Electronic device and manufacturing method thereof
An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.
1. An electronic device, comprising:
a substrate;
a spacer disposed on the substrate and having a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction, wherein in a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening; wherein a width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening;
a first element overlapped with the first opening; and
a second element overlapped with the third opening.
2. The electronic device according to claim 1 , wherein the first element and the second element are light-emitting diodes.
3. The electronic device according to claim 1 , further comprising:
a plurality of the first elements overlapped with the first opening.
4. The electronic device according to claim 1 , further comprising:
a plurality of the second elements overlapped with the third opening.
5. The electronic device according to claim 1 , further comprising:
at least one third element overlapped with the second opening.
6. The electronic device according to claim 1 , wherein the substrate is a flexible substrate.
7. The electronic device according to claim 1 , further comprising:
a driving circuit disposed on the substrate and configured to drive at least one of the first element and the second element.