Air cooled compact power systems
An apparatus with a bus bar, a heat-pipe, and device, which has a metal structure, a metal element, and a transistor. The metal structure may include first and second surfaces, that are flat and opposite facing. The metal element may include first and second surfaces that are flat and opposite facing. The transistor may include first and second terminals between which electrical current is transmitted when the transistor is activated. The first and second terminals may include first and second surfaces, respectively, that are substantially flat and opposite facing. The first and second surfaces of the first and second terminals, respectively, may be sintered to the first and second surfaces, respectively, of the metal structure and the metal element, respectively. The heat-pipe is thermally connected to the bus bar. The second surface of the metal structure is electrically and thermally connected to the bus bar.
1. An apparatus comprising:
a 1 st bus bar comprising a 1 st channel;
a 1 st heat-pipe received in the 1 st channel and thermally connected to the 1 st bus bar;
a 1 st dielectric that electrically insulates the 1 st heat-pipe from the 1 st bus bar;
a 2 nd bus bar;
a 2 nd heat-pipe thermally connected to the 2 nd bus bar;
a first device comprising:
a 1 st metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd Surfaces of the 1 st metal structure are electrically connected, substantially flat and oppositely facing;
a 1 st metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 1 st metal element are electrically connected, substantially flat and oppositely facing;
a 1 st transistor comprising 1 st and 2 nd terminals between which 1 ampere or more of electrical current is transmitted when the 1 st transistor is activated, wherein the 1 st and 2 nd terminals comprise st and 2 nd surfaces, respectively, wherein the 1 st and 2 nd surfaces of the 1 st and 2 nd terminals, respectively, are substantially flat and oppositely facing;
wherein the 1 st and 2 nd surfaces of the 1 st and 2 nd terminals, respectively, are electrically and thermally connected to the 1 st and 2 nd surfaces, respectively, of the 1 st metal structure and the 1 st metal element, respectively;
wherein the 1 st and 2 nd second surfaces of the 1 st metal element and the 1 st metal structure, respectively, are electrically and thermally connected to the 2 nd and 1 st bus bars, respectively.
2. The apparatus of claim 1 wherein the 1 st metal element comprises a 1 st pedestal with an end surface, wherein the 2 nd surface of the 1 st metal element comprises the end surface.
3. The apparatus of claim 1 wherein the first device comprises a 1 st case, wherein the 1 st case comprises a 1 st opening through which the 2 nd surface of the 1 st metal structure is electrically and thermally connected to the 1 st bus bar, and wherein the 1 st case comprises a 2 nd opening through which the 1 st surface of the 2 nd metal element is electrically and thermally connected to the 2 nd bus bar.
4. The apparatus of claim 1 further comprising:
a 3 rd bus bar;
a 3 rd heat-pipe thermally connected to the 3 rd bus bar;
a second device comprising:
a 2 nd metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 2 nd metal structure are electrically connected, substantially flat and oppositely facing;
a 2 nd metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 2 nd metal element are electrically connected, substantially flat and oppositely facing;
a 2 nd transistor comprising 3 rd and 4 th terminals between which 1 ampere or more of electrical current is transmitted when the 2 nd transistor is activated, wherein the 3 rd and 4 th terminals comprise 3 rd and 4 th surfaces, respectively, wherein the 3 rd and 4 th surfaces are substantially flat and oppositely facing;
wherein the 3 rd and 4 th surfaces are sintered to the 1 st and 2 nd surfaces, respectively, of the 2 nd metal structure and the 2 nd metal element, respectively;
wherein the 2 nd surface of the 2 nd metal structure is electrically and thermally connected to a flat surface of the 2 nd bus bar;
wherein the 1 st surface of the 2 nd metal element is thermally and electrically connected to the 3 rd bus bar.
5. The apparatus of claim 4 , wherein the 2 nd metal element comprises a 2 nd pedestal with an end surface, wherein the 2 nd surface of the 2 nd metal element comprises the end surface of the 2 nd pedestal.
