Smart connector and method of manufacturing same using an application specific electronics packaging manufacturing process
In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.
1. A method of forming a smart connector comprising:
forming a lead frame defining an opening and having a plurality of fingers which extend into the opening;
overmolding a substrate onto the fingers, the substrate having a plurality of openings provided therethrough thereby forming exposed portions of the fingers;
electroplating traces on the substrate which are electrically coupled to the exposed portions;
mounting at least one electrical component on the substrate and electrically connecting the at least one electrical component to the traces;
separating the fingers from a remainder of the lead frame to form an Application Specific Electronics Packaging device; and
electrically attaching a separate printed circuit board to the exposed portion of some of the fingers, the separate printed circuit board having electrical components thereon which are configured to control the functionality of the at least one electrical component of the Application Specific Electronics Packaging device or are configured to modify properties of the at least one electrical component of the Application Specific Electronics Packaging device.
2. The method as defined in claim 1 , further comprising:
mounting the Application Specific Electronics Packaging device and the printed circuit board in a housing.