IP Library › Granted Patent US 12,168,738
Granted Patent B2
US 12,168,738 · App. 17/419,640 · Granted Dec 17, 2024

Adhesive resin compositions and laminates

Inventors: Akihiko Iwashita (Harrison, NY); Ryohei Shiga (Ichihara, JP); Motoyasu Yasui (Chiba, JP); Yoshisada Fukagawa (Ichihara, JP); Kyoko Kobayashi (Chiba, JP); Masahiko Okamoto (Chiba, JP)
Assignee: Mitsui Chemicals, Inc.
C09J123/12B32B7/12B32B27/08C09J123/06C09J123/18C09J151/06B32B2250/05B32B2250/24B32B2439/46B32B2439/70
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Quick Facts
Patent No.
US 12,168,738
App. No.
17/419,640
Granted
Dec 17, 2024
Kind
B2
Abstract

An adhesive resin composition including a propylene polymer (A), an ethylene polymer (B), and a thermoplastic resin (C) including a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 α-olefin other than 4-methyl-1-pentene, these structural units representing total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC). The total of the components (A), (B) and (C) includes 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).

Claims (34)

1. An adhesive resin composition comprising:

a propylene polymer (A),

an ethylene polymer (B) that is a polymer with 10 mol % or less of comonomer, and

a thermoplastic resin (C) comprising a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 α-olefin other than 4-methyl-1-pentene, the structural units derived from 4-methyl-1-pentene and the structural units derived from a C2-C20 α-olefin other than 4-methyl-1-pentene representing in total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC),

the total of the components (A), (B) and (C) taken as 100 parts by mass including 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).

2. The adhesive resin composition according to claim 1 , wherein the propylene polymer (A) contains 75 to 100 mol % of structural units derived from propylene.

3. The adhesive resin composition according to claim 1 , wherein part or all of the propylene polymer (A), the ethylene polymer (B), and the copolymer included in the thermoplastic resin (C) are graft-modified with an unsaturated carboxylic acid and/or a derivative thereof.

4. A laminate comprising:

a thermoplastic resin layer (X),

a thermoplastic resin layer (Y) comprising a polymer containing, with respect to all structural units, 90 mol % or more and 100 mol % or less of structural units derived from 4-methyl-1-pentene, and 0 mol % or more and 10 mol % or less of structural units derived from an α-olefin other than 4-methyl-1-pentene, the thermoplastic resin layer (Y) having a melting point Tm of not less than 200° C. as measured with a differential scanning calorimeter (DSC), and

an adhesive layer disposed between the thermoplastic resin layer (X) and the thermoplastic resin layer (Y) and comprising the adhesive resin composition described in claim 1 .

5. The laminate according to claim 4 , wherein the layer (X) is a layer comprising a polypropylene.

6. The laminate according to claim 4 , wherein the layer (X) is a layer comprising a resin containing an OH group or an NH group.

7. The laminate according to claim 4 , wherein the layer (X) is a layer comprising an ethylene-vinyl alcohol copolymer.

8. The laminate according to claim 4 , wherein the layer (X) is a layer comprising a resin containing a polyamide.

9. The laminate according to claim 4 , which is formed by a coextrusion cast film forming method.

10. The laminate according to claim 4 , which is formed by a blown-film coextrusion method.

11. A food packaging container or food packaging bag produced using the laminate described in claim 4 .

12. The adhesive resin composition according to claim 1 , wherein the composition further comprises a carbodiimide-modified polyolefin (D), and the total of the components (A), (B), (C) and (D) taken as 100 parts by mass includes 10 to 65 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), 15 to 45 parts by mass of the component (C), and 5 to 30 parts by mass of the component (D).

13. The adhesive resin composition according to claim 12 , which includes carbodiimide groups in an amount of 0.1 to 50 mmol per 100 g.

14. A laminate comprising:

a layer (E) comprising a resin having no active hydrogen in a main molecular skeleton,

a thermoplastic resin layer (Y) comprising a polymer containing, with respect to all structural units, 90 mol % or more and 100 mol % or less of structural units derived from 4-methyl-1-pentene, and 0 mol % or more and 10 mol % or less of structural units derived from an α-olefin other than 4-methyl-1-pentene, the thermoplastic resin layer (Y) having a melting point Tm of not less than 200° C. as measured with a differential scanning calorimeter (DSC), and

an adhesive layer disposed between the layer (E) and the thermoplastic resin layer (Y) and comprising the adhesive resin composition described in claim 12 .

15. The laminate according to claim 14 , wherein the resin having no active hydrogen in the main molecular skeleton is a polyketone.

16. The laminate according to claim 15 , wherein the polyketone is a linear polymer in which carbonyl groups, and divalent organic groups derived from an ethylenically unsaturated compound or divalent organic groups formed by linking of two or more of the organic groups are bonded alternately.

17. The laminate according to claim 15 , wherein the polyketone is an ethylene-carbon monoxide copolymer or an ethylene-propylene-carbon monoxide copolymer.

18. The laminate according to claim 14 , wherein the resin having no active hydrogen in the main molecular skeleton is a polar resin.

19. The laminate according to claim 18 , wherein the polar resin is a polycarbonate.

20. A laminate comprising:

a layer (G) comprising a resin having active hydrogen in a main molecular skeleton, the layer (G) being free from resins having no active hydrogen in a main molecular skeleton,

a thermoplastic resin layer (Y) comprising a polymer containing, with respect to all structural units, 90 mol % or more and 100 mol % or less of structural units derived from 4-methyl-1-pentene, and 0 mol % or more and 10 mol % or less of structural units derived from an α-olefin other than 4-methyl-1-pentene, the thermoplastic resin layer (Y) having a melting point Tm of not less than 200° C. as measured with a differential scanning calorimeter (DSC), and

an adhesive layer disposed between the layer (G) and the thermoplastic resin layer and comprising the adhesive resin composition described in claim 12 .

21. The laminate according to claim 20 , wherein the resin having active hydrogen in the main molecular skeleton is a modified fluororesin.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE PREVIOUSLY SUBMITTED ASSIGNMENT DOCUMENT WAS INCOMPLETE PREVIOUSLY RECORDED AT REEL: 056709 FRAME: 0273. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 11, 2021
From: IWASHITA, AKIHIKO; SHIGA, RYOHEI; YASUI, MOTOYASU; FUKAGAWA, YOSHISADA; KOBAYASHI, KYOKO; OKAMOTO, MASAHIKO
To: MITSUI CHEMICALS, INC.
Reel/Frame 057473/0821 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2021
From: IWASHITA, AKIHIKO; SHIGA, RYOHEI; YASUI, MOTOYASU; FUKAGAWA, YOSHISADA; KOBAYASHI, KYOKO; OKAMOTO, MASAHIKO
To: MITSUI CHEMICALS, INC.
Reel/Frame 056709/0273 →
Priority Claims (3)
JP 2019-000636 · Jan 7, 2019 · national
JP 2019-018512 · Feb 5, 2019 · national
JP 2019-234236 · Dec 25, 2019 · national
Continuity (1)
Related Publication 20220081598A1 · Mar 17, 2022