6. The apparatus of claim 4 further comprising:
a 4 th bus bar;
a 4 th heat-pipe thermally connected to the 4 th bus bar;
a third device comprising:
a 3 rd metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 3 rd metal structure are electrically connected, substantially flat and oppositely facing;
a 3 rd metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 3 rd metal element are electrically connected, substantially flat and oppositely facing;
a 3 rd transistor comprising 5 th and 6 th terminals between which 1 ampere or more of electrical current is transmitted when the 3 rd transistor is activated, wherein the 5 th and 6 th terminals comprise 5 th and 6 th surfaces, respectively, wherein the 5 th and 6 th surfaces are substantially flat and oppositely facing;
wherein the 5 th and 6 th surfaces are sintered to the 1 st and 2 nd surfaces, respectively, of the 3 rd metal structure and the 3 rd metal element, respectively;
wherein the 2 nd surface of the 3 rd metal structure is electrically and thermally connected directly to a flat surface of the 1 st bus bar;
wherein the 1 st surface of the 3 rd metal element is electrically and thermally connected directly to the 4 th bus bar;
wherein the 2 nd bus bar is electrically isolated from the 4 th bus bar.
7. The apparatus of claim 6 further comprising:
a fourth device comprising:
a 4 th metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 4 th metal structure are electrically connected, substantially flat and oppositely facing;
a 4 th metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 4 th metal element are electrically connected, substantially flat and oppositely facing;
a 4 th transistor comprising 7 th and 8 th terminals between which 1 ampere or more of electrical current is transmitted when the 4 th transistor is activated, wherein the 7 th and 8 th terminals comprise 7 th and 8 th surfaces, respectively, wherein the 7 th and 8 th surfaces are substantially flat and oppositely facing;
wherein the 7 th and 8 th surfaces are sintered directly to the 1 st and 2 nd surfaces, respectively, of the 4 th metal structure and the 4 th metal element, respectively;
wherein the 2 nd surface of the 4 th metal structure is electrically and thermally connected to the 4 th bus bar;
wherein the 1 st surface of the 4 th metal element is electrically and thermally connected to a flat surface of the 3 rd bus bar.
8. The apparatus of claim 7 further comprising:
a 5 th bus bar;
a 5 th heat-pipe thermally connected to the 5 th bus bar;
a fifth device comprising:
a 5 th metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 5 th metal structure are electrically connected, substantially flat and oppositely facing;
a 5 th metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 5 th metal element are electrically connected, substantially flat and oppositely facing;
a 5 th transistor comprising 9 th and 10 th terminals between which 1 ampere or more of electrical current is transmitted when the 5 th transistor is activated, wherein the 9 th and 10 th terminals comprise 9 th and 10 th surfaces, respectively, wherein the 9 th and 10 th surfaces are substantially flat and oppositely facing;
wherein the 9 th and 10 th surfaces are sintered to the 1 st and 2 nd surfaces, respectively, of the 5 th metal structure and the 5 th metal element, respectively;
wherein the 2 nd surface of the 5 th metal structure is electrically and thermally connected to the 1 st bus bar;
wherein the 1 st surface of the 5 th metal element is electrically and thermally connected to the 5 th bus bar;
wherein the 5 th bus bar is electrically isolated from the 2 nd and 4 th bus bars.
9. The apparatus of claim 8 further comprising:
a sixth device comprising:
a 6 th metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 6 th metal structure are electrically connected, substantially flat and oppositely facing;
a 6 th metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 6 th metal element are electrically connected, substantially flat and oppositely facing;
a 6 th transistor comprising 11 th and 12 th terminals between which 1 ampere or more of electrical current is transmitted when the 6 th transistor is activated, wherein the 11 th and 12 th terminals comprise 11 th and 12 th surfaces, respectively, wherein the 11 th and 12 th surfaces are substantially flat and oppositely facing;
wherein the 11 th and 12 th surfaces are sintered to the 1 st and 2 nd surfaces, respectively, of the 6 th metal structure and the 6 th metal element, respectively;
wherein the 2 nd surface of the 6 th metal structure is electrically and thermally connected to the 5 th bus bar;
wherein the 11 th surface of the 6 th metal element is electrically and thermally connected to the 3 rd bus bar.
