Cooling apparatus and semiconductor apparatus with cooling apparatus
A cooling apparatus includes: a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and radiating fins protruding from the second surface; and a second member including a third surface facing the second surface, a refrigerant flows between the first member and the second member, the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant, the first protrusion includes a first slope inclined to the third surface, the first slope includes a first end and a second end, the first end is closer to the second surface than the second end, the second end is closer to the third surface than the first end, the first end is positioned downstream in the flow direction from the second end.
1. A cooling apparatus comprising:
a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and a plurality of radiating fins protruding from the second surface; and
a second member including a third surface facing the second surface, wherein:
a refrigerant flows between the first member and the second member,
the second member includes a first protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant,
the first protrusion includes a first slope inclined to the third surface,
the first slope includes a first end and a second end,
the first end is closer to the second surface than the second end,
the second end is closer to the third surface than the first end,
the first end is positioned downstream in the flow direction from the second end,
the first slope includes a first partial surface and a second partial surface that is closer to the second end than the first partial surface and that faces the second surface, and
an absolute value of a gradient of the first partial surface from the third surface is greater than an absolute value of a gradient of the second partial surface from the third surface.
2. The cooling apparatus according to claim 1 , wherein:
the third surface faces the second surface with the third surface apart from a tip of each of the radiating fins, and
the first protrusion includes a tip closer to the second surface than the tip of each of the radiating fins.
3. The cooling apparatus according to claim 1 , wherein:
each of the radiating fins includes a tip end facing the third surface,
the tip end includes a first corner and a second corner, which are both ends of the tip end in the flow direction, and
at least one of the first corner or the second corner is rounded.
4. The cooling apparatus according to claim 1 , wherein:
the second member includes a plurality of protrusions arranged in the flow direction on the third surface, and
the plurality of protrusions includes the first protrusion.
5. The cooling apparatus according to claim 4 , wherein:
the plurality of protrusions further includes a second protrusion positioned upstream in the flow direction from the first protrusion.
6. The cooling apparatus according to claim 4 , wherein:
the plurality of protrusions further includes a second protrusion positioned upstream in the flow direction from the first protrusion,
the second protrusion includes a second slope inclined to the third surface,
the second slope includes a third end and a fourth end,
the third end is closer to the second surface than the fourth end,
the fourth end is closer to the third surface than the third end, and
the third end is positioned downstream in the flow direction from the fourth end.
7. The cooling apparatus according to claim 1 , wherein the first protrusion extends in a direction intersecting the flow direction in the space between the radiating fins.
8. The cooling apparatus according to in claim 7 , wherein a height of the first protrusion is not constant in the direction intersecting the flow direction.
9. The cooling apparatus according to claim 1 , wherein the radiating fins are staggered on the second surface.
10. The cooling apparatus according to claim 1 , wherein:
the first protrusion includes a first portion and a second portion, which are both ends of the first protrusion in the flow direction, and
the first portion is positioned downstream in the flow direction from the second portion.
11. A semiconductor apparatus comprising a cooling apparatus, wherein:
the cooling apparatus includes:
a first member including a first surface in contact with a cooling target, a second surface opposite to the first surface, and a plurality of radiating fins protruding from the second surface; and
a second member including a third surface facing the second surface, wherein:
a refrigerant flows between the first member and the second member,
the second member includes a protrusion protruding from the third surface toward a space, the space existing between the radiating fins in a flow direction of the refrigerant,
the protrusion includes a slope inclined to the third surface,
the slope includes a first end and a second end,
the first end is closer to the second surface than the second end,
the second end is closer to the third surface than the first end,
the first end is positioned downstream in the flow direction from the second end,
the slope includes a first partial surface and a second partial surface that is closer to the second end than the first partial surface and that faces the second surface, and
an absolute value of a gradient of the first partial surface from the third surface is greater than an absolute value of a gradient of the second partial surface from the third surface.