IP Library › Granted Patent US 12,186,833
Granted Patent B2
US 12,186,833 · App. 16/768,731 · Granted Jan 7, 2025

Apparatus for 3D shaping of a workpiece by a liquid jet guided laser beam

Inventors: Bernold Richerzhagen (Saint-Sulpice, CH); David Hippert (Lancy, CH); Helgi Diehl (Morges, CH)
Assignee: SYNOVA S.A.
B23K26/36B23K26/0622B23K26/082B23K26/0861B23K26/146
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,186,833
App. No.
16/768,731
Granted
Jan 7, 2025
Kind
B2
Abstract

The invention relates to an apparatus 100 for 3D shaping of a workpiece 101 by material ablation with a laser beam 102 . The apparatus 100 comprises a machining unit 103 , which is configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 into the fluid jet 104 towards the workpiece 101 . Further, the apparatus 100 includes a motion controller 105 configured to set an x-y-z-position of the workpiece 101 relative to the machining unit 103 . It also includes a measuring unit 107 configured to measure a z-position of the point of incidence 108 of the pressurized fluid jet 104 on the workpiece 101 in the z-direction.

Claims (33)

1. A method ( 1000 ) for 3D shaping of a workpiece ( 101 ) by material ablation with a laser beam ( 102 ) comprising a plurality of laser pulses, the method ( 1000 ) comprising the steps of:

providing ( 1001 ) a pressurized laminar fluid jet ( 104 ) produced by a nozzle of an apparatus onto the workpiece ( 101 ) and coupling the laser beam ( 102 ) into the pressurized laminar fluid jet ( 104 ) which guides the laser beam towards the workpiece ( 101 ),

moving a machining surface of the apparatus, on which the workpiece ( 101 ) is provided, relative to the nozzle according to x-y-z coordinates of the machining surface set in a motion controller of the apparatus, and

performing ( 1003 ) a measurement of a z-coordinate of a point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) at the set x-y-z-coordinates of the machining surface,

wherein the measurement is performed by a measuring unit comprising a depth sensor of the apparatus through the pressurized laminar fluid jet, and

wherein a z-direction is parallel to a propagation direction of the pressurized laminar fluid jet ( 104 ),

scanning a surface ( 109 ) of the workpiece ( 101 ) in a x-y-plane,

determining a profile of the surface ( 109 ) by measuring respective z-coordinates of a plurality of points of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ),

ablating a layer of material of the workpiece, wherein the ablating comprises setting individually an energy of each laser pulse ( 200 ) or setting a trajectory of moving the workpiece ( 101 ) by changing the x-y-z coordinates of the machining surface after each laser pulse ( 200 ) based on the determined profile of the surface ( 109 ), and

calculating a layered representation ( 601 ) of a to be ablated volume of the workpiece, wherein the workpiece ( 101 ) is shaped by ablating, layer-by-layer, a plurality of layers ( 800 ) of workpiece material with the laser beam ( 102 ).

2. The method ( 1000 ) of claim 1 , wherein a laser controller ( 106 ) is configured to increase or decrease a laser pulse frequency, respectively, such that a number of laser pulses ( 200 ) per distance is constant along the trajectory.

3. The method ( 1000 ) of claim 1 further comprising the step of determining a first inclination or surface irregularity ( 901 ) of a lastly ablated workpiece material layer ( 900 ) by scanning the workpiece surface ( 109 ) in the x-y-plane and thereby measuring z-positions of the plurality of points of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) and a second inclination or surface irregularity ( 902 ) on the surface ( 109 ) of the workpiece ( 101 ).

4. An apparatus ( 100 ) for 3D shaping of the workpiece ( 101 ) by material ablation with the laser beam ( 102 ) for carrying out the steps of claim 1 , the apparatus ( 100 ) comprising a machining unit ( 103 ) configured to provide the pressurized laminar fluid jet ( 104 ) onto the workpiece ( 101 ) and to couple the laser beam ( 102 ) into the pressurized laminar fluid jet ( 104 ) towards the workpiece ( 101 ), a motion controller ( 105 ) configured to set an x-y-z-position of the workpiece ( 101 ) relative to the machining unit ( 103 ), the measuring unit ( 107 ) configured to measure a z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) in the z-direction.

5. The apparatus ( 100 ) according to claim 4 , further comprising a laser controller ( 106 ) configured to adjust a power or energy of the laser beam ( 102 ) based on the x-y-z-position set by the motion controller ( 105 ) and the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) measured by the measuring unit ( 107 ).

6. The apparatus ( 100 ) according to claim 4 , wherein the laser beam ( 102 ) is pulsed, and the apparatus ( 100 ) further comprises a laser controller ( 106 ) configured to adjust individually the energy of each laser pulse ( 200 ) based on the x-y-z-position set by the motion controller ( 105 ) for that laser pulse ( 200 ) and the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) measured by the measuring unit ( 107 ) before that laser pulse ( 200 ).