10. The apparatus of claim 1 further comprising a 2 nd dielectric element that electrically isolates the 2 nd bus bar from the 2 nd heat-pipe.
11. The apparatus of claim 10 further comprising a metal heat-fin that is electrically and thermally connected to the 1 st and 2 nd heat-pipes.
12. The apparatus of claim 1 wherein the 2 nd heat-pipe is electrically connected to the 2 nd bus bar.
13. The apparatus of claim 12 further comprising:
a 1 st heat-fin thermally and electrically connected to the 1 st heat-pipe;
a 2 nd heat-fin thermally and electrically connected to the 2 nd heat-pipe;
wherein the 1 st and 2 nd heat-fins are electrically isolated from each other.
14. The apparatus of claim 4 further comprising:
a capacitor with first and second electrodes;
wherein the first and second electrodes are thermally and electrically connected to the 1 st and 3 rd bus bars.
15. An apparatus comprising:
a 1 st bus bar comprising a channel through which air can flow through the 1 st bus bar;
a 2 nd bus bar comprising a channel through which air can flow through the 2 nd bus bar;
a first device comprising:
a 1 st case;
a 1 st metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd Surfaces of the 1 st metal structure are electrically connected, substantially flat and oppositely facing;
a 1 st metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 1 st metal element are electrically connected, substantially flat and oppositely facing;
a 1 st transistor comprising 1 st and 2 nd terminals between which 1 ampere or more of electrical current is transmitted when the 1 st transistor is activated, wherein the 1 st and 2 nd terminals comprise 1 st and 2 nd surfaces, respectively, wherein the 1 st and 2 nd surfaces of the 1 st and 2 nd terminals, respectively, are substantially flat and oppositely facing;
wherein the 1 st and 2 nd surfaces of the 1 st and 2 nd terminals, respectively, are sintered to the 1 st and 2 nd surfaces, respectively, of the 1 st metal structure and the 1 st metal element, respectively;
wherein the 2 nd surface of the 1 st metal structure is electrically and thermally connected to the 1 st bus bar through a 1 st opening in the 1 st case;
wherein the 1 st surface of the 1 st metal element is electrically and thermally connected to the 2 nd bus bar through a 2 nd opening in the 1 st case.
16. The apparatus of claim 15 further comprising:
a 3 rd bus bar comprising a channel through which air can flow through the 3 rd bus bar;
a second device comprising:
a 2 nd case;
a 2 nd metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd Surfaces of the 1 st metal structure are electrically connected, substantially flat and oppositely facing;
a 2 nd metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 2 nd metal element are electrically connected, substantially flat and oppositely facing;
a 2 nd transistor comprising 3 rd and 4 th terminals between which 1 ampere or more of electrical current is transmitted when the 2 nd transistor is activated, wherein the 3 rd and 4 th terminals comprise 3 rd and 4 th surfaces, respectively, wherein the 3 rd and 4 th surfaces are substantially flat and oppositely facing;
wherein the 3 rd and 4 th surfaces of the 3 rd and 4 th terminals, respectively, are sintered to the 1 st and 2 nd surfaces, respectively, of the 2 nd metal structure and the 2 nd metal element, respectively;
wherein the 2 nd surface of the 2 nd metal structure is electrically and thermally connected to the 2 nd bus bar through a 1 st opening in the 2 nd case;
wherein the 1 st surface of the 2 nd metal element is electrically and thermally connected to the 3 rd bus bar through a 2 nd opening in the 2 nd case.
17. The apparatus of claim 16 further comprising:
a 4 th bus bar comprising a channel through which air can flow through the 4 th bus bar;
a third device comprising:
a 3 rd case;
a 3 rd metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 3 rd metal structure are electrically connected, substantially flat and oppositely facing;
a 3 rd metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 3 rd metal element are electrically connected, substantially flat and oppositely facing;
a 3 rd transistor comprising 5 th and 6 th terminals between which 1 ampere or more of electrical current is transmitted when the 3 rd transistor is activated, wherein the 5 th and 6 th terminals comprise 5 th and 6 th surfaces, respectively, wherein the 5 th and 6 th surfaces are substantially flat and oppositely facing;
wherein the 5 th and 6 th surfaces of the 5th and 6th terminals, respectively, are sintered to the 1 st and 2 nd surfaces, respectively, of the 3 rd metal structure and the 3 rd metal element, respectively;
wherein the 2 nd surface of the 3 rd metal structure is electrically and thermally connected to the 1 st bus bar through a 1 st opening in the 3 rd case;
wherein the 1 st surface of the 3 rd metal element is electrically and thermally connected to the 4 th bus bar through a 2 nd opening in the 3 rd case;
wherein the 2 nd and 3 rd bus bars are electrically isolated from each other.
18. The apparatus of claim 17 further comprising:
a fourth device comprising:
a 4 th case;
a 4 th metal structure comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 4 th metal structure are electrically connected, substantially flat and oppositely facing;
a 4 th metal element comprising 1 st and 2 nd surfaces, wherein the 1 st and 2 nd surfaces of the 4 th metal element are electrically connected, substantially flat and oppositely facing;
a 4 th transistor comprising 7 th and 8 th terminals between which 1 ampere or more of electrical current is transmitted when the 4 th transistor is activated, wherein the 7 th and 8 th terminals comprise 7 th and 8 th surfaces, respectively, wherein the 7 th and 8 th surfaces are substantially flat and oppositely facing;
wherein the 5 th and 6 th surfaces of the 7 th and 8 th terminals, respectively, are sintered to the 1 st and 2 nd surfaces, respectively, of the 4 th metal structure and the 4 th metal element, respectively;
wherein the 2 nd surface of the 4 th metal structure is electrically and thermally connected to the 4 th bus bar through a 1 st opening in the 4 th case;
wherein the 1 st surface of the 4 th metal element is electrically and thermally connected to the 3 rd bus bar through a 2 nd opening in the 4 th case.
19. The apparatus of claim 17 further comprising:
a capacitor with first and second electrodes;
wherein the first and second electrodes are thermally and electrically connected to the 1 st and 3 rd bus bars.
20. A method comprising:
a 1 st channel of a 1 st bus bar receiving a 1 st heat-pipe;
sintering a 1 st surface of a 1 st terminal of a 1 st transistor to a 1 st surface of a 1 st metal structure;
sintering a 2 nd surface of a 2 nd terminal of the 1 st transistor to a 2 nd surface of a 1 st metal pedestal;
thermally and electrically connecting a 2 nd surface of the 1 st metal pedestal to a 2 nd surface of a 1 st metal element;
thermally and electrically connecting the 2 nd surface of the 1 st metal structure to the 1 st bus bar;
wherein the 1 st metal structure comprises a 2 nd surface, wherein the 1 st and 2 nd surfaces of the 1 st metal structure are electrically connected, substantially flat and oppositely facing;
wherein the 1 st metal element comprises a 2 nd surface, wherein the 1 st and 2 nd surfaces of the 1 st metal element are electrically connected, substantially flat and oppositely facing;
wherein the 1 st and 2 nd surfaces of the 1 st metal pedestal are electrically connected, substantially flat and oppositely facing;
wherein the 1 st transistor can conduct 1 ampere or more of electrical current between the 1 st and 2 nd terminals when activated, wherein the 1 st and 2 nd surfaces of the 1 st and 2 nd terminals, respectively, are substantially flat and oppositely facing.