Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate
A cleaning solution for temporary adhesive for substrates contains: tetrabutylammonium fluoride; dimethyl sulfoxide; and a liquid compound having a solubility parameter of 8.0 or more and 10.0 or less and having a heteroatom. The tetrabutylammonium fluoride is preferably contained at a content of 1 mass % or more and 15 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound. The dimethyl sulfoxide is preferably contained at a content of 5 mass % or more and 30 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound.
1. A cleaning solution for temporary adhesive for substrates, the cleaning solution comprising:
tetrabutylammonium fluoride; dimethyl sulfoxide; and a liquid compound having a solubility parameter of 8.0 or more and 10.0 or less and having a heteroatom, wherein
the tetrabutylammonium fluoride is contained at a content of 1 mass % or more and 15 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound,
the dimethyl sulfoxide is contained at a content of 5 mass % or more and 30 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound, and
the liquid compound comprises propylene glycol monomethyl ether acetate or butyl acetate.
2. A substrate cleaning method comprising steps of:
separating a support from a substrate laminate comprising the support, a temporary adhesive layer formed on the support, and a substrate laminated on the temporary adhesive layer and having a front surface on which a circuit is formed and that faces the temporary adhesive layer; and
cleaning and removing the temporary adhesive layer remaining on the substrate with the cleaning solution for temporary adhesive for substrates according to claim 1 .
3. A cleaning method for a support or a substrate comprising steps of:
forming a temporary adhesive layer on a support or a substrate; and
cleaning and removing a part of the temporary adhesive layer with the cleaning solution for temporary adhesive for substrates according to claim 1 .
4. The cleaning solution for temporary adhesive for substrates according to claim 1 , wherein the tetrabutylammonium fluoride is contained at a content of 5 mass % or more and 10 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound, and
the dimethyl sulfoxide is contained at a content of 10 mass % or more and 20 mass % or less in 100 mass % of a total of the tetrabutylammonium fluoride, the dimethyl sulfoxide, and the liquid compound.