Immersion cooling apparatus
An immersion cooling apparatus includes a pressure vessel including a vessel body and at least one lid. The at least one lid is detachably joined to the vessel body, wherein a certain lid of the at least one lid has a coolant outlet and a coolant inlet. The pressure vessel is filled with liquid coolant. A mounting member places the circuit board at a position between the coolant outlet and the coolant inlet within the pressure vessel. The circuit board is immersed in the liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant. The liquid coolant forcedly flows from one side of the circuit board to outside through the coolant outlet and forcedly flows into the other side of the circuit board from outside through the coolant inlet.
1. An immersion cooling apparatus for a circuit board including a heat-generating section, comprising:
a pressure vessel including a vessel body and at least one lid, wherein the at least one lid is detachably joined to the vessel body, wherein a certain lid of the at least one lid has a coolant outlet and a coolant inlet, and wherein the pressure vessel is filled with liquid coolant; and
a mounting member that places the circuit board at a position between the coolant outlet and the coolant inlet within the pressure vessel, wherein the circuit board is immersed in the liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant,
wherein the circuit board is placed to partition an inside space of the pressure vessel into a coolant-outlet-side and a coolant-inlet-side, such that the liquid coolant forcedly flows from one side of the circuit board to outside the pressure vessel through the coolant outlet and forcedly flows into another side of the circuit board from outside the pressure vessel through the coolant inlet,
wherein the vessel body has two opening surfaces which are detachably closed by a first lid and a second lid, respectively, wherein the first lid has the coolant outlet and the coolant inlet, and the second lid has electric terminals connected to the circuit board.
2. The immersion cooling apparatus according to claim 1 , further comprising
a thermal control system that exchanges heat with the liquid coolant flowing out of the coolant outlet such that heat-exchanged liquid coolant flows into the coolant inlet, wherein the thermal control system includes a forced-liquid flow generator.
3. The immersion cooling apparatus according to claim 1 , wherein the mounting member includes a first mounting member and a second mounting member which support the circuit board at both end portions thereof.
4. The immersion cooling apparatus according to claim 3 , the vessel body has the first mounting member and the second mounting member.
5. The immersion cooling apparatus according to claim 3 , wherein the vessel body has the first mounting member and the certain lid has the second mounting member.
6. The immersion cooling apparatus according to claim 1 , wherein the vessel body is of cylindrical shape and has the two opening surfaces opposing each other.
7. The immersion cooling apparatus according to claim 1 , wherein the mounting member comprises: a first mounting member protruding outward from one of the two opening surfaces; and a second mounting member protruding outward from another of the two opening surfaces,
and wherein the circuit board is fixed to the first mounting member and the second mounting member.
8. The immersion cooling apparatus according to claim 7 , wherein the first lid has a protruding wall on an inner wall of the first lid at a position between the coolant outlet and the coolant inlet, and wherein the protruding wall and the first mounting member are combined to form a partition wall that partitions a first-lid-side inside space of the pressure vessel such that the partition wall prevents the liquid coolant from directly flowing from the coolant inlet to the coolant outlet.
9. A space vehicle equipped with the immersion cooling apparatus according to claim 1 .
10. A method for cooling a circuit board including a heat-generating section, wherein the circuit board is placed within a pressure vessel including a vessel body and at least one lid, wherein the at least one lid is detachably joined to the vessel body,
wherein the circuit board is immersed in liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant, and wherein the vessel body has two opening surfaces which are detachably closed by a first lid and a second lid, respectively, wherein the first lid has the coolant outlet and the coolant inlet, and the second lid has electric terminals connected to the circuit board, the method comprising:
preparing a certain lid of the at least one lid having a coolant outlet and a coolant inlet;
placing the circuit board at a position between the coolant outlet and the coolant inlet to partition an inside space of the pressure vessel into a coolant-outlet-side and a coolant-inlet-side;
forcedly flowing the liquid coolant from one side of the circuit board to outside the pressure vessel through the coolant outlet; and
forcedly flowing the liquid coolant into another side of the circuit board from outside the pressure vessel through the coolant inlet.
11. The method according to claim 10 , further comprising
exchanging heat with the liquid coolant forcedly flowing out of the coolant outlet such that heat-exchanged liquid coolant forcedly flows into the coolant inlet.