7. The apparatus ( 100 ) according to claim 6 , wherein the measuring unit ( 107 ) is configured to determine an ablation result of each laser pulse ( 200 ) at the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) measured by the measuring unit ( 107 ) after that laser pulse ( 200 ), and the laser controller ( 106 ) is configured to adjust an energy of the next laser pulse ( 200 ) based on the determined ablation result.

8. The apparatus ( 100 ) according to claim 6 , wherein the laser controller ( 106 ) is configured to control the energy of each laser pulse ( 200 ) by setting its width or amplitude or by setting a pulse ( 200 ) rate and consequently a time delay between consecutive pulses ( 200 ) or by executing a pulse burst ( 201 ).

9. The apparatus ( 100 ) according to claim 8 , wherein the laser controller ( 106 ) is configured to control the energy of each laser pulse ( 200 ) such that it ablates in z-direction between 1 - 1000 um depth of workpiece material at the x-y-z-position of the workpiece ( 101 ) set by the motion controller ( 105 ) for that laser pulse ( 200 ).

10. The apparatus ( 100 ) according to claim 6 , further comprising a laser source ( 110 ) for generating the laser beam ( 102 ), the laser source ( 110 ) including the laser controller ( 106 ) and a fast switch, preferably a Q-switch ( 400 ), for modulating the laser pulses ( 200 ).

11. The apparatus ( 100 ) according to claim 6 , wherein the measuring unit ( 107 ) is configured to measure the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) within a time period between two subsequent laser pulses ( 200 ).

12. The apparatus ( 100 ) according to claim 6 , wherein the motion controller ( 105 ) is configured to step-wise or continuously change the x-y-z-position of the workpiece ( 101 ) relative to the machining unit ( 103 ) after each laser pulse ( 200 ).

13. The apparatus ( 100 ) according to claim 12 , wherein the motion controller ( 105 ) is configured to accelerate or decelerate the changing of the x-y-z-position of the workpiece ( 101 ) when moving the workpiece ( 101 ) along the trajectory.

14. The apparatus ( 100 ) according to claim 4 , wherein the motion controller ( 105 ) is configured to repeatedly change the x-y-z-position of the workpiece ( 101 ) such that the laser beam ( 102 ) scans the workpiece surface ( 109 ) in the x-y-plane.

15. The apparatus ( 100 ) according to claim 14 , configured to selectively activate or deactivate the laser beam ( 102 ) during the scan of the workpiece surface ( 109 ) depending on the x-y-z-positions given by the motion controller ( 105 ).

16. The apparatus ( 100 ) according to claim 2 , configured to shape the workpiece ( 101 ) by ablating, layer-by-layer, a plurality of layers ( 800 ) of workpiece material with the laser beam ( 102 ), wherein each of the plurality of layers ( 800 ) takes an individually predetermined area in the x-y-plane and has an individually predetermined uniform or non-uniform thickness along the z-direction a processing unit ( 600 ) configured to calculate a layered representation ( 601 ) of the to be ablated volume of the workpiece ( 101 ), wherein the apparatus ( 100 ) is configured to shape the workpiece ( 101 ) by ablating the plurality of layers ( 800 ) of workpiece material based on the calculated layered representation ( 601 ) the laser controller ( 106 ) is configured to control the power or energy of the laser beam ( 102 ) based further on the layered representation ( 601 ) received from the processing unit ( 600 ).

17. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is configured to feedback a measured z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) to a processing unit ( 600 ), and the processing unit ( 600 ) is configured to recalculate the layered representation ( 601 ), particularly a number of layers of the layered representation ( 601 ), based on the feedback from the measuring unit ( 107 ).

18. The apparatus ( 100 ) according to claim 4 , wherein a processing unit ( 600 ) is configured to recalculate the layered representation ( 601 ) after each workpiece material layer ( 800 ) that is ablated from the workpiece ( 101 ).

19. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is further configured to determine a first inclination or surface irregularity ( 901 ) of a lastly ablated workpiece material layer ( 900 ) by scanning the workpiece surface ( 109 ) in the x-y-plane and thereby measuring z-positions of the plurality of points of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) and a second inclination or surface irregularity ( 902 ) on the surface ( 109 ) of the workpiece ( 101 ), and the apparatus ( 100 ) is configured to ablate at least a next layer ( 800 ) based on the first inclination or surface irregularity ( 901 ) determined by the measuring unit ( 107 ).

20. The apparatus according to claim 3 , configured to shape the workpiece ( 101 ) by ablating, layer-by-layer, the plurality of layers ( 800 ) of workpiece material with the laser beam ( 102 ) wherein the apparatus ( 100 ) is configured to ablate at least a next layer ( 800 ) based on the first inclination or surface irregularity ( 901 ) determined by the measuring unit ( 107 ), and the laser controller ( 106 ) is configured to adapt, for at least the next layer ( 800 ), individually the energy of each laser pulse ( 200 ) or a trajectory of moving the workpiece ( 101 ) by changing the x-y-z-position after each laser pulse ( 200 ) based on the first inclination or surface irregularity ( 901 ) determined by the measuring unit ( 107 ).

21. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is configured to measure the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) by using an electromagnetic radiation or acoustic waves.

22. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is configured to measure the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) by measuring a characteristic length of the pressurized laminar fluid jet ( 104 ).

23. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is configured to measure the z-position of the point of incidence ( 108 ) of the pressurized laminar fluid jet ( 104 ) on the workpiece ( 101 ) through the pressurized laminar fluid jet ( 104 ).

24. The apparatus ( 100 ) according to claim 4 , wherein the measuring unit ( 107 ) is integrated into the machining unit ( 103 ).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2020
From: RICHERZHAGEN, BERNOLD; HIPPERT, DAVID; DIEHL, HELGI
To: SYNOVA S.A.
Reel/Frame 053338/0744 →
Priority Claims (1)
EP 17205193 · Dec 4, 2017 · regional
Continuity (1)
Related Publication 20210170529A1 · Jun 10, 2021
References Cited (43)
US 5541416A · Washizuka · 1996 [cited by examiner]
US 5698120A · Kurosawa · 1997 [cited by examiner]
US 7273997B2 · Lambert et al. · 2007 [cited by applicant]
US 8263900B2 · Maehara et al. · 2012 [cited by applicant]
US 10335900B2 · Hu · 2019 [cited by applicant]
US 11318560B2 · Richerzhagen et al. · 2022 [cited by applicant]
US 20060062265A1 · Denney · 2006 [cited by examiner]
US 20150121960A1 · Hosseini · 2015 [cited by examiner]
US 20150255248A1 · Boguslavsky · 2015 [cited by examiner]
US 20160199941A1 · McDowell et al. · 2016 [cited by applicant]
US 20160228988A1 · Dallarosa · 2016 [cited by examiner]
US 20160368083A1 · Lowell et al. · 2016 [cited by applicant]
US 20170157709A1 · Richerzhagen et al. · 2017 [cited by applicant]
US 20180214982A1 · Richerzhagen et al. · 2018 [cited by applicant]
US 20210162540A1 · Houbertz · 2021 [cited by examiner]
DE 102012003202A1 · 2013 [cited by applicant]
EP 3124165A1 · 2017 [cited by applicant]
JP H11245059A · 1999 [cited by applicant]
JP H11254161A · 1999 [cited by applicant]
JP 2005125398A · 2005 [cited by applicant]
JP 2009000698A · 2009 [cited by applicant]
JP 2009190082A · 2009 [cited by applicant]
JP 2009241138A · 2009 [cited by applicant]
JP 2010115680A · 2010 [cited by applicant]
JP 2011064503A · 2011 [cited by applicant]
JP 2011212710A · 2011 [cited by applicant]
International Search Report and Written Opinion issued in connection with the corresponding International Application No. PCT/EP2018/083467 on Mar. 8, 2019. [cited by applicant]
Machine translation of DE 102012003202 to Saegmueller et al. [cited by applicant]
European Search Report issued in connection with the corresponding European Patent Application No. 17205193.0 on Jun. 26, 2018. [cited by applicant]
Translation of First Office Action issued in connection with the corresponding Chinese Patent Application No. 20188078642.X on Sep. 9, 2021. [cited by applicant]
European Office Action issued in connection with the corresponding European Patent Application No. 17205193.0 on Nov. 4, 2021. [cited by applicant]
Machine translation of JP 2011212710 to Keiichi et al. [cited by applicant]
Machine translation of JP 2011064503 to Koji. [cited by applicant]
Machine translation of Jp 2010115680A to Hidenobu et al. [cited by applicant]
Machine translation of JP2005125398 A to Hirotaka. [cited by applicant]
Machine translation of JPH11254161 A to Makoto. [cited by applicant]
Machine translation of JP 2009000698 A to Oasako Sadanobu. [cited by applicant]
Machine translation of JP 2009241138 A to Muratsubaki Ryoji et al. [cited by applicant]
Machine translation of JP 2009190082 A to Sasaki Motoi et al. [cited by applicant]
Machine translation of DE 102012003202 A1 to Saegmueller et al. [cited by applicant]
Translated excerpts of the office actions issued in connection with the related Japanese patent applications. [cited by applicant]
Machine translation of Jp H11245059 A to Sumitomo Heavy Industries. [cited by applicant]
Korean Office Action issued in connection with the corresponding Korean Patent Application No. 10-2020-7015417 on Feb. 14, 2023. [cited by applicant]
Cited By (1)
US 12,722,225