Surface-mount compatible VCSEL array
A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.
1. An array of light-emitting devices, comprising:
a die having light-emitting structures and first etched trenches therebetween,
wherein the light-emitting structures have first metal electrical contacts thereon;
shorted structures separated by second etched trenches,
wherein the shorted structures have second metal electrical contacts thereon;
a layer of dielectric material that forms a planarized surface of an etched side of the die;
first metal pads, patterned in or on the layer of dielectric material, that connect groups of the light-emitting structures or individual light-emitting structures together,
wherein the first metal pads contact the first metal electrical contacts of the light-emitting devices, and
wherein a bottom surface, of a metal pad of the first metal pads, is in contact with a first horizontal surface of the layer of dielectric material that is below the planarized surface; and
second metal pads, patterned in or on the layer of dielectric material, that make electrical contact to groups of the shorted structures or individual shorted structures,
wherein the second metal pads contact the second metal electrical contacts of the shorted structures, and
wherein a bottom surface, of a metal pad of the second metal pads, is in contact with a second horizontal surface of the layer of dielectric material that is below the planarized surface.
2. The array of claim 1 , wherein the second metal pads include solder bonding surfaces that attach the die to a printed circuit board.
3. The array of claim 1 , wherein the die is a single die.
4. The array of claim 1 , wherein light is emitted through a substrate wafer side of the die.
5. The array of claim 1 , further comprising:
under-bump metallization on the first metal electrical contacts and the second metal electrical contacts; and
solder pre-tinned to the first metal electrical contacts and the second metal electrical contacts.
6. The array of claim 1 , further comprising:
under-bump metallization on the first metal electrical contacts and the second metal electrical contacts; and
solder balls attached to the first metal electrical contacts and the second metal electrical contacts.
7. The array of claim 1 , further comprising:
a substrate; and
an anti-reflection coating.
8. The array of claim 7 , further comprising:
lenses etched into the substrate in alignment with the light-emitting structures.
9. The array of claim 7 , further comprising:
a diffractive optical element etched into the substrate in alignment with the light-emitting structures.
10. The array of claim 7 , further comprising:
vias etched in the substrate aligned to apertures of the light-emitting structures.
11. The array of claim 1 , further comprising:
a transparent support substrate.
12. The array of claim 11 , wherein the transparent support substrate includes lenses or diffractive surfaces aligned with the light-emitting structures.
13. The array of claim 11 , further comprising:
a reflective coating bonded to the transparent support substrate that provides an external light-emitting cavity for each of the light-emitting structures.
14. The array of claim 13 , wherein the transparent support substrate includes convex or concave lens surfaces.
15. The array of claim 11 , wherein the transparent support substrate is:
a glass, or
a crystal solid state laser gain medium; and
wherein the transparent support substrate has a reflective coating bonded to a surface to configure a vertical-cavity surface-emitting laser (VCSEL) pumped solid state laser array.
16. The array of claim 1 , wherein the die includes lateral oxidation layers that are exposed, through the first etched trenches, for oxidation, to optically and electrically separate the light-emitting structures.
17. The array of claim 1 , wherein the first metal pads contact the second metal pads in an opening of the layer of dielectric material.
18. The array of claim 1 , wherein the first metal pads are patterned on the layer of dielectric material,
wherein the second metal pads are patterned on the layer of dielectric material, and
wherein the planarized surface, the first horizontal surface, and the second horizontal surface are the same surface.
19. An array of light-emitting devices, comprising:
a light-emitting structure;
a first metal electrical contact on the light-emitting structure;
a shorted structure;
a second metal electrical contact on the shorted structure;
a trench between the light-emitting structure and the shorted structure;
a dielectric layer in the trench,
wherein the dielectric layer comprises a planarized surface;
a first metal pad on the first metal electrical contact, and
wherein a bottom surface, of the first metal pad, is in contact with a first horizontal surface of the dielectric layer that is below the planarized surface; and
a second metal pad on the second metal electrical contact,
wherein a bottom surface, of the second metal pad, is in contact with a second horizontal surface of the dielectric layer that is below the planarized surface.
20. An array of light-emitting devices, comprising:
a first light-emitting structure;
a first metal electrical contact on the first light-emitting structure;
a second light-emitting structure;
a second metal electrical contact on the second light-emitting structure;
a first trench between the first light-emitting structure and the second light-emitting structure;
a first shorted structure;
a third metal electrical contact on the first shorted structure;
a second shorted structure;
a fourth metal electrical contact on the second shorted structure;
a second trench between the first shorted structure and the second shorted structure;
a dielectric layer in at least a third trench between the first light-emitting structure and the first shorted structure,
wherein the dielectric layer comprises a planarized surface;
a first metal pad on the first metal electrical contact, and
wherein a bottom surface, of the first metal pad, is in contact with a first horizontal surface of the dielectric layer that is below the planarized surface; and
a second metal pad on the third metal electrical contact,
wherein a bottom surface, of the second metal pad, is in contact with a second horizontal surface of the dielectric layer that is below the planarized surface.