Electronic device and method for manufacturing electronic device
An electronic device includes a housing formed of a resin member having a predetermined light absorption property and having an opening, a circuit board accommodated in the housing and on which an electronic circuit is formed, at least one terminal including one end portion and the other end portion electrically connected to the circuit board, and a cover portion covering the opening of the housing, penetrating the at least one terminal, and formed of a resin member having a predetermined light transmitting property. The one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion, and the cover portion is molded at a mold temperature of 100 degrees to 180 degrees. The at least one terminal and the circuit board are electrically connected by solder joining. The housing and the cover portion are connected by laser welding.
1. An electronic device comprising:
a housing that is formed of a resin member having a predetermined light absorption property and that has an opening;
a circuit board that is accommodated in the housing and on which an electronic circuit is formed;
at least one terminal that includes one end portion and the other end portion, the other end portion being electrically connected to the circuit board; and
a cover portion that covers the opening of the housing, that is penetrated by the at least one terminal, and that is formed of a resin member having a predetermined light transmitting property,
wherein the one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion,
wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 180 degrees Celsius,
wherein the at least one terminal and the circuit board are electrically connected to each other by solder joining,
wherein the housing and the cover portion are connected to each other by laser welding, and
wherein a light absorption property of the housing is higher than a light absorption property of the cover portion.
2. The electronic device according to claim 1 ,
wherein the at least one terminal is molded integrally with the cover portion.
3. The electronic device according to claim 1 ,
wherein the at least one terminal is a part of a connector.
4. The electronic device according to claim 1 ,
wherein a part of the at least one terminal is curved.
5. The electronic device according to claim 1 ,
wherein the at least one terminal penetrates the circuit board.
6. The electronic device according to claim 1 ,
wherein the solder joining of the at least one terminal and the circuit board is performed using at least one of a partial dip, a dip tank, or a reflow oven.
7. The electronic device according to claim 1 ,
wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 120 degrees Celsius.
8. The electronic device according to claim 1 ,
wherein a distance from a portion where the cover portion and the housing are joined to a portion where the at least one terminal and the circuit board are subjected to solder joining is less than a predetermined distance.
9. The electronic device according to claim 1 ,
wherein the cover portion and the housing are formed of polybutylene terephthalate.
10. The electronic device according to claim 1 ,
wherein the housing has a rectangular parallelepiped shape having an opening.
11. An electronic device comprising:
a housing that is formed of a resin member having a predetermined light absorption property and that has an opening;
a circuit board that is accommodated in the housing and on which an electronic circuit is formed;
at least one terminal that includes one end portion and the other end portion, the other end portion being electrically connected to the circuit board; and
a cover portion that covers the opening of the housing, that is penetrated by the at least one terminal, and that is formed of a resin member having a predetermined light transmitting property,
wherein the one end portion of the at least one terminal is located opposite to the other end portion with reference to the cover portion,
wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 180 degrees Celsius,
wherein the at least one terminal and the circuit board are electrically connected to each other by solder joining,
wherein the housing and the cover portion are connected to each other by laser welding, and
wherein a light transmitting property of the cover portion is higher than a light transmitting property of the housing.
12. The electronic device according to claim 11 ,
wherein the at least one terminal is molded integrally with the cover portion.
13. The electronic device according to claim 11 ,
wherein the at least one terminal is a part of a connector.
14. The electronic device according to claim 11 ,
wherein a part of the at least one terminal is curved.
15. The electronic device according to claim 11 ,
wherein the at least one terminal penetrates the circuit board.
16. The electronic device according to claim 11 ,
wherein the solder joining of the at least one terminal and the circuit board is performed using at least one of a partial dip, a dip tank, or a reflow oven.
17. The electronic device according to claim 11 ,
wherein the cover portion is molded at a mold temperature of 100 degrees Celsius to 120 degrees Celsius.
18. The electronic device according to claim 11 ,
wherein a distance from a portion where the cover portion and the housing are joined to a portion where the at least one terminal and the circuit board are subjected to solder joining is less than a predetermined distance.
19. The electronic device according to claim 11 ,
wherein the cover portion and the housing are formed of polybutylene terephthalate.
20. The electronic device according to claim 11 ,
wherein the housing has a rectangular parallelepiped shape having an opening.