Cooling system and electronic device
A cooling system includes a first module provided with a substrate, a heat generating member, and a cooling member, a second module provided on a first side of a housing in a depth direction with respect to the first module and provided with a substrate, a heat generating member, and a cooling member, an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside, a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module, and a discharge tube configured to discharge the cooling medium passed through the first module and the second module.
1. A cooling system comprising:
a first module provided in a housing and provided with a first substrate, a first heat generating member mounted on the first substrate, and a cooling member that cools the first heat generating member;
a second module provided on a first side of the housing in a depth direction with respect to the first module in the housing and provided with a second substrate, a second heat generating member mounted on the second substrate, and a cooling member that cools the second heat generating member;
an upstream side tube configured to supply a cooling medium to the cooling member of the first module from an outside;
a downstream side tube configured to supply the cooling medium passed through the cooling member of the first module to the cooling member of the second module; and
a discharge tube configured to discharge the cooling medium passed through the first module and the second module,
wherein the discharge tube extends along the upstream side tube and the downstream side tube,
a part of the discharge tube is arranged on a side of the cooling member of the first module, and bypasses the cooling member and the first heat generating member of the first module,
the downstream side tube includes a first downstream side tube connected to the first module via a first connection joint, and a second downstream side tube connected to the second module via a second connection joint,
the first downstream side tube and the second downstream side tube are detachably connected to each other via a first joint and a second joint,
the first downstream side tube is fixed to the first substrate by a first holder member between the first connection joint and the first joint, and
the second downstream side tube is fixed to the second substrate by a second holder member between the second connection joint and the second joint.
2. The cooling system according to claim 1 , wherein the discharge tube extends from a second module side to a first module side in the depth direction of the housing along the upstream side tube and the downstream side tube.
3. The cooling system according to claim 2 , wherein the discharge tube is disposed on the side of the cooling member of the first module when viewed from a direction orthogonal to a surface of the first substrate of the first module.
4. The cooling system according to claim 1 , wherein the upstream side tube extends in the depth direction and is connected to the cooling member of the first module from a second side in the depth direction, and
the downstream side tube extends in the depth direction between the cooling member of the first module and the cooling member of the second module.
5. The cooling system according to claim 4 , wherein the discharge tube extends in the depth direction and is connected to the cooling member of the second module from a second side in the depth direction.
6. An electronic device comprising:
the housing; and
the cooling system according to claim 1 .