Semiconductor package and method of manufacturing the same
Provided is a semiconductor package including: a pad substrate on which a semiconductor chip is installed; a solder formed on the pad substrate having a length same as or longer than a side of the semiconductor chip; and an intagliated groove formed on the pad substrate having a length longer than at least the side of the semiconductor chip and filled with at least a certain amount of melted solder, wherein the solder having a thickness of at least 1 μm or above is filled in the intagliated groove to have a length of at least 3 μm or above and an intermetallic compound layer is formed on a certain area included in an inner wall of the intagliated groove. Accordingly, movement of the semiconductor chip may be restricted so that the quality of following processes may be improved, and electrical and mechanical combination between the solder and the pad substrate may be stabled.
1. A semiconductor package comprising:
a pad substrate on which a semiconductor chip is installed;
a solder formed on the pad substrate having a length same as or longer than a side of the semiconductor chip; and
an intagliated groove formed on the pad substrate having a length longer than at least the side of the semiconductor chip and filled with at least a certain amount of melted solder,
wherein the solder having a thickness of at least 1 μm or above is filled in the intagliated groove to have a length of at least 3 μm or above and an intermetallic compound layer is formed on a certain area included in an inner wall of the intagliated groove.
2. The semiconductor package of claim 1 , wherein the pad substrate comprises at least one metal layer and an uppermost metal layer is formed of any one metal comprising Cu, Ag, Au, and Ni or a metal compound containing 50% or more of any one metal comprising Cu, Ag, Au, and Ni.
3. The semiconductor package of claim 1 , wherein the pad substrate comprises at least one insulation layer and an uppermost metal layer of the insulation layer is formed of any one metal comprising Cu, Ag, Au, and Ni or a metal compound containing 50% or more of any one metal comprising Cu, Ag, Au, and Ni.
4. The semiconductor package of claim 1 , further comprising metal projections having certain heights from the surface of the pad substrate at the outer edge of the intagliated groove.
5. The semiconductor package of claim 4 , wherein at least one metal projections are formed to have a height of above 1 μm and a length of above 2 μm.
6. The semiconductor package of claim 1 , wherein the intagliated groove is laser processed to have patterns.
7. The semiconductor package of claim 1 , wherein the semiconductor chip and the pad substrate comprise a solder void interposed therebetween which is below 15% against the area of the semiconductor chip.
8. The semiconductor package of claim 1 , wherein the intagliated groove has a depth of 3 μm through 150 μm.
9. The semiconductor package of claim 1 , wherein the intagliated groove has a depth same as or smaller than a depth of the semiconductor chip.
10. The semiconductor package of claim 1 , wherein the intagliated groove has at least one tetragonal pattern having each different size or a circular or elliptical pattern separately formed or combined on the outer area of the semiconductor chip formed on the pad substrate.
11. The semiconductor package of claim 1 , wherein the intagliated groove has at least one line pattern which is longer than the side of the semiconductor chip on the outer area of the semiconductor chip formed on the pad substrate.
12. The semiconductor package of claim 1 , wherein the intermetallic compound layer on the inner wall of the intagliated groove contains Sn, Ag, or Pb.
13. The semiconductor package of claim 4 , wherein the intermetallic compound layer is formed in surrounding areas of the metal projections and contains Sn, Ag, or Pb.
14. The semiconductor package of claim 1 , wherein the intermetallic compound layer on the inner wall of the intagliated groove is formed at a temperature of above 150° C.
15. The semiconductor package of claim 1 , wherein the semiconductor chip is applied as a component of an inverter, a converter, or an on board charger (OBC).