Polymer-graphene electronic component housing
An electronic component housing defining an EMI shield and an ESD protection cover includes a polymeric core formed from a first polymeric material with a reinforcement material and an overmolded outer layer formed from a second polymeric material with between about 2 wt. % and about 30 wt. % graphene. The reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof, the overmolded outer layer defines a housing skin disposed on the polymeric core.
1. An electronic component housing comprising:
an injection molded polymeric core comprising a first polymeric material; and
an injection molded overmolded outer layer comprising a second polymeric material with graphene, wherein the injection molded overmolded outer layer defines a housing skin disposed on the injection molded polymeric core, the injection molded polymeric core and the injection molded overmolded outer layer defining an electrostatic discharge (ESD) protection cover with an anti-static conductivity greater than about 10 −10 S/m and a static dissipative conductivity greater than about 10 −8 S/m.
2. The electronic component housing according to claim 1 , wherein the injection molded polymeric core is free of graphene.
3. The electronic component housing according to claim 1 , wherein the injection molded polymeric core includes a reinforcement material, wherein the reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof.
4. The electronic component housing according to claim 1 , wherein the first polymeric material and the second polymeric material are at least one of a thermoplastic, a thermoset epoxy, and a phenolic polymer.
5. The electronic component housing according to claim 1 , wherein the first polymeric material and the second polymeric material are at least one of polypropylene, polybutylene terephthalate, acrylonitrile butadiene styrene, and combinations thereof.
6. The electronic component housing according to claim 1 , wherein the first polymeric material and the second polymeric material are the same polymeric material.
7. The electronic component housing according to claim 1 , wherein the first polymeric material and the second polymeric material are polypropylene.
8. The electronic component housing according to claim 1 , wherein the overmolded outer layer comprises the second polymeric material with between about 2 wt. % and about 30 wt. % graphene.
9. The electronic component housing according to claim 1 , wherein the injection molded polymeric core and the injected molded overmolded outer layer define an EMI shield with a shielding efficiency of at least 30 dB for EM radiation frequencies between about 1 GHz to about 40 GHz.
10. The electronic component housing according to claim 9 , wherein the shielding efficiency is at least 35 dB for EM radiation frequencies between about 1 GHz to about 40 GHz.
11. The electronic component housing according to claim 9 , wherein the shielding efficiency is between about 35 dB and about 90 dB for EM radiation frequencies between about 1 GHz to about 100 GHz.
12. The electronic component housing according to claim 1 , wherein the anti-static conductivity is greater than about 10 −9 S/m and less than or equal to about 10 −6 S/m and the static dissipative conductivity is greater than about 10 −7 S/m and less than or equal to about 10 −3 S/m.
13. The electronic component housing according to claim 1 , wherein the injection molded polymeric core has a thickness between about 1 mm and about 10 mm.
14. The electronic component housing according to claim 1 , wherein the injection molded overmolded outer layer has a thickness between about 0.5 mm and about 5 mm.
15. An electronic component housing defining an EMI shield and an ESD protection cover, the electronic component housing comprising:
a polymeric core comprising a first polymeric material with a reinforcement material, wherein the reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof; and
an overmolded outer layer comprising a second polymeric material and between about 2 wt. % and about 30 wt. % graphene, wherein the overmolded outer layer defines a housing skin disposed on the polymeric core, wherein the polymeric core and the overmolded outer layer define an electrostatic discharge (ESD) protection cover with an anti-static conductivity greater than about 10 −10 S/m and a static dissipative conductivity greater than about 10 −8 S/m.
16. The electronic component housing according to claim 15 , wherein the first polymeric material and the second polymeric material are at least one of a thermoplastic, a thermoset epoxy, and a phenolic polymer.
17. The electronic component housing according to claim 16 , wherein:
the polymeric core has a thickness between about 1 mm and about 10 mm;
the housing skin has a thickness between about 0.5 mm and about 5 mm;
the polymeric core with the housing skin has a shielding efficiency between about 35 dB and about 90 dB for EM radiation frequencies between about 1 GHz to about 100 GHz; and
the polymeric core with the housing skin has an anti-static conductivity less than or equal to about 10 −6 S/m and a static dissipative conductivity less than or equal to about 10 −3 S/m.
18. An electronic component housing comprising:
an injection molded polymeric core comprising a first polymeric material; and
an injection molded overmolded outer layer comprising a second polymeric material with graphene, wherein the injection molded overmolded outer layer defines a housing skin disposed on the injection molded polymeric core, the injection molded polymeric core and the injection molded overmolded outer layer defining an electrostatic discharge (ESD) protection cover with an anti-static conductivity greater than about 10 −9 S/m and less than or equal to about 10 −6 S/m and a static dissipative conductivity greater than about 10 −7 S/m and less than or equal to about 10 −3 S/m.
19. The electronic component housing according to claim 18 , wherein the injection molded polymeric core is free of graphene.
20. The electronic component housing according to claim 18 , wherein the injection molded polymeric core includes a reinforcement material, wherein the reinforcement material provides structural reinforcement to the electronic component housing and is at least one of carbon fiber, glass, talc, mineral filler, and combinations thereof.