surface in contact with a surface of the cutout parallel to the first side surface.

11. The terahertz module according to claim 9 , wherein

the dielectric substrate is a photonic crystal.

12. The terahertz module according to claim 11 , wherein

a waveguide for the terahertz wave is formed on the photonic crystal in a direction perpendicular to the upper surface of the semiconductor substrate.

13. The terahertz module according to claim 11 , wherein

a filter for passing or filtering out a predetermined frequency component of the terahertz wave is formed on the photonic crystal.

14. The terahertz module according to claim 11 , wherein

a planar lens for collecting the terahertz wave emitted by the active device is formed on the photonic crystal.

15. The terahertz module according to claim 11 , wherein

a plurality of the terahertz chips disposed in a row are coupled to the photonic crystal.

16. The terahertz module according to claim 9 , wherein

the active device is a resonant tunneling diode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2022
From: FUJITA, MASAYUKI; HEADLAND, DANIEL JONATHAN; NAGATSUMA, TADAO; NISHIDA, YOSUKE
To: ROHM CO., LTD.; OSAKA UNIVERSITY
Reel/Frame 062238/0618 →
Priority Claims (1)
JP 2020-123912 · Jul 20, 2020 · national
Continuity (1)
Related Publication 20230260913A1 · Aug 17, 2023