Camera module with shield can
A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.
1. A camera module comprising:
a first housing;
a lens module being disposed in the first housing;
a second housing being coupled to the first housing;
a first printed circuit board being disposed in an inner space of the first housing and the second housing;
a second printed circuit board being disposed at a lower portion than the first printed circuit board;
an image sensor being disposed on the first printed circuit board; and
a shield can being disposed at a lower portion than the first printed circuit board in the second housing,
wherein the second printed circuit board is disposed within the shield can,
wherein the shield can includes a side plate and a rib being in contact with a lower surface of the first printed circuit board,
wherein the rib includes a vertical portion extending upward from an upper end of the side plate and a horizontal portion bent inward from a top of the vertical portion,
wherein an exposed portion in which electrodes inside the first printed circuit board are exposed is disposed in a lower surface of the first printed circuit board facing the rib, and
wherein the exposed portion is soldered to an upper surface of the horizontal portion.
2. The camera module according to claim 1 , wherein the rib is provided in pluralities and disposed to be spaced apart from one another.
3. The camera module according to claim 1 , wherein the material of the first housing is resin or plastic, and
wherein the material of the shield can is a metal.
4. The camera module according to claim 1 , wherein a bracket is disposed between the first printed circuit board and the second printed circuit board.
5. The camera module according to claim 1 , wherein the cross-sectional area of the second printed circuit board is smaller than the cross-sectional area of the first printed circuit board.
6. The camera module according to claim 1 , including:
a cable being electrically connected to a lower surface of the second printed circuit board; and
a flexible circuit board electrically connecting the first printed circuit board and the second printed circuit board.
7. The camera module according to claim 1 , wherein the shield can is integrally formed with the second housing by insert molding.
8. The camera module according to claim 4 , wherein a first groove coupled to the bracket is disposed on a side surface of the first printed circuit board, and
wherein a third groove coupled to the bracket is disposed on a side surface of the second printed circuit board facing the first groove.
9. The camera module according to claim 6 , wherein a second groove in which the flexible circuit board is disposed on a side surface of the first printed circuit board, and
wherein a fourth groove in which the flexible printed circuit board is disposed is disposed in a region facing the second groove among side surfaces of the second printed circuit board.
10. The camera module according to claim 2 , wherein a cross-sectional area of an area connecting inner ends of the plurality of ribs is smaller than a cross-sectional area of the second printed circuit board.
11. The camera module according to claim 1 , wherein the shield can has four sides, and
wherein the ribs are provided in plurality on each of the four sides.
12. A camera module comprising:
a first housing;
a lens module being disposed in the first housing;
a second housing being coupled to the first housing;
a first printed circuit board being disposed in an inner space of the first housing and the second housing;
a second printed circuit board being disposed at a lower portion than the first printed circuit board;
an image sensor being disposed on the first printed circuit board; and
a shield can being disposed below the first printed circuit board in the second housing,
wherein the second printed circuit board is disposed within the shield can,
wherein a lower surface of the first printed circuit board is soldered to an upper surface of the shield can,
wherein the shield can includes a side plate and a rib being in contact with a lower surface of the first printed circuit board,
wherein the rib includes a vertical portion extending upward from an upper end of the side plate and a horizontal portion bent inward from a top of the vertical portion,
wherein an exposed portion in which electrodes inside the first printed circuit board are exposed is disposed in a lower surface of the first printed circuit board facing the rib, and
wherein the exposed portion is soldered to an upper surface of the horizontal portion.
13. The camera module according to claim 12 , wherein the rib is provided in pluralities and disposed to be spaced apart from one another, and
wherein a cross-sectional area of an area connecting inner ends of the plurality of ribs is smaller than a cross-sectional area of the second printed circuit board.