Semiconductor device having a curved part in the printed circuit board
A semiconductor device includes: an insulated circuit substrate including first and second conductive layers on a top surface side; a first semiconductor chip mounted on the first conductive layer; a second semiconductor chip mounted on the second conductive layer; a printed circuit board including a first lower-side wiring layer arranged to be opposed to the first semiconductor chip, and a second lower-side wiring layer arranged to be opposed to the second semiconductor chip, the printed circuit board being provided with a curved part curved toward the insulated circuit substrate; a first connection member arranged to connect the first semiconductor chip with the first lower-side wiring layer; a second connection member arranged to connect the second semiconductor chip with the second lower-side wiring layer; and a third connection member arranged to connect the first conductive layer with the second lower-side wiring layer at the curved part.
1. A semiconductor device comprising:
an insulated circuit substrate including first and second conductive layers on a top surface side;
a first semiconductor chip mounted on the first conductive layer;
a second semiconductor chip mounted on the second conductive layer;
a printed circuit board including an insulating layer, a first lower-side wiring layer arranged on one main surface of the insulating layer so as to be opposed to the first semiconductor chip, and a second lower-side wiring layer arranged on the one main surface of the insulating layer so as to be opposed to the second semiconductor chip, the printed circuit board being provided with a curved part curved toward the insulated circuit substrate;
a first connection member arranged to connect the first semiconductor chip with the first lower-side wiring layer;
a second connection member arranged to connect the second semiconductor chip with the second lower-side wiring layer;
a third connection member arranged to connect the first conductive layer with the second lower-side wiring layer at the curved part; and
a sealing member provided to seal the first and second semiconductor chips, the printed circuit board, and the first to third connection members.
2. The semiconductor device of claim 1 , wherein the first to third connection members have heights common to each other.
3. The semiconductor device of claim 1 , wherein the curved part has a step having a thickness common to a total thickness of the first semiconductor chip and a bonding material bonding the first semiconductor chip and the first conductive layer to each other.
4. The semiconductor device of claim 1 , wherein the curved part is located in a middle part of the printed circuit board in a longitudinal direction.
5. The semiconductor device of claim 1 , wherein the insulating layer is formed from resin.
6. The semiconductor device of claim 1 , wherein the insulated circuit substrate includes a resin substrate having a top surface on which the first and second conductive layers are deposited.
7. The semiconductor device of claim 6 , further comprising a first external connection terminal integrated with the second conductive layer and externally extending from the sealing member.
8. The semiconductor device of claim 1 , wherein the first lower-side wiring layer is electrically connected to a main electrode of the first semiconductor chip, and
the second lower-side wiring layer is electrically connected to a main electrode of the second semiconductor chip.
9. The semiconductor device of claim 1 , wherein the printed circuit board includes:
a first upper-side wiring layer deposited on a top surface of the insulating layer at a position overlapping with the first lower-side wiring layer via the insulating layer so as to be electrically connected to the first lower-side wiring layer; and
a second upper-side wiring layer deposited on the top surface of the insulating layer at a position overlapping with the second lower-side wiring layer via the insulating layer so as to be electrically connected to the second lower-side wiring layer.
10. The semiconductor device of claim 9 , further comprising a second external connection terminal connected to the first upper-side wiring layer.
11. The semiconductor device of claim 10 , further comprising a third external connection terminal connected to the second upper-side wiring layer.
12. The semiconductor device of claim 9 , wherein the printed circuit board includes:
a third lower-side wiring layer deposited on a bottom surface of the insulating layer and electrically connected to a first main electrode of the first semiconductor chip; and
a third upper-side wiring layer deposited on the top surface of the insulating layer at a position overlapping with the third lower-side wiring layer via the insulating layer so as to be electrically connected to a control electrode of the first semiconductor chip, and
the third lower-side wiring layer and the third upper-side wiring layer have current paths opposite to each other.
13. The semiconductor device of claim 1 , wherein the printed circuit board is provided with a slit at a position corresponding to the curved part.
14. The semiconductor device of claim 1 , wherein the printed circuit board is provided with a notch at a position corresponding to the curved